المؤلفون: Vivek Chidambaram, Sharon Lim Pei Siang, Wang Xiangyu, Vasarla Nagendra Sekhar, Surya Bhattacharya

المصدر: IEEE Journal of the Electron Devices Society, Vol 7, Pp 1209-1216 (2019)

مصطلحات موضوعية: Active interposer, heterogeneous integration, via-last TSV, reflow, underfill, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/8830464/; https://doaj.org/toc/2168-6734

URL الوصول: https://doaj.org/article/8f74a72230314abdb958643a6f01cf44

المؤلفون: Fahad S. Al-Mubaddel, Abhijit Dutta, Himadri Chattopadhyay, Abdullah M. Abusorrah, Mamdouh El Haj Assad, Mohammad Rahimi-Gorji, Nidal H. Abu-Hamdeh, Sayan Surya Bhattacharya

المصدر: Case Studies in Thermal Engineering, Vol 26, Iss , Pp 100992- (2021)

مصطلحات موضوعية: Exergetic performance, Condenser, Fouling resistance, Cooling water, Load, Overall heat transfer coefficient, Engineering (General). Civil engineering (General), TA1-2040

Relation: http://www.sciencedirect.com/science/article/pii/S2214157X21001556; https://doaj.org/toc/2214-157X; https://doaj.org/article/9fd2c112a64c48c3b1e0d586f9ac0cf6

الاتاحة: https://doi.org/10.1016/j.csite.2021.100992
https://doaj.org/article/9fd2c112a64c48c3b1e0d586f9ac0cf6

المؤلفون: Teyuh Chou, Wei Tang, Mihai D. Rotaru, Chester Liu, Rahul Dutta, Sharon Lim Pei Siang, David Ho Soon Wee, Surya Bhattacharya, Zhengya Zhang

المصدر: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bf915032fa27edcb6f0192a7b3266618
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830249

المؤلفون: Chai Tai Chong, Soon Wee Ho, Chong Ser Choong, Sharon Lim P S, Surya Bhattacharya

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::03219e1d4f7e34b4319d8cbd85bfb662
https://doi.org/10.1109/ectc51906.2022.00110

المؤلفون: Sajay Bhuvanendran Nair Gourikutty, Ming Chinq Jong, Chockanathan Vinoth Kanna, David Soon Wee Ho, Seit Wen Wei, Sharon Lim Pei Siang, Jiaqi Wu, Teck Guan Lim, Rathin Mandal, Jason Tsung-Yang Liow, Surya Bhattacharya

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::704eecc72e2321a35bc1f1506940f8b9
https://doi.org/10.1109/ectc51906.2022.00074

المؤلفون: Sajay Bhuvanendran Nair Gourikutty, Ming Chinq Jong, Chockanathan Vinoth Kanna, David Soon Wee Ho, Jiaqi Wu, Rathin Mandal, Nanxi Li, Teck Guan Lim, Jason Tsung-Yang Liow, Surya Bhattacharya

المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::911cad6d159965ffd102b73636077ff3
https://doi.org/10.1109/eptc53413.2021.9663971

المؤلفون: Mamdouh El Haj Assad, Himadri Chattopadhyay, Sayan Surya Bhattacharya, Abdullah Abusorrah, Nidal H. Abu-Hamdeh, Mohammad Rahimi-Gorji, Fahad S. Al-Mubaddel, Abhijit Dutta

المصدر: Case Studies in Thermal Engineering, Vol 26, Iss, Pp 100992-(2021)

مصطلحات موضوعية: Exergy, Exergetic performance, Materials science, Overall heat transfer coefficient, 020209 energy, Thermal power station, 02 engineering and technology, Heat transfer coefficient, 01 natural sciences, Thermal conductivity, 0202 electrical engineering, electronic engineering, information engineering, Mass flow rate, Water cooling, Cooling water, Engineering (miscellaneous), Condenser (heat transfer), Fluid Flow and Transfer Processes, Fouling, Fouling resistance, Engineering (General). Civil engineering (General), 010406 physical chemistry, 0104 chemical sciences, Law, Condenser, Load, TA1-2040

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6b2567b1bab1c02916a6bb770ece49af
http://www.sciencedirect.com/science/article/pii/S2214157X21001556

المؤلفون: Sharon Lim Pei Siang, Chong Ser Choong, Lim Teck Guan, Han Yong, Surya Bhattacharya, David Ho, Chai Tai Chong

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Wafer fabrication, Interconnection, Fabrication, Application-specific integrated circuit, Computer science, Process integration, Hardware_INTEGRATEDCIRCUITS, Semiconductor device modeling, Mechanical engineering, Process control, Wafer

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b752aaad551fa44e8aba4bbc32f99ef5
https://doi.org/10.1109/ectc32696.2021.00348

المؤلفون: Kok Keng Chua, Sharon Lim Seow Huang, Surya Bhattacharya, Desmond Yeo, Sajay Bhuvanendran Nair Gourikutty, Jesse Alton

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Computer science, Interposer, Volume (computing), Isolation (database systems), Fault (power engineering), Chip, Field-programmable gate array, Fault detection and isolation, Die (integrated circuit), Reliability engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f2ebe29e8430e5242780195321f3e3ca
https://doi.org/10.1109/ectc32696.2021.00144

المؤلفون: Surya Bhattacharya, David Ho Soon Wee, Eva Wai Leong Ching, Lim Teck Guan, Jong Ming Ching, Loh Woon Leng

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Embedding process, Optical fiber, Computer science, business.industry, Integration platform, Integrated circuit, law.invention, Si substrate, law, Scalable design, Interposer, Optoelectronics, Photonics, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::da5002c397decbb1f5b166ec098671f5
https://doi.org/10.1109/ectc32696.2021.00050

المؤلفون: Chai Tai Chong, Surya Bhattacharya, Ma Yu Gang, Sun Mei, Lim Teck Guan

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Computer science, Mimo radar, Chip, Die (integrated circuit), law.invention, Passive radar, Material selection, law, ComputerApplications_MISCELLANEOUS, visual_art, Electronic component, visual_art.visual_art_medium, Electronic engineering, Radar, Antenna (radio)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7f86124a665ef8a5de1a6d4252b60ea5
https://doi.org/10.1109/ectc32696.2021.00189

المؤلفون: Jong Ming Chinq, Ratan Bhimrao Umralkar, Sajay Bhuvanendran Nair Gourikutty, Vivek Chidambaram, Surya Bhattacharya, Jesse Alton, Kok Keng Chua

المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).

مصطلحات موضوعية: business.industry, Semiconductor device fabrication, Computer science, Location awareness, Hardware_PERFORMANCEANDRELIABILITY, Integrated circuit, computer.software_genre, Die (integrated circuit), Fault detection and isolation, law.invention, System in package, law, Non destructive, Embedded system, Integrated circuit packaging, business, computer

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::09feb24b4c49cb0a79f3e67de9279431
https://doi.org/10.1109/eptc50525.2020.9315038

المؤلفون: Kevin T. C. Chai, Rahul Dutta, Kuang Kuo Lin, Surya Bhattacharya, Anh Tuan Do, Vishnu P. Nambiar, Jingjing Lan, Rheeshaalaen Sabapathy, Mihai Rotaru, Chai Tai Chong

المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).

مصطلحات موضوعية: 010302 applied physics, Multi-core processor, Register transfer language, business.industry, Computer science, Design flow, 02 engineering and technology, 01 natural sciences, 020202 computer hardware & architecture, Embedded system, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Netlist, Interposer, Electronic design automation, Physical design, Routing (electronic design automation), business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8d0eaf75f2f42d7fb4f4ea41ba765f6f
https://doi.org/10.1109/eptc50525.2020.9315089

المؤلفون: Chai Tai Chong, Xie Dan Peng, Surya Bhattacharya, Lim Teck Guan, Sun Mei

المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).

مصطلحات موضوعية: business.industry, Computer science, Electrical engineering, Mimo radar, Solder ball, Die (integrated circuit), Computer Science::Other, law.invention, Power (physics), law, Key (cryptography), Radio frequency, Radar, Antenna (radio), business, Computer Science::Information Theory

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4214b3635a33b276b5c1310be54d36c3
https://doi.org/10.1109/eptc50525.2020.9315111

المؤلفون: Kok Keng Chua, Jesse Alton, Sajay Bhuvanendran Nair Gourikutty, Surya Bhattacharya, Haonan Bai, Yew Meng Chow, Ratan Bhimrao Umralkar

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: business.industry, Computer science, Three-dimensional integrated circuit, 02 engineering and technology, Solder ball, Fault (power engineering), 020202 computer hardware & architecture, Silicon interposer, Reliability (semiconductor), Embedded system, 0202 electrical engineering, electronic engineering, information engineering, Interposer, business, Field-programmable gate array, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e8f284096fc7884038ccdc50eda4e3cc
https://doi.org/10.1109/ectc32862.2020.00189

المؤلفون: David Ho, Lim Teck Guan, Chai Tai Chong, Surya Bhattacharya

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Interconnection, business.industry, Computer science, Integration platform, Electrical engineering, Hardware_PERFORMANCEANDRELIABILITY, Electrical connection, System in package, Printed circuit board, Hardware_INTEGRATEDCIRCUITS, Redistribution layer, Routing (electronic design automation), business, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::52a59807bb05b042c4d3532383c30b94
https://doi.org/10.1109/ectc32862.2020.00270

المؤلفون: Masaya Kawano, Yong Han, Fa Xing Che, Mian Zhi Ding, Surya Bhattacharya

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:1774-1785

مصطلحات موضوعية: 010302 applied physics, Materials science, Semiconductor device modeling, Mechanical engineering, Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Temperature cycling, 021001 nanoscience & nanotechnology, 01 natural sciences, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Reliability (semiconductor), Material selection, Chip-scale package, 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Interposer, Wafer testing, Wafer, Electrical and Electronic Engineering, 0210 nano-technology

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ffb4555b1cc575ea38178d18f9c8c14e
https://doi.org/10.1109/tcpmt.2017.2707567

المؤلفون: Surya Bhattacharya, Dutta Rahul, Shengcheng Wang, Fa Xing Che, Danpeng Xie, Lim Teck Guan, Yong Han

المصدر: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).

مصطلحات موضوعية: Antenna array, Computer science, Reference design, Design flow, Extremely high frequency, Electronic engineering, Fan-out, Radio frequency, Antenna (radio), Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e479fbcd9fe289d94d4638e260f8d208
https://doi.org/10.1109/eptc47984.2019.9026718

المؤلفون: Teck Guan Lim, Eva Wai Leong Ching, Zi-Hao Chen, Surya Bhattacharya, David Soon Wee Ho

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Interconnection, Materials science, business.industry, Die (integrated circuit), law.invention, law, Electrical network, Package on package, Hardware_INTEGRATEDCIRCUITS, Optoelectronics, Redistribution layer, Integrated circuit packaging, business, Wafer-level packaging, Electronic circuit

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::171aae7c31e05a75642e33ba239bf3e3
https://doi.org/10.1109/ectc.2019.00143

المؤلفون: Surya Bhattacharya, Jong Ming Chinq, Sharon Lim Pei Siang, Vivek Chidambaram Nachiappan, Wang Xiangyu, J. Jayabalan

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: 010302 applied physics, Computer science, Digital-to-analog converter, Three-dimensional integrated circuit, Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Integrated circuit design, 021001 nanoscience & nanotechnology, 01 natural sciences, Die (integrated circuit), law.invention, CMOS, law, 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Miniaturization, Interposer, Power Management Unit, 0210 nano-technology

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d2b2c0e34891169f49ef5b5552c528fe
https://doi.org/10.1109/ectc.2019.00094