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المؤلفون: Belov, Ilja, Wingbrant, Helena, Spetz, Anita-Lloyd, Sundgren, Hans, Thuner, Bo, Svenningstorp, Henrick, Leisner, Peter
المصدر: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. :475-482
وصف الملف: print