المؤلفون: Liu, Johan, 1960, Chen, Si, 1981, Ye, Lilei

المصدر: Lead-Free Solders: Materials Reliability for Electronics. :161-177

مصطلحات موضوعية: electronics packaging, solder characterization, lead-free solder, nano-reinforcements, nanocomposite solder, nano-composite solder fabrication, wettability, nano-composite solders, TMF resistance

URL الوصول: https://research.chalmers.se/publication/168915