المؤلفون: Chen, Y., Tang, Y.T., Collins, D.M., Clark, S.J., Ludwig, W., Rodriguez-Lamas, R., Detlefs, C., Reed, R.C., Lee, P.D., Withers, P.J., Yildirim, C.

المساهمون: Matériaux, ingénierie et science Villeurbanne (MATEIS), Université Claude Bernard Lyon 1 (UCBL), Université de Lyon-Université de Lyon-Institut National des Sciences Appliquées de Lyon (INSA Lyon), Université de Lyon-Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS), European Synchrotron Radiation Facility Grenoble (ESRF)

المصدر: ISSN: 1359-6462.

مصطلحات موضوعية: Directed Energy Deposition Laser Additive Manufacturing Dark Field X-ray Microscopy Electron Backscatter Diffraction Microstructure, Directed Energy Deposition, Laser Additive Manufacturing, Dark Field X-ray Microscopy, Electron Backscatter Diffraction, Microstructure, [SPI]Engineering Sciences [physics]

Relation: hal-04305265; https://hal.science/hal-04305265; https://hal.science/hal-04305265/document; https://hal.science/hal-04305265/file/AM_surface_grain_paper_REVISED.pdf

الاتاحة: https://hal.science/hal-04305265
https://hal.science/hal-04305265/document
https://hal.science/hal-04305265/file/AM_surface_grain_paper_REVISED.pdf
https://doi.org/10.1016/j.scriptamat.2023.115579

المؤلفون: Tang, Y.T., Yin, S.G., Peng, C.F., Tang, J.Y., Jia, G., Che, L.Q., Liu, G.M., Tian, G., Chen, X.L., Cai, J.Y., Kang, B., Zhao, H.

المصدر: Poultry Science ; volume 102, issue 11, page 103037 ; ISSN 0032-5791

الاتاحة: http://dx.doi.org/10.1016/j.psj.2023.103037
https://api.elsevier.com/content/article/PII:S0032579123005564?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0032579123005564?httpAccept=text/plain

المؤلفون: Alabort, E., Tang, Y.T., Barba, D., Reed, R.C.

المساهمون: Innovate UK

المصدر: Acta Materialia ; volume 229, page 117749 ; ISSN 1359-6454

الاتاحة: http://dx.doi.org/10.1016/j.actamat.2022.117749
https://api.elsevier.com/content/article/PII:S1359645422001355?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S1359645422001355?httpAccept=text/plain

المؤلفون: Todaro, C.J., Rashidi, M., Liu, R.L., Gao, S., Le, T.P., Fronda, J.E., Setyadji, J., Tang, Y.T., Seita, M.

المساهمون: Nanyang Technological University, Ministry of Education - Singapore

المصدر: Materials Characterization ; volume 194, page 112454 ; ISSN 1044-5803

الاتاحة: http://dx.doi.org/10.1016/j.matchar.2022.112454
https://api.elsevier.com/content/article/PII:S1044580322007367?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S1044580322007367?httpAccept=text/plain

المؤلفون: Tang, Y.T., Reiff-Musgrove, R., Gu, W., Campbell, J.E., Burley, M., Dean, J., Clyne, T.W.

المساهمون: Leverhulme Trust, Engineering and Physical Sciences Research Council

المصدر: Materials Science and Engineering: A ; volume 848, page 143429 ; ISSN 0921-5093

الاتاحة: http://dx.doi.org/10.1016/j.msea.2022.143429
https://api.elsevier.com/content/article/PII:S0921509322008188?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0921509322008188?httpAccept=text/plain

المؤلفون: Barba Cancho, Daniel, Alabort, C., Tang, Y.T., Viscasillas Morillo, Manuel José, Reed, R.C., Alabort, E.

المصدر: Materials & Design, ISSN 0264-1275, 2020-01-15, Vol. 186

مصطلحات موضوعية: Materiales, Mecánica

وصف الملف: application/pdf

Relation: https://www.sciencedirect.com/science/article/pii/S0264127519306732; https://oa.upm.es/77172/

الاتاحة: https://oa.upm.es/77172/

المؤلفون: Barba, D., Alabort, C., Tang, Y.T., Viscasillas, M.J., Reed, R.C., Alabort, E.

المساهمون: OxMet Technologies

المصدر: Materials & Design ; volume 186, page 108235 ; ISSN 0264-1275

الاتاحة: http://dx.doi.org/10.1016/j.matdes.2019.108235
https://api.elsevier.com/content/article/PII:S0264127519306732?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0264127519306732?httpAccept=text/plain

المؤلفون: Tang, Y.T., Zhang, C., Ren, L.B., Yang, W., Yin, D.D., Huang, G.H., Zhou, H., Zhang, Y.B.

المساهمون: National Natural Science Foundation of China, Sichuan Science and Technology Program

المصدر: Journal of Magnesium and Alloys ; volume 7, issue 3, page 522-528 ; ISSN 2213-9567

الاتاحة: http://dx.doi.org/10.1016/j.jma.2019.05.003
https://api.elsevier.com/content/article/PII:S2213956719300404?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S2213956719300404?httpAccept=text/plain

المؤلفون: Zhang, R.Y., Qin, H.L., Bi, Z.N., Tang, Y.T., Araujo de Oliveira, J., Lee, T.L., Panwisawas, C., Zhang, S.Y., Zhang, J., Li, J., Dong, H.B.

وصف الملف: application/pdf

Relation: https://oro.open.ac.uk/82898/1/1-s2.0-S1005030222003577-main%20%281%29.pdf; Zhang, R.Y.; Qin, H.L.; Bi, Z.N.; Tang, Y.T.; Araujo de Oliveira, J. ; Lee, T.L.; Panwisawas, C.; Zhang, S.Y.; Zhang, J.; Li, J. and Dong, H.B. (2022). γ'' variant-sensitive deformation behaviour of Inconel 718 superalloy. Journal of Materials Science & Technology, 126 pp. 169–181.

الاتاحة: https://oro.open.ac.uk/82898/
https://oro.open.ac.uk/82898/1/1-s2.0-S1005030222003577-main%20%281%29.pdf
https://doi.org/10.1016/j.jmst.2022.03.018

المؤلفون: Barba, Daniel, Alabort, Carles, Tang, Y.T., Viscasillas, M.J., Reed, R.C., Alabort, E.

المصدر: Materials & Design, 186, 108235, (2019-11-01)

Relation: https://doi.org/10.5281/zenodo.10509361; https://doi.org/10.5281/zenodo.10509362; oai:zenodo.org:10509362; https://doi.org/10.1016/j.matdes.2019.108235; https://www.sciencedirect.com/science/article/pii/S0264127519306732?via%3Dihub

الاتاحة: https://doi.org/10.5281/zenodo.10509362
https://doi.org/10.1016/j.matdes.2019.108235
https://www.sciencedirect.com/science/article/pii/S0264127519306732?via%3Dihub

المؤلفون: Chen, A.Y., Bu, Y., Tang, Y.T., Wang, Y., Liu, F., Xie, X.F., Gu, J.F.

المساهمون: NSFC, Metal-based Advanced Electrical Materials Key Laboratory of Shanghai Municipal Commission of Education, Shanghai Municipal Education Commission

المصدر: Thin Solid Films ; volume 574, page 71-77 ; ISSN 0040-6090

الاتاحة: http://dx.doi.org/10.1016/j.tsf.2014.10.053
https://api.elsevier.com/content/article/PII:S0040609014010141?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0040609014010141?httpAccept=text/plain

المؤلفون: Waite, A.M., Straube, U.N., Lloyd, N.S., Croucher, S.G., Tang, Y.T., Rong, B., Evans, A.G.R., Grasby, T.J., Myronov, M., Whall, T.E., Parker, E.H.C., Norris, D.J., Cullis, A.G.

Relation: Waite, A.M., Straube, U.N., Lloyd, N.S., Croucher, S.G., Tang, Y.T., Rong, B., Evans, A.G.R., Grasby, T.J., Myronov, M., Whall, T.E., Parker, E.H.C., Norris, D.J. and Cullis, A.G. (2002) Enhanced performance from SiGe pMOSFETs Fabricated on NOvel SiGe Virtual Substrates Grown on 10µm x 10µm Si pillars. SSDM 2002. pp. 10-11 .

الاتاحة: https://eprints.soton.ac.uk/257808/

المؤلفون: Temple, M.P., Paul, D.J., Tang, Y.T., Waite, A.M., Cerrina, C, Evans, A.G.R., Grasby, T.J., Parker, E.H.C., von Känel, H, O’Neill, A.G

وصف الملف: application/octet-stream; text

Relation: https://eprints.soton.ac.uk/258988/1/Paper_for_IEEE_TED.DOC; https://eprints.soton.ac.uk/258988/2/Paper_for_IEEE_TED.pdf; Temple, M.P., Paul, D.J., Tang, Y.T., Waite, A.M., Cerrina, C, Evans, A.G.R., Grasby, T.J., Parker, E.H.C., von Känel, H and O’Neill, A.G (2005) Enhanced p-MOSFET performance using strained-Si on SiGe virtual substrates grown by low energy plasma enhanced chemical vapor deposition. IEEE Transactions on Electron Devices.

الاتاحة: https://eprints.soton.ac.uk/258988/
https://eprints.soton.ac.uk/258988/1/Paper_for_IEEE_TED.DOC
https://eprints.soton.ac.uk/258988/2/Paper_for_IEEE_TED.pdf

المؤلفون: Paul, D.J., Temple, M., Olsen, S.H., ONeill, A.G., Tang, Y.T., Waite, A.M., Cerrina, C., Evans, A.G.R., Li, X., Zhang, J., Norris, D.J., Cullis, A.G.

Relation: Paul, D.J., Temple, M., Olsen, S.H., ONeill, A.G., Tang, Y.T., Waite, A.M., Cerrina, C., Evans, A.G.R., Li, X., Zhang, J., Norris, D.J. and Cullis, A.G. (2005) Strained-Si n-MOS surface-channel and buried Si0.7Ge0.3 compressively-strained p-MOS fabricated in a 0.25 µm heterostructure CMOS process. Materials Science in Semiconductor Processing, 8 (1-3), 343-346.

الاتاحة: https://eprints.soton.ac.uk/260880/

المؤلفون: Paul, D.J., Temple, M., Olsen, S.H., O'Neill, A.G., Tang, Y.T, Waite, A.M., Cerrina, C., Evans, A.G.R., Li, X., Zhang, J., Norris, D.J., Cullis, A.G.

Relation: Paul, D.J. et al. (2005) Strained-Si n-MOS surface-channel and buried Si0.7Ge0.3 compressively-strained p-MOS fabricated in a 0.25 mu m heterostructure CMOS process. Materials Science in Semiconductor Processing , 8(1-3), pp. 343-346. (doi:10.1016/j.mssp.2004.09.106 )

الاتاحة: http://eprints.gla.ac.uk/48091/

المؤلفون: Tang, Y.T., Chen, Y.W., Huang, H.P., Yu, C.C., Hung, S.B., Lee, M.J.

مصطلحات موضوعية: esterification, acetate, reactive distillation, process design, butyl acetate, chemical-equilibrium, reaction-kinetics, methyl acetate, system, dynamics

Relation: Aiche Journal, Vol.51, No.6, pp.1683-1699; http://ir.lib.ntust.edu.tw/handle/987654321/33916; http://ir.lib.ntust.edu.tw/bitstream/987654321/33916/-1/index.html

الاتاحة: http://ir.lib.ntust.edu.tw/handle/987654321/33916
https://doi.org/10.1002/aic.10519
http://ir.lib.ntust.edu.tw/bitstream/987654321/33916/-1/index.html

المؤلفون: Tang, Y.T., Huang, H.P., Chien, I.L.

مصطلحات موضوعية: reactive distillation, plant-wide, dynamics, control, design

Relation: Journal of Chemical Engineering of Japan, Vol.38, No.2, pp.130-146; http://ir.lib.ntust.edu.tw/handle/987654321/33917; http://ir.lib.ntust.edu.tw/bitstream/987654321/33917/-1/index.html

الاتاحة: http://ir.lib.ntust.edu.tw/handle/987654321/33917
https://doi.org/10.1252/jcej.38.130
http://ir.lib.ntust.edu.tw/bitstream/987654321/33917/-1/index.html

المؤلفون: Chien, I.L., Teng, Y.P., Huang, H.P., Tang, Y.T.

مصطلحات موضوعية: ethyl acetate process, coupled reactor/column, process design, plant-wide control, reactive distillation, systems, esterification, simulation

Relation: Journal of Process Control, Vol.15, No.4, pp.435-449; http://ir.lib.ntust.edu.tw/handle/987654321/33873; http://ir.lib.ntust.edu.tw/bitstream/987654321/33873/-1/index.html

الاتاحة: http://ir.lib.ntust.edu.tw/handle/987654321/33873
https://doi.org/10.1016/j.jprocont.2004.07.003
http://ir.lib.ntust.edu.tw/bitstream/987654321/33873/-1/index.html

المؤلفون: Rong, B., Zijlstra, T., Tang, Y.T., Evans, A.G.R.

المصدر: Microelectronic Engineering ; volume 78-79, page 319-323 ; ISSN 0167-9317

الاتاحة: http://dx.doi.org/10.1016/j.mee.2004.12.041
https://api.elsevier.com/content/article/PII:S0167931704005775?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0167931704005775?httpAccept=text/plain

المؤلفون: Paul, D.J., Temple, M., Olsen, S.H., ONeill, A.G., Tang, Y.T., Waite, A.M., Cerrina, C., Evans, A.G.R., Li, X., Zhang, J., Norris, D.J., Cullis, A.G.

المصدر: Materials Science in Semiconductor Processing ; volume 8, issue 1-3, page 343-346 ; ISSN 1369-8001

الاتاحة: http://dx.doi.org/10.1016/j.mssp.2004.09.106
https://api.elsevier.com/content/article/PII:S1369800104001738?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S1369800104001738?httpAccept=text/plain