المؤلفون: Mohd Abid, Mohd Asyadi 'Azam, Safie, Nur Ezyanie, Arith, Faiz, Thangaraj, Joseph Sahaya Anand, Mohamad, Najmiah Radiah, Takasaki, Akito

وصف الملف: text

Relation: http://eprints.utem.edu.my/id/eprint/27632/2/0270518062024165118867.PDF; Mohd Abid, Mohd Asyadi 'Azam and Safie, Nur Ezyanie and Arith, Faiz and Thangaraj, Joseph Sahaya Anand and Mohamad, Najmiah Radiah and Takasaki, Akito and UNSPECIFIED (2024) Electrical conductivity enhancement of rGO-MoS2 composite electrode for inverted PSC by parameter optimization. Results in Engineering, 22 (102237). pp. 1-11. ISSN 2590-1230

الاتاحة: http://eprints.utem.edu.my/id/eprint/27632/
http://eprints.utem.edu.my/id/eprint/27632/2/0270518062024165118867.PDF
https://www.sciencedirect.com/science/article/pii/S2590123024004924
https://doi.org/10.1016/j.rineng.2024.102237

المؤلفون: Sarban Singh, Ranjit Singh, Lachumanan, Thilagawathy, Shapiai, Mohd Ibrahim, Thangaraj, Joseph Sahaya Anand

وصف الملف: text

Relation: http://eprints.utem.edu.my/id/eprint/26534/2/ETASR_4489.PDF; Sarban Singh, Ranjit Singh and Lachumanan, Thilagawathy and Shapiai, Mohd Ibrahim and Thangaraj, Joseph Sahaya Anand (2021) Analysis of a multilevel voltage-based coordinating controller for solar-wind energy generator: a simulation, development and validation approach. Engineering, Technology & Applied Science Research, 11 (6). pp. 7793-7799. ISSN 2241-4487

الاتاحة: http://eprints.utem.edu.my/id/eprint/26534/
http://eprints.utem.edu.my/id/eprint/26534/2/ETASR_4489.PDF
https://etasr.com/index.php/ETASR/article/view/4489/2611
https://doi.org/10.48084/etasr.4489

المؤلفون: Lau, Kok Tee, Thangaraj, Joseph Sahaya Anand, Sorrell, Charles Christopher

وصف الملف: text

Relation: http://eprints.utem.edu.my/id/eprint/17087/2/1-s2.0-S0254058416305636-main.pdf; Lau, Kok Tee and Thangaraj, Joseph Sahaya Anand and Sorrell, Charles Christopher (2016) Protonation Of The Polyethyleneimine And Titanium Particles And Their Effect On The Electrophoretic Mobility And Deposition. Materials Chemistry And Physics, 182. pp. 359-364. ISSN 0254-0584

الاتاحة: http://eprints.utem.edu.my/id/eprint/17087/
http://eprints.utem.edu.my/id/eprint/17087/2/1-s2.0-S0254058416305636-main.pdf
http://www.sciencedirect.com/science/article/pii/S0254058416305636
https://doi.org/10.1016/j.matchemphys.2016.07.043

المؤلفون: Thangaraj, Joseph Sahaya Anand, Chua, Kok Yau, Jalar, Azman

مصطلحات موضوعية: TJ Mechanical engineering and machinery

وصف الملف: text

Relation: http://eprints.utem.edu.my/id/eprint/9148/1/Bond_21_Anand_and_Chua.pdf; Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Jalar, Azman (2013) Micro-structural studies of thermosonic Cu-Al bonding interface. In: Joint International Conference on Nanoscience, Engineering and Management, 19-21 August 2013, Penang. (In Press)

الاتاحة: http://eprints.utem.edu.my/id/eprint/9148/
http://eprints.utem.edu.my/id/eprint/9148/1/Bond_21_Anand_and_Chua.pdf
http://bond21.unimap.edu.my/

المؤلفون: Thangaraj, Joseph Sahaya Anand, Chua, Kok Yau, Hng, May Ting, Lee, Cher Chia

مصطلحات موضوعية: T Technology (General), TA Engineering (General). Civil engineering (General)

وصف الملف: text

Relation: http://eprints.utem.edu.my/id/eprint/20186/1/XRD%20ANALYSIS%20OF%20CU-AI%20INTERCONNECT%20INTERMETALLIC%20COMPOUND%20IN%20AN%20ANNEALED%20MICRO-CHIP-KOK%20YAU%20CHUA-MAK%2000353%20RAF.pdf; Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Hng, May Ting and Lee, Cher Chia (2012) Xrd Analysis Of Cu-Ai Interconnerct Intermetallic Compound In An Annealed Micro-Chip. In: International Conference on X-Rays & Related Techniques in Research & Industry 2012 (ICXRI 2012) , 3-5 Julai 2012, Vistana Hotel, Pulau Pinang.

الاتاحة: http://eprints.utem.edu.my/id/eprint/20186/
http://eprints.utem.edu.my/id/eprint/20186/1/XRD%20ANALYSIS%20OF%20CU-AI%20INTERCONNECT%20INTERMETALLIC%20COMPOUND%20IN%20AN%20ANNEALED%20MICRO-CHIP-KOK%20YAU%20CHUA-MAK%2000353%20RAF.pdf

المؤلفون: Thangaraj, Joseph Sahaya Anand, Chua, Kok Yau, Abd Rashid, Mohd Warikh, Hng, May Ting, Lee, Cher Chia

مصطلحات موضوعية: TJ Mechanical engineering and machinery

وصف الملف: text

Relation: http://eprints.utem.edu.my/id/eprint/6959/1/idecon2012_Anand_105.pdf; Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Abd Rashid, Mohd Warikh and Hng, May Ting and Lee, Cher Chia (2012) Microstructural studies of Cu-Al Intermetallic Compound at Thermosonic Wire Bonding Interface. In: iDECON 2012 – International Conference on Design and Concurrent Engineering, 15-16 October 2012, Hotel Equatorial, Melaka.

الاتاحة: http://eprints.utem.edu.my/id/eprint/6959/
http://eprints.utem.edu.my/id/eprint/6959/1/idecon2012_Anand_105.pdf
http://idecon.utem.edu.my/

المؤلفون: Thangaraj, Joseph Sahaya Anand, Chua, Kok Yau, Hng, May Ting, Lee, Cher Chia

مصطلحات موضوعية: TJ Mechanical engineering and machinery

وصف الملف: text

Relation: http://eprints.utem.edu.my/id/eprint/6957/1/XRD_Study_of_Intermetallic_Cu-Al_Interconnection.pdf; Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Hng, May Ting and Lee, Cher Chia (2012) X-ray Diffraction Study of Intermetallic Cu-Al Interconnection in Electronic Components. In: International Conference of Young Researchers on Advanced Materials, July 1 - 6, 2012, MATRIX Building< National University of Singapore (NUS), Singapore. (Unpublished)

الاتاحة: http://eprints.utem.edu.my/id/eprint/6957/
http://eprints.utem.edu.my/id/eprint/6957/1/XRD_Study_of_Intermetallic_Cu-Al_Interconnection.pdf
http://www.mrs.org.sg/icyram2012/public.asp?page=venue.asp

المؤلفون: Thangaraj, Joseph Sahaya Anand, Mohd Abid, Mohd Asyadi 'Azam, Subramonian, Sivarao, Buang, Zolkepli, K.M.Rajan, Rajes, Mat Yusoff, Nurul Hazliza, Abdul Aziz, Mohd Zaidan, Chua, Kok Yau

وصف الملف: text

Relation: http://eprints.utem.edu.my/id/eprint/18980/2/41%20AMM%20761.pdf; Thangaraj, Joseph Sahaya Anand and Mohd Abid, Mohd Asyadi 'Azam and Subramonian, Sivarao and Buang, Zolkepli and K.M.Rajan, Rajes and Mat Yusoff, Nurul Hazliza and Abdul Aziz, Mohd Zaidan and Chua, Kok Yau (2015) Hrtem Studies Of Magnetron Sputtered Ni4al Thin Films. Applied Mechanics and Materials, 761 (-). pp. 504-509. ISSN -

الاتاحة: http://eprints.utem.edu.my/id/eprint/18980/
http://eprints.utem.edu.my/id/eprint/18980/2/41%20AMM%20761.pdf
https://www.scientific.net/AMM.761.504

المؤلفون: Thangaraj, Joseph Sahaya Anand, Mohd Abid, Mohd Asyadi 'Azam, Subramonian, Sivarao, Buang, Zolkepli, K.M.Rajan, Rajes, Mat Yusoff, Nurul Hazliza, Abdul Aziz, Mohd Zaidan, Chua, Kok Yau

وصف الملف: text

Relation: http://eprints.utem.edu.my/id/eprint/14327/1/41_AMM_761.pdf; Thangaraj, Joseph Sahaya Anand and Mohd Abid, Mohd Asyadi 'Azam and Subramonian, Sivarao and Buang, Zolkepli and K.M.Rajan, Rajes and Mat Yusoff, Nurul Hazliza and Abdul Aziz, Mohd Zaidan and Chua, Kok Yau (2015) HRTEM analysis of magnetron sputtered Ni4Al thin films. Applied Mechanics and Materials, 761. pp. 504-509. ISSN 1660-9336

الاتاحة: http://eprints.utem.edu.my/id/eprint/14327/
http://eprints.utem.edu.my/id/eprint/14327/1/41_AMM_761.pdf
https://doi.org/10.4028/www.scientific.net/AMM.761.504

المؤلفون: Thangaraj, Joseph Sahaya Anand, Chua, Kok Yau, Jalar, Azman

وصف الملف: text

Relation: http://eprints.utem.edu.my/id/eprint/12158/1/36_AMR_925.pdf; Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Jalar, Azman (2014) Micro-structural Studies of Thermosonic Cu-Al Bonding Interface. Advanced Materials Research, 925. pp. 154-158. ISSN 1662-8985

الاتاحة: http://eprints.utem.edu.my/id/eprint/12158/
http://eprints.utem.edu.my/id/eprint/12158/1/36_AMR_925.pdf
http://www.scientific.net

المؤلفون: Chua, Kok Yau, Hng, May Ting, Lee, Cher Chia, Thangaraj, Joseph Sahaya Anand

وصف الملف: text

Relation: http://eprints.utem.edu.my/id/eprint/10252/1/24_AMR_620.pdf; Chua, Kok Yau and Hng, May Ting and Lee, Cher Chia and Thangaraj, Joseph Sahaya Anand (2013) XRD Analysis Of Cu-Al Interconnect Intermetallic Compound In An Annealed Micro-Chip. Advanced Materials Research, 620. pp. 166-172. ISSN 10226680

الاتاحة: http://eprints.utem.edu.my/id/eprint/10252/
http://eprints.utem.edu.my/id/eprint/10252/1/24_AMR_620.pdf
http://www.scientific.net

المؤلفون: Thangaraj, Joseph Sahaya Anand, Chua, Kok Yau, Yeow, See Leong, Lim, Weng Keat, Hng, May Ting

مصطلحات موضوعية: TJ Mechanical engineering and machinery

وصف الملف: text

Relation: http://eprints.utem.edu.my/id/eprint/9145/1/30_CAP_13.pdf; Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Yeow, See Leong and Lim, Weng Keat and Hng, May Ting (2013) Microstructural and mechanical analysis of Cu and Au interconnect on various bond pads. Current Applied Physics, 13 (8). pp. 1674-1683. ISSN 1567-1739

الاتاحة: http://eprints.utem.edu.my/id/eprint/9145/
http://eprints.utem.edu.my/id/eprint/9145/1/30_CAP_13.pdf
http://www.journals.elsevier.com/current-applied-physics

المؤلفون: Thangaraj, Joseph Sahaya Anand, Chua, Kok Yau, Lim, Boon Huat

مصطلحات موضوعية: TJ Mechanical engineering and machinery

وصف الملف: text

Relation: http://eprints.utem.edu.my/id/eprint/6949/1/22_MCP_136.pdf; Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Lim, Boon Huat (2012) Oxidation study on as-bonded intermetallic of copper wire-aluminum bond pad metallization for electronic microchip. Materials Chemistry and Physics, 136 (2-3). pp. 638-647. ISSN 0254-0584

الاتاحة: http://eprints.utem.edu.my/id/eprint/6949/
http://eprints.utem.edu.my/id/eprint/6949/1/22_MCP_136.pdf
http://www.journals.elsevier.com/materials-chemistry-and-physics
https://doi.org/10.1016/j.matchemphys.2012.07.036

المؤلفون: Thangaraj Joseph Sahaya. Anand

مصطلحات موضوعية: Materials science, Thin film, Composite material, Microstructure

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d688ff04009598fe21861bfbbbf92c07
https://doi.org/10.5353/th_b2953336

المؤلفون: Chua, Kok Yau, Hng, May Ting, Lee, Cher Chia, Thangaraj, Joseph Sahaya Anand

مصطلحات موضوعية: TJ Mechanical engineering and machinery

وصف الملف: text

Relation: http://eprints.utem.edu.my/id/eprint/8589/2/24_AMR_620.pdf; Chua, Kok Yau and Hng, May Ting and Lee, Cher Chia and Thangaraj, Joseph Sahaya Anand (2003) XRD analysis of Cu-Al interconnect intermetallic compound in an annealed micro-chip. Advanced Materials Research, 620. pp. 166-172. ISSN 1022-6680

الاتاحة: http://eprints.utem.edu.my/id/eprint/8589/
http://eprints.utem.edu.my/id/eprint/8589/2/24_AMR_620.pdf
http://www.scientific.net/AMR.620.166