المؤلفون: Akemi UTSUMI, Akiko ISHIZAKI, Asari EBUCHI, Ayano OGAWA, Daisuke TAKAGI, Kaori TOMITA, Kazumi KUBOTA, Keigo ISHIDA, Kentaro ISHIKAWA, Kohji MURAKAMI, Luna OSAKABE, Mari TAKAHASHI, Masahiro WATANABE, Shouji HIRONAKA, Takafumi OOKA, Takuya ASAMI, Toshikazu ISHIKAWA, Yoshiharu MUKAI, Yu MORITA

المصدر: The Showa University Journal of Medical Sciences. 2015, 27(3):175

المؤلفون: Kiyoshi Koyano, Shinji Iyama, Toshikazu Ishikawa, Yoshihiro Tsukiyama, 伊山 慎二, 古谷 野潔, 石川 利一, 築山 能大

المصدر: 日本顎口腔機能学会雑誌 / The Journal of Japanese Society of Stomatognathic Function. 2003, 9(2):202

المؤلفون: Kiyoshi Koyano, Shinji Iyama, Toshikazu Ishikawa, Yoshihiro Tsukiyama

المصدر: The Journal of Japanese Society of Stomatognathic Function. 2003, 9(2):185

المؤلفون: Ryo Mori, Hideki Tanaka, Yoshihiro Ono, Tsuyoshi Kida, Toshikazu Ishikawa, Tomoaki Hashimoto, Michiaki Sugiyama, Kentaro Mori, Satoshi Imasu, Shinji Watanabe, Michitaka Kimura, Toshihiko Ochiai

المصدر: 3DIC

مصطلحات موضوعية: Materials science, Reliability (semiconductor), Packaging engineering, business.industry, Electrical engineering, Optoelectronics, Temperature cycling, business, Electrical conductor, Flip chip, Dram, Highly accelerated stress test, Die (integrated circuit)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0665f4eedb565156eb520ba7d6fc13ce
https://doi.org/10.1109/3dic.2013.6702322