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1Academic Journal
المؤلفون: HAO, JIAN-HONG, ZHANG, HAO
المصدر: DEStech Transactions on Environment, Energy and Earth Sciences; International Conference on Power, Energy, Environment and Material Science (PEEMS 2019) ; 2475-8833
مصطلحات موضوعية: Solder void, IGBT module, Finite element, Chip solder layer, Thermal analysis, Chip temperature.Text
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2Academic Journal
المؤلفون: YU, Tong-qiang, LIU, Kun, WANG, Zi-li, SHEN, Yan
المصدر: DEStech Transactions on Computer Science and Engineering; International Conference on Modeling, Simulation and Analysis (ICMSA 2018) ; 2475-8841
مصطلحات موضوعية: Ship structures, Ship-ice collision, Ice material constitutive, Temperature.Text, geo, envir
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3Academic Journal
المؤلفون: YU, Tong-qiang, LIU, Kun, WANG, Zi-li, SHEN, Yan
المصدر: DEStech Transactions on Computer Science and Engineering; International Conference on Modeling, Simulation and Analysis (ICMSA 2018) ; 2475-8841
مصطلحات موضوعية: Ship structures, Ship-ice collision, Ice material constitutive, Temperature.Text
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4Academic Journal
المؤلفون: XIE, Jian, XIA, Wen-long
المصدر: DEStech Transactions on Computer Science and Engineering; International Conference on Modeling, Simulation and Analysis (ICMSA 2018) ; 2475-8841
مصطلحات موضوعية: Numerical research, Jets flow, Heat transfer, Silencer temperature.Text