المؤلفون: Taprogge, Jens L.M.

المساهمون: UAM. Departamento de Física Teórica

مصطلحات موضوعية: Física

وصف الملف: application/pdf

Relation: Physical Review C; http://dx.doi.org/10.1103/PhysRevC.91.054324; Gobierno de España. FPA2009-13377-C02; Gobierno de España. FPA2011-29854- C04; info:eu-repo/grantAgreement/EC/FP7/300096; Physical Review C 91.5 (2015): 054324; http://hdl.handle.net/10486/673852; 054324; 91

الاتاحة: http://hdl.handle.net/10486/673852
https://doi.org/10.1103/PhysRevC.91.054324

المؤلفون: Taprogge, Jens, Beyeler, Felix, Steinecker, Alexander, Nelson, Bradley, J.

المساهمون: Centre Suisse d'Electronique et Microtechnique SA (CSEM), FemtoTools GmbH Zurich, Eidgenössische Technische Hochschule - Swiss Federal Institute of Technology Zürich (ETH Zürich), Svetan Ratchev, TC 5, WG 5.5

المصدر: IFIP Advances in Information and Communication Technology ; 6th International Precision Assembly Seminar (IPAS) ; https://inria.hal.science/hal-01363876 ; 6th International Precision Assembly Seminar (IPAS), Feb 2012, Chamonix, France. pp.28-35, ⟨10.1007/978-3-642-28163-1_4⟩

مصطلحات موضوعية: flip-chip, C-4, self-alignment, MEMS, MOEMS, no clean, force sensor, solder paste, bismuth, FemtoTools, wafer level packaging, WLP, chip scale packaging, CSP, direct chip attach, DCA, DRIE, SOI, [INFO]Computer Science [cs]

جغرافية الموضوع: Chamonix, France

Relation: hal-01363876; https://inria.hal.science/hal-01363876; https://inria.hal.science/hal-01363876/document; https://inria.hal.science/hal-01363876/file/978-3-642-28163-1_4_Chapter.pdf

الاتاحة: https://inria.hal.science/hal-01363876
https://inria.hal.science/hal-01363876/document
https://inria.hal.science/hal-01363876/file/978-3-642-28163-1_4_Chapter.pdf
https://doi.org/10.1007/978-3-642-28163-1_4

المؤلفون: Taprogge, Jens L.M.

المساهمون: UAM. Departamento de Física Teórica

المصدر: Biblos-e Archivo. Repositorio Institucional de la UAM
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مصطلحات موضوعية: Física

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::b1deca70120b0108fbde6f7a0273d540
http://hdl.handle.net/10486/673852

المؤلفون: Taprogge, Jens Ludwig Manfred

المساهمون: Hierold, Christofer, Nelson, Bradley J.

مصطلحات موضوعية: Electric engineering, ddc:621.3, PRODUCTION IN ELECTRICAL ENGINEERING, ELECTRONICS, MICRO-, NANOELECTRONICS, MICROELECTROMECHANICAL COMPONENTS, MEMS (ELECTRICAL ENGINEERING), FERTIGUNG IN DER ELEKTROTECHNIK, ELEKTRONIK, MIKRO-, NANOELEKTRONIK, MIKROELEKTROMECHANISCHE BAUELEMENTE, MEMS (ELEKTROTECHNIK)

وصف الملف: application/application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f2a871103fe97ef3ff8280285e8f385b
https://hdl.handle.net/20.500.11850/154151

المؤلفون: Taprogge, Jens L. M.¹, Beyeler, Felix², Steinecker, Alexander³, Nelson, Bradley J.¹

المصدر: IEEE Transactions on Components, Packaging & Manufacturing Technology. Aug2013, Vol. 3 Issue 8, p1420-1429. 10p.

مصطلحات موضوعية: *ELECTRONIC packaging, *ROBOTICS, MICROELECTROMECHANICAL systems, OXIDES

People: OXIDE & Neutrino (Performer)

المؤلفون: Taprogge, Jens L. M.¹, Nelson, Bradley J.¹, Beyeler, Felix²

المصدر: IEEE Transactions on Components, Packaging & Manufacturing Technology. Feb2013, Vol. 3 Issue 2, p342-349. 8p.

مصطلحات موضوعية: TEMPERATURE detectors, CLOSED loop systems, MICROELECTROMECHANICAL systems, FLIP chip technology, FEEDBACK control systems, COMPUTER interfaces