المؤلفون: Tomonori OGAWA, 小川 智永, 樫本 秀好

المصدر: 中部日本整形外科災害外科学会雑誌 / The Central Japan Journal of Orthopaedic Surgery & Traumatology. 2018, 61(6):1351

المؤلفون: Tomonori OGAWA, 冨山 貴司, 小川 智永, 柿木 良介, 田中 寛樹, 赤木 將男

المصدر: 中部日本整形外科災害外科学会雑誌 / The Central Japan Journal of Orthopaedic Surgery & Traumatology. 2016, 59(2):299

المؤلفون: Daisuke Anzai, Shinsuki Chiba, Tomonori Ogawa, Toshihiro Ohtani

المصدر: Proceedings of Symposium on Ultrasonic Electronics. 2010, 31:47

المؤلفون: Tomonori OGAWA, Toshihiro OHTANI, 大谷 俊博, 小川 大騎

المصدر: The proceedings of the JSME annual meeting. 2010, :31

المؤلفون: Tomonori Ogawa, Toshihiro Ohtani

المصدر: The Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics. 2011,

المؤلفون: Akio KOIKE, Kaname OKADA, Madoka ONO, Sinya KIKUGAWA, Tomonori OGAWA

المصدر: Journal of the Ceramic Society of Japan. 2008, 116(1358):1126

المؤلفون: Masahiro Kanda, Naoyuki Kojima, Osamu Mikami, Tomonori Ogawa, 三上 修, 児島 直之, 小川 知訓, 神田 昌宏

المصدر: Proceedings of JIEP Annual Meeting. 2009, :94

المؤلفون: Kenichi Goto, Masahiro Kanda, Osamu Mikami, Tomonori Ogawa, 三上 修, 小川 知訓, 後藤 健一, 神田 昌宏

المصدر: Proceedings of JIEP Annual Meeting. 2008, :39

المؤلفون: Masahiro Kanda, Naoyuki Kojima, Osamu Mikami, Takuya Tokuhara, Tomonori Ogawa, Yousuke Nakanishi, 三上 修, 中西 陽介, 児島 直之, 小川 知訓, 徳原 拓也, 神田 昌宏

المصدر: Proceedings of JIEP Annual Meeting. 2008, :35

المؤلفون: Hisao IMAI, Kazuto MAKIGUSA, Masaru OKAMURA, Shigeaki NAGASAWA, Tomonori OGAWA, Tsuyoshi YAMAGUCHI, Yasutane HIKIDA, 今井 久夫, 小川 智功, 山口 剛, 岡村 大, 牧草 一人, 疋田 泰種, 長澤 成明

المصدر: Program and Abstracts of Annual Meeting of the Japanese Society of Periodontology. 2006, :137

المؤلفون: Ryugo KONNO, Shuichi ADACHI, Tomonori OGAWA

المصدر: Transactions of the Society of Instrument and Control Engineers. 2001, 37(12):1189

المؤلفون: Rao Tummala, Tomonori Ogawa, Pulugurtha Markondeya Raj, Atom Watanabe, Bijan Tehrani, Manos M. Tentzeris

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:531-533

مصطلحات موضوعية: Fabrication, Materials science, business.industry, Frequency band, Borosilicate glass, 020206 networking & telecommunications, 02 engineering and technology, Dielectric, Substrate (electronics), Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Resonator, Extremely high frequency, 0202 electrical engineering, electronic engineering, information engineering, Insertion loss, Optoelectronics, 020201 artificial intelligence & image processing, Electrical and Electronic Engineering, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::59267da31b46a778637924efeaf4ea20
https://doi.org/10.1109/tcpmt.2020.2968305

المؤلفون: Siddharth Ravichandran, Shuhei Yamada, Tomonori Ogawa, Tailong Shi, Fuhan Liu, Vanessa Smet, Venky Sundaram, Rao Tummala

المصدر: Journal of Microelectronics and Electronic Packaging. 16:124-135

مصطلحات موضوعية: 010302 applied physics, Computer Networks and Communications, 020208 electrical & electronic engineering, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, 02 engineering and technology, Electrical and Electronic Engineering, 01 natural sciences, Electronic, Optical and Magnetic Materials

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::245c43bf78c52b1c5c7a848d3f089551
https://doi.org/10.4071/imaps.930748

المؤلفون: Venky Sundaram, Shuhei Yamada, Vanessa Smet, Tomonori Ogawa, Tailong Shi, Rao Tummala, Fuhan Liu, Siddharth Ravichandran

المصدر: International Symposium on Microelectronics. 2018:000331-000336

مصطلحات موضوعية: 010302 applied physics, Packaging engineering, business.industry, Computer science, 020208 electrical & electronic engineering, 02 engineering and technology, 01 natural sciences, Reliability engineering, Form factor (design), 0103 physical sciences, Automotive Engineering, 0202 electrical engineering, electronic engineering, information engineering, Embedding, Electrical performance, business, Reliability (statistics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1c5c437752996b447e531c90ea1a64fe
https://doi.org/10.4071/2380-4505-2018.1.000331

المؤلفون: P. Markondeya Raj, Rao Tummala, Tomonori Ogawa, Kaya Demir, Venky Sundaram

المصدر: IEEE Transactions on Device and Materials Reliability. 17:683-691

مصطلحات موضوعية: 010302 applied physics, Fabrication, Materials science, Scanning electron microscope, 020209 energy, Delamination, Stress–strain curve, 02 engineering and technology, Temperature cycling, 01 natural sciences, Finite element method, Electronic, Optical and Magnetic Materials, Stress (mechanics), 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Electrical and Electronic Engineering, Composite material, Safety, Risk, Reliability and Quality, Daisy chain

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::791c42b6fb39176870f1211f33c4c466
https://doi.org/10.1109/tdmr.2017.2752730

المؤلفون: Timothy Huang, Bruce C. Chou, Venky Sundaram, Tomonori Ogawa, Rao Tummala, Jialing Tong

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:544-551

مصطلحات موضوعية: chemistry.chemical_classification, Materials science, Plasma etching, 020209 energy, chemistry.chemical_element, Fine pitch, 02 engineering and technology, Polymer, Copper, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, chemistry, 0202 electrical engineering, electronic engineering, information engineering, Interposer, Copper deposition, Metallizing, Electrical and Electronic Engineering, Composite material, Curing (chemistry)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e682c7b9274a8b7bfb6c18be0d2180f4
https://doi.org/10.1109/tcpmt.2017.2654219

المؤلفون: Tomonori Ogawa, P. Markondeya Raj, Muhammad Ali, Manos M. Tentzeris, Rao Tummala, Madhavan Swaminathan, Atom Watanabe, Tong-Hong Lin

المصدر: 2019 IEEE MTT-S International Microwave Conference on Hardware and Systems for 5G and Beyond (IMC-5G).

مصطلحات موضوعية: Materials science, Main lobe, business.industry, Bandwidth (signal processing), Microstrip, Electric power transmission, visual_art, Extremely high frequency, visual_art.visual_art_medium, Optoelectronics, Ceramic, Center frequency, business, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::68496a7d4cd173a433dce6c2a1c7f538
https://doi.org/10.1109/imc-5g47857.2019.9160350

المؤلفون: Tomonori Ogawa, Atom Watanabe, Rao Tummala, Manos M. Tentzeris, Tong-Hong Lin, P. Markondeya Raj, Venky Sundaram

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: 010302 applied physics, Microvia, Materials science, Fabrication, business.industry, Bandwidth (signal processing), 020206 networking & telecommunications, 02 engineering and technology, Chip, 01 natural sciences, Microstrip, Electric power transmission, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Optoelectronics, Transceiver, business, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0fddd74c4bb6c32d7de2087f0163d47d
https://doi.org/10.1109/ectc.2018.00304

المؤلفون: P. Markondeya Raj, Venkatesh Sundaram, Tomonori Ogawa, Tong-Hong Lin, Rao Tummala, Atom Watanabe, Manos M. Tentzeris

المصدر: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).

مصطلحات موضوعية: Microvia, Materials science, Fabrication, business.industry, 020206 networking & telecommunications, 02 engineering and technology, Dielectric, Chip, Signal, Electric power transmission, Link budget, 0202 electrical engineering, electronic engineering, information engineering, Optoelectronics, 020201 artificial intelligence & image processing, Antenna (radio), business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c2cda441ed6aa88c86189d19043d8938
https://doi.org/10.23919/icep.2018.8374698

المؤلفون: Tomonori Ogawa, Muhammad Ali, Atom Watanabe, Bijan Tehrani, Hiroyuki Matsuura, Rao Tummala, Jimmy Hester, Manos M. Tentzeris, P. Markondeya Raj, Venky Sundaram

المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: 010302 applied physics, Materials science, business.industry, Bandwidth (signal processing), 020206 networking & telecommunications, 02 engineering and technology, 01 natural sciences, Microstrip antenna, Electric power transmission, Transmission line, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, High bandwidth, Insertion loss, Optoelectronics, Antenna gain, business, 5G

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9006366782fbfb23b3a2d334ff8afa8e
https://doi.org/10.1109/ectc.2017.329