المؤلفون: Michael Hoffmann, Zheng Wang, Nujhat Tasneem, Ahmad Zubair, Prasanna Venkatesan Ravindran, Mengkun Tian, Anthony Arthur Gaskell, Dina Triyoso, Steven Consiglio, Kandabara Tapily, Robert Clark, Jae Hur, Sai Surya Kiran Pentapati, Sung Kyu Lim, Milan Dopita, Shimeng Yu, Winston Chern, Josh Kacher, Sebastian E. Reyes-Lillo, Dimitri Antoniadis, Jayakanth Ravichandran, Stefan Slesazeck, Thomas Mikolajick, Asif Islam Khan

المصدر: Nature Communications, Vol 13, Iss 1, Pp 1-8 (2022)

مصطلحات موضوعية: Science

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2041-1723

URL الوصول: https://doaj.org/article/a3714ccb4ef949fda04b550a059cfdef

المؤلفون: Daehyun Kim, Edward Lee, Jamin Seo, Jinwoo Kim, Sung Kyu Lim, Saibal Mukhopadhyay

المصدر: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits, Vol 7, Iss 2, Pp 106-114 (2021)

مصطلحات موضوعية: CNFET, memory compiler, monolithic-3-D (M3D), electronic design automation (EDA), SRAM, Computer engineering. Computer hardware, TK7885-7895

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/9576728/; https://doaj.org/toc/2329-9231

URL الوصول: https://doaj.org/article/df1b2c62224146cda435cc567414f305

المؤلفون: Jinwoo Kim, Bon Woong Ku, Junsik Yoon, Sung Kyu Lim

المصدر: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits, Vol 7, Iss 1, Pp 26-34 (2021)

مصطلحات موضوعية: 3-D integrated circuits, block pin assignment, block-level design, physical design (EDA), pin-in-the-area, Computer engineering. Computer hardware, TK7885-7895

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/9525089/; https://doaj.org/toc/2329-9231

URL الوصول: https://doaj.org/article/8c4123e96c08456c8d1ab32441e1ddd5

المؤلفون: Tae Jun Ahn, Sung Kyu Lim, Yun Seop Yu

المصدر: Applied Sciences, Vol 11, Iss 24, p 12151 (2021)

مصطلحات موضوعية: monolithic 3D integration, inverter, interface trap charge, parameter extraction, Technology, Engineering (General). Civil engineering (General), TA1-2040, Biology (General), QH301-705.5, Physics, QC1-999, Chemistry, QD1-999

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2076-3417/11/24/12151; https://doaj.org/toc/2076-3417

URL الوصول: https://doaj.org/article/a4aecb52b7544b99ae2597dae0977606

المؤلفون: Tae Jun Ahn, Bum Ho Choi, Sung Kyu Lim, Yun Seop Yu

المصدر: Micromachines, Vol 10, Iss 10, p 637 (2019)

مصطلحات موضوعية: circuit simulation, electrical coupling, monolithic 3D integrated circuit (IC), parameter extraction, Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2072-666X/10/10/637; https://doaj.org/toc/2072-666X

URL الوصول: https://doaj.org/article/5a3e87d5d75f4118b63d694a82cb4f81

المؤلفون: Adriano Tavares, Krit Athikulwongse, Lalinthip Tangjittaweechai, Mongkol Ekpanyapong, Sung Kyu Lim, Thaisiri Watewai

المصدر: IEICE Electronics Express. 2016, 13(6):20160036

المؤلفون: Seung-Ho Ok, Yong-Hwan Lee, Jae Hoon Shim, Sung Kyu Lim, Byungin Moon

المصدر: Sensors, Vol 17, Iss 2, p 426 (2017)

مصطلحات موضوعية: through-silicon via, stereo matching processor, technology scaling, low-power, Chemical technology, TP1-1185

وصف الملف: electronic resource

Relation: http://www.mdpi.com/1424-8220/17/2/426; https://doaj.org/toc/1424-8220

URL الوصول: https://doaj.org/article/17ac8579196f444d92103dbf3f8d4851

المؤلفون: Dong Eun YOO, Ga Won LEE, Hi Deok LEE, Jae Sub OH, Jeong Gyu PARK, Kwang Il CHOI, Min Ho KANG, Myeong Ho SONG, Sung Kyu LIM, Young Su KIM

المصدر: IEICE Transactions on Electronics. 2010, E93.C(5):590

المؤلفون: Yi-Chen Lu, Siddhartha Nath, Sai Pentapati, Sung Kyu Lim

المصدر: ACM Transactions on Design Automation of Electronic Systems. 28:1-22

مصطلحات موضوعية: Electrical and Electronic Engineering, Computer Graphics and Computer-Aided Design, Computer Science Applications

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::06885b2fa57cde93f7144a9e2b94c28a
https://doi.org/10.1145/3569942

المؤلفون: Anthony Agnesina, Kyungwook Chang, Sung Kyu Lim

المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 42:1295-1308

مصطلحات موضوعية: Electrical and Electronic Engineering, Computer Graphics and Computer-Aided Design, Software

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f16d5ef2adffe38683dedfadb5b501c5
https://doi.org/10.1109/tcad.2022.3193647

المؤلفون: Anthony Agnesina, Moritz Brunion, Jinwoo Kim, Alberto Garcia-Ortiz, Dragomir Milojevic, Francky Catthoor, Gioele Mirabelli, Manu Komalan, Sung Kyu Lim

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 13:300-314

مصطلحات موضوعية: Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3700b111b83615863f35135f8e2f25e1
https://doi.org/10.1109/tcpmt.2023.3264520

المؤلفون: Arjun Chaudhuri, Sanmitra Banerjee, Jinwoo Kim, Sung Kyu Lim, Krishnendu Chakrabarty

المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 31:296-309

مصطلحات موضوعية: Hardware and Architecture, Electrical and Electronic Engineering, Software

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b9058e7c86340422c43d38fa1b748805
https://doi.org/10.1109/tvlsi.2022.3228850

المؤلفون: Jongwon Lee, Kilsun Roh, Sung-Kyu Lim, Youngsu Kim

المصدر: Micromachines; Volume 12; Issue 1; Pages: 89

مصطلحات موضوعية: InP, via hole, 3D integration, through substrate via (TSV)

وصف الملف: application/pdf

Relation: https://dx.doi.org/10.3390/mi12010089

الاتاحة: https://doi.org/10.3390/mi12010089

المؤلفون: Lingjun Zhu, Chanmin Jo, Sung Kyu Lim

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1969-1982

مصطلحات موضوعية: Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::353fae515bf114ac07581f387044399f
https://doi.org/10.1109/tcpmt.2022.3221025

المؤلفون: Yi-Chen Lu, Sai Pentapati, Lingjun Zhu, Gauthaman Murali, Kambiz Samadi, Sung Kyu Lim

المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 41:4575-4586

مصطلحات موضوعية: Electrical and Electronic Engineering, Computer Graphics and Computer-Aided Design, Software

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::71a07a2e297ea7f3a7e58de715420a67
https://doi.org/10.1109/tcad.2021.3139310

المؤلفون: Anthony Agnesina, Yi-Chen Lu, Jeehyun Lee, Kambiz Samadi, Sung Kyu Lim

المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 41:3104-3117

مصطلحات موضوعية: Computer science, Design space exploration, business.industry, Multi-task learning, Machine learning, computer.software_genre, Computer Graphics and Computer-Aided Design, Metamodeling, Design objective, Netlist, Sequence learning, Artificial intelligence, Electrical and Electronic Engineering, Physical design, Transfer of learning, business, computer, Software

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9c914a754f767fa225052ebe35a01351
https://doi.org/10.1109/tcad.2021.3122109

المؤلفون: Sai Pentapati, Sung Kyu Lim

المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 30:1355-1367

مصطلحات موضوعية: Hardware and Architecture, Electrical and Electronic Engineering, Software

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::21fe05a286e96a28333d4a7c344b9f79
https://doi.org/10.1109/tvlsi.2022.3181185

المؤلفون: Yandong Luo, Sourav Dutta, Ankit Kaul, Sung Kyu Lim, Muhannad Bakir, Suman Datta, Shimeng Yu

المصدر: IEEE Journal on Emerging and Selected Topics in Circuits and Systems. 12:445-457

مصطلحات موضوعية: Electrical and Electronic Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bbb452787c67538784acdafc4d09e89d
https://doi.org/10.1109/jetcas.2022.3177577

المؤلفون: Matheus Cavalcante, Anthony Agnesina, Samuel Riedel, Moritz Brunion, Alberto Garcia-Ortiz, Dragomir Milojevic, Francky Catthoor, Sung Kyu Lim, Luca Benini

المساهمون: Matheus Cavalcante, Anthony Agnesina, Samuel Riedel, Moritz Brunion, Alberto Garcia-Ortiz, Dragomir Milojevic, Francky Catthoor, Sung Kyu Lim, Luca Benini

مصطلحات موضوعية: Many-core, 3D Integration, 3D-ICs

وصف الملف: ELETTRONICO

Relation: info:eu-repo/semantics/altIdentifier/isbn/978-3-9819263-6-1; info:eu-repo/semantics/altIdentifier/wos/WOS:000819484300076; ispartofbook:2022 Design, Automation & Test in Europe Conference & Exhibition (DATE); 2022 Design, Automation & Test in Europe Conference & Exhibition (DATE); firstpage:394; lastpage:399; numberofpages:6; serie:PROCEEDINGS - DESIGN, AUTOMATION, AND TEST IN EUROPE CONFERENCE AND EXHIBITION; https://hdl.handle.net/11585/905384; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85130791268

الاتاحة: https://hdl.handle.net/11585/905384
https://doi.org/10.23919/date54114.2022.9774726

المؤلفون: Bon Woong Ku, Catherine D. Schuman, Md Musabbir Adnan, Tiffany M. Mintz, Raphael Pooser, Kathleen E. Hamilton, Garrett S. Rose, Sung Kyu Lim

المصدر: ACM Journal on Emerging Technologies in Computing Systems. 18:1-20

مصطلحات موضوعية: Hardware and Architecture, Electrical and Electronic Engineering, Software

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1c3360dc4c76a475d0ed441bc07c7554
https://doi.org/10.1145/3473036