المؤلفون: S. Lapper, T. Booz, M. Fenker, H. Kück, W. Eberhardt, H. Richter, H. Kappl, K. Petrikowski

المصدر: Proceedings of the 7th International Conference on Multi-Material Micro Manufacture.

مصطلحات موضوعية: Materials science, Hot embossing, Engineering physics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8167f92a21b6f412eaa87ad6a54ecd74
https://doi.org/10.3850/978-981-08-6555-9_167