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1Conference
المصدر: 2022 International Conference on Electronics Packaging (ICEP)
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2Conference
المؤلفون: Tripathi, Ashutosh, Smits, Edsger, van der Steen, Jan-Laurens, Cauwe, Maarten, Verplancke, Rik, Myny, Kris, Maas, Joris, Kusters, Roel, Sabik, Sami, Murata, Mitsuhiro, Tomita, Yoshihiro, Ohmae, Hideki, van den Brand, Jeroen, Gelinck, Gerwin
المصدر: International meeting on information displays, Proceedings
مصطلحات موضوعية: Technology and Engineering
وصف الملف: application/pdf
Relation: https://biblio.ugent.be/publication/6981091; http://hdl.handle.net/1854/LU-6981091; https://biblio.ugent.be/publication/6981091/file/6981149
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3ConferenceScaling Solder Micro-Bump Interconnect Down to $10\ \mu\mathrm{m}$ Pitch for Advanced 3D IC Packages
المؤلفون: Li, Zhaozhi, Tomita, Yoshihiro, Elsherbini, Adel A., Liu, Pilin, Sawyer, Holly A., Swan, Johanna M., Liff, Shawna M.
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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