يعرض 1 - 12 نتائج من 12 نتيجة بحث عن '"Tavva, Yaswanth"', وقت الاستعلام: 0.47s تنقيح النتائج
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    المساهمون: National Research Foundation, Singapore.

    المصدر: Proceedings of the 15th IEEE/ACM International Symposium on Networks-on-Chip

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    Conference

    المساهمون: School of Computer Science and Engineering (SCSE), Nanyang Technological University Singapour, Jalpaiguri Government Engineering College, Nicola Bombieri, Graziano Pravadelli, Masahiro Fujita, Todd Austin, Ricardo Reis, TC 10, WG 10.5

    المصدر: IFIP Advances in Information and Communication Technology ; 26th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC) ; https://inria.hal.science/hal-02321764 ; 26th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC), Oct 2018, Verona, Italy. pp.128-146, ⟨10.1007/978-3-030-23425-6_7⟩

    جغرافية الموضوع: Verona, Italy

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    Academic Journal

    المساهمون: National Research Foundation, Prime Minister’s Office, Singapore, through its Strategic Capability Research Centres Funding Initiative, Energy Research Institute (ERI@N), Nanyang Technological University, Singapore

    المصدر: IEEE Transactions on Intelligent Transportation Systems ; volume 22, issue 11, page 7015-7029 ; ISSN 1524-9050 1558-0016

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    Academic Journal

    المساهمون: School of Computer Science and Engineering, National University of Singapore

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    Academic Journal

    المساهمون: School of Computer Science and Engineering

    Relation: IEEE Transactions on Computers; Bhattacharjee, D., Tavva, Y., Easwaran, A. & Chattopadhyay, A. (2020). Crossbar-constrained technology mapping for ReRAM based in-memory computing. IEEE Transactions On Computers, 69(5), 734-748. https://dx.doi.org/10.1109/TC.2020.2964671; https://hdl.handle.net/10356/154461; 2-s2.0-85083355086; 69; 734; 748

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    Conference

    المساهمون: Vacca, Marco, Tavva, Yaswanth, Chattopadhyay, Anupam, Calimera, Andrea

    وصف الملف: ELETTRONICO

    Relation: info:eu-repo/semantics/altIdentifier/isbn/978-1-5386-9562-3; info:eu-repo/semantics/altIdentifier/wos/WOS:000458965100216; ispartofbook:Titolo volume non avvalorato; IEEE International Conference on Electronics Circuits and Systems, ICECS 2018; firstpage:853; lastpage:856; numberofpages:4; http://hdl.handle.net/11583/2736315; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85062284057; https://ieeexplore.ieee.org/document/8617879