المؤلفون: Shuhang Lyu, Qianying Wu, Zheng Gong, Keyu Wang, Kenneth Goodson, Tiwei Wei

مصطلحات موضوعية: Components, Circuits, Devices and Systems, Two-phase cooling, Porous media, Thermomechanical Reliability

Relation: https://figshare.com/articles/preprint/Thermomechanical_Modeling_and_Stress_Analysis_of_Copper_Inverse_Opals_CIO_Structure_for_Capillary-Fed_Boiling/24654336

الاتاحة: https://doi.org/10.36227/techrxiv.24654336.v2
https://figshare.com/articles/preprint/Thermomechanical_Modeling_and_Stress_Analysis_of_Copper_Inverse_Opals_CIO_Structure_for_Capillary-Fed_Boiling/24654336

المؤلفون: William J. Scheideler

المصدر: Frontiers in Energy Research, Vol 10 (2022)

مصطلحات موضوعية: solar modules, perovskite photovoltaics, thermomechanical reliability, halide perovskites, scalable manufacturing, rapid curing, General Works

وصف الملف: electronic resource

Relation: https://www.frontiersin.org/articles/10.3389/fenrg.2022.902746/full; https://doaj.org/toc/2296-598X

URL الوصول: https://doaj.org/article/3acf13392d8048b2a1c7ebc5df9050ea

المؤلفون: Sandera, Josef

المصدر: Microelectronics International, 2014, Vol. 31, Issue 2, pp. 86-89.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/MI-10-2013-0053

المؤلفون: Xue, Ke, Lu, Dong, Chen, Kai, Qin, Yijing, Li, Dayang, Tang, Qi

مصطلحات موضوعية: Die crack, Flip Chip QFN, Thermal cycling test, Thermomechanical reliability

Relation: http://repository.ust.hk/ir/Record/1783.1-114269; 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021, September 2021; https://doi.org/10.1109/ICEPT52650.2021.9567718; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2021&rft.spage=&rft.aulast=Xue&rft.aufirst=&rft.atitle=Failure+Mechanism+Study+for+Flip+Chip+QFN+Crack+Issue+under+Temperature+Cycling+Test&rft.title=2021+22nd+International+Conference+on+Electronic+Packaging+Technology,+ICEPT+2021; http://www.scopus.com/record/display.url?eid=2-s2.0-85118453766&origin=inward

الاتاحة: http://repository.ust.hk/ir/Record/1783.1-114269
https://doi.org/10.1109/ICEPT52650.2021.9567718
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2021&rft.spage=&rft.aulast=Xue&rft.aufirst=&rft.atitle=Failure+Mechanism+Study+for+Flip+Chip+QFN+Crack+Issue+under+Temperature+Cycling+Test&rft.title=2021+22nd+International+Conference+on+Electronic+Packaging+Technology,+ICEPT+2021
http://www.scopus.com/record/display.url?eid=2-s2.0-85118453766&origin=inward

المؤلفون: Lei, Guangyin

Thesis Advisors: Materials Science and Engineering, Lu, Guo-Quan, Aning, Alexander O., Ngo, Khai D. T., Suchicital, Carlos T. A., Guido, Louis J.

مصطلحات موضوعية: Nanoscale silver paste, low-temperature sintering, direct bonded aluminum (DBA), thermomechanical reliability, high-temperature electronics, temperature cycling reliability

وصف الملف: application/pdf

Relation: Lei_Guangyin_D_2010.pdf

الاتاحة: http://hdl.handle.net/10919/37803
http://scholar.lib.vt.edu/theses/available/etd-05132010-174237/

المؤلفون: Lang, Jenny, Belov, Ilja, Hellén, Johan, Lim, Jang-Kwon, Schodt, Bo, Nilsson, Torbjörn M. J., Poder, Ralf, Bakowski, Mietek, Leisner, Peter

المصدر: Materials Science Forum. :715-718

مصطلحات موضوعية: GaN (gallium nitride), HEMT (high-electron-mobility transistor), PC (power cycle), Reliability, RF (radio frequency) power amplifier, SiC (silicon carbide), TC (thermal cycle), Gallium nitride, High electron mobility transistors, Lead, Lead-free solders, Polychlorinated biphenyls, Power amplifiers, Silicon, Silicon carbide, Soldering alloys, Thermal conductivity, Thermal cycling, Threshold voltage, Tin, Electrical performance, Performance degradation, Power cycle, Radio frequencies, Thermomechanical reliability, Threshold voltage shifts, Radio frequency amplifiers

وصف الملف: print

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:hj:diva-36611

المؤلفون: Colin D. Bailie, Nicholas Rolston, Arun Tej Mallajosyula, Doojin Vak, Brian L. Watson, Reinhold H. Dauskardt, Michael D. McGehee, Robert Gehlhaar, Aditya D. Mohite, Jueng Eun Kim, Gautam Gupta, João P. Bastos

المصدر: Extreme Mechanics Letters. 9:353-358

مصطلحات موضوعية: Degradation modes, Materials science, Perovskite solar cell, Mineralogy, Bioengineering, 02 engineering and technology, 010402 general chemistry, 01 natural sciences, Fracture processes, Thermal, Chemical Engineering (miscellaneous), Deposition (phase transition), Engineering (miscellaneous), Thermomechanical reliability, Perovskite (structure), Perovskite solar cells, Mechanical Engineering, Trihalide, 021001 nanoscience & nanotechnology, Grain size, 0104 chemical sciences, Chemical engineering, Mechanics of Materials, Grain boundaries, Grain boundary, 0210 nano-technology, Stoichiometry

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::698d9aa1a55be6d7914fd8ae191aedec
https://doi.org/10.1016/j.eml.2016.06.006

المؤلفون: Lang, Jenny, Lim, Jang-Kwon, Hellén, Johan, Nilsson, Torbjörn M. J., Schodt, Bo, Poder, Ralf, Belov, Ilja, Bakowski, Mietek, Leisner, Peter

المصدر: ECS Transactions. :49-59

مصطلحات موضوعية: Gallium nitride, Lead, Lead-free solders, Nitrides, Polychlorinated biphenyls, Power amplifiers, Silicon carbide, Soldering alloys, Thermal conductivity, Threshold voltage, Tin, Cold plates, Current saturation, Current stress, Electrical performance, Quad flat no-leads, RF power amplifiers, Thermomechanical reliability, Threshold voltage shifts, Radio frequency amplifiers

وصف الملف: print

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:ri:diva-27663

المؤلفون: Belov, Ilja, Arwidson, Jonas, Poder, Ralf, Johannesson, Pär, Leisner, Peter

المصدر: Proceedings of the 16th International Conference IEEE EuroSimE 2015. :165-169

مصطلحات موضوعية: Elastic moduli, Fatigue of materials, Finite element method, Microelectronics, Microsystems, Soldered joints, Strain energy, Accumulated creep strain energy densities, Counting techniques, Maximum variations, Temperature cycling, Temperature profiles, Thermomechanical reliability, Time characteristics, Young's modulus variations

وصف الملف: print

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:hj:diva-28912

المؤلفون: Zhang, Chun, Ma, Dian, Li, Changzhi, Shi, Yiyu

المصدر: Electrical and Computer Engineering Faculty Research & Creative Works

مصطلحات موضوعية: Self-calibration, temperature-stress cosensor, thermomechanical reliability, Electrical and Computer Engineering

وصف الملف: application/pdf

Relation: https://scholarsmine.mst.edu/ele_comeng_facwork/6630; https://scholarsmine.mst.edu/context/ele_comeng_facwork/article/7659/viewcontent/Runtime_Self_Calibrated_TemperatureStress_Cosensor_for_3_D_Integrated_Circuits.pdf

الاتاحة: https://scholarsmine.mst.edu/ele_comeng_facwork/6630
https://doi.org/10.1109/TVLSI.2013.2290132
https://scholarsmine.mst.edu/context/ele_comeng_facwork/article/7659/viewcontent/Runtime_Self_Calibrated_TemperatureStress_Cosensor_for_3_D_Integrated_Circuits.pdf

المؤلفون: Auersperg, R., Dudek, R., Michel, B.

مصطلحات موضوعية: parameterized FE-modeling, interfacial fracture toughness, reliability enhancement, plastic package, package damage, package fatigue, package failure, MEMS packaging, harsh environmental condition, extreme temperature, thermomechanical reliability, industrial application, residual stress, inhomogeneity, manufacturing process, microelectronic package, Young's Modul, thermal expansion coefficient, interface delamination, chip cracking, solder interconnect fatigue, design optimization, nonlinear FEA, fracture mechanic, sensitivity analysis, material parameter, geometrical boundary condition, physical boundary condition, thermo-mechanical reliability, parameterized finite element modeling technique

Time: 621

Relation: Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; https://publica.fraunhofer.de/handle/publica/341163

الاتاحة: https://publica.fraunhofer.de/handle/publica/341163
https://doi.org/10.1117/12.462850

المؤلفون: Schubert, A., Dudek, R., Döring, R., Walter, H., Auerswald, E., Gollhardt, A., Michel, B.

مصطلحات موضوعية: thermomechanical reliability, lead-free solder interconnect, finite element model, SMD component, flip chip assembly, failure mechanism, temperature cycling, life prediction model, solder-surface interaction

Time: 621

Relation: International Symposium on Advanced Packaging Materials 2002; 8th International Advanced Packaging Materials Symposium 2002. Proceedings; https://publica.fraunhofer.de/handle/publica/341203

الاتاحة: https://publica.fraunhofer.de/handle/publica/341203
https://doi.org/10.1109/ISAPM.2002.990369

المؤلفون: Ryu, Suk-Kyu

مصطلحات موضوعية: 3-D interconnect, Trough-silicon vias, Thermomechanical reliability, Thermal stresses, Bending beam curvature technique, Raman spectroscopy

وصف الملف: application/pdf

الاتاحة: http://hdl.handle.net/2152/ETD-UT-2011-12-4580

المؤلفون: LIAO EBIN

المساهمون: MECHANICAL ENGINEERING, TAY AH ONG, ANDREW

مصطلحات موضوعية: compliant interconnects, wafer level packaging, multi-copper-column interconnects, planar microspring interconnects, thermomechanical reliability

Relation: LIAO EBIN (2008-03-20). Compliant Chip-to-Package Interconnects for Wafer Level Packaging. ScholarBank@NUS Repository.; http://scholarbank.nus.edu.sg/handle/10635/27835; NOT_IN_WOS

الاتاحة: http://scholarbank.nus.edu.sg/handle/10635/27835

المؤلفون: Kulojärvi, Mervi

المساهمون: Rautila, Pekka, Teknillinen korkeakoulu, Helsinki University of Technology, Sähkö- ja tietoliikennetekniikan osasto, Kivilahti, Jorma, Aalto-yliopisto, Aalto University

مصطلحات موضوعية: lead-free process, mixed technology, FBGA, thermomechanical reliability, lyijytön pintaliitostekniikka, lämpömekaaninen luetettavuus

Relation: https://aaltodoc.aalto.fi/handle/123456789/89095; URN:NBN:fi:aalto-2020120447930

الاتاحة: https://aaltodoc.aalto.fi/handle/123456789/89095