المؤلفون: D. Sherlekar, B. Cheng, X-W. Lin, Victor Moroz, Lee Joung Joo, Suketu A. Parikh, Munkang Choi, Po-Wen Chan, P. Asenov

المصدر: 2020 IEEE Symposium on VLSI Technology.

مصطلحات موضوعية: Materials science, Logic block, business.industry, Transistor, Electrical engineering, Copper interconnect, Ranging, Signal, Power (physics), law.invention, law, Hardware_INTEGRATEDCIRCUITS, Node (circuits), Routing (electronic design automation), business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::dc4155fd8fa441df3e312a9301a38ee4
https://doi.org/10.1109/vlsitechnology18217.2020.9265022

المؤلفون: Hsiang-Jen Huang, Roey Shaviv, Lee Joung Joo, Balasubramanian S. Pranatharthi Haran, Nicolas Loubet, Suketu A. Parikh, A. Simon, Takeshi Nogami, S. Reidy, Rong Tao, M. Gage, Nicholas A. Lanzillo, M. Stolfi, Prasad Bhosale

المصدر: 2020 IEEE Symposium on VLSI Technology.

مصطلحات موضوعية: Standard cell, Computer science, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Node (circuits), Supercomputer, Electrical conductor, Signal, Line (electrical engineering), Power (physics), Conductor

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5cf619ac69174397e98b98f31b3e95d2
https://doi.org/10.1109/vlsitechnology18217.2020.9265021

المؤلفون: Suketu A. Parikh, Roman Mostovoy

المصدر: 2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM).

مصطلحات موضوعية: Reduction (complexity), Identification (information), Yield (engineering), Knowledge base, Computer science, business.industry, Process (computing), Wafer, Hardware_PERFORMANCEANDRELIABILITY, Root cause, business, Metrology, Reliability engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7602455e5001cfa4e694737dc1f91bd7
https://doi.org/10.1109/edtm.2018.8421515

المؤلفون: Suketu A. Parikh, N Parekh, Armstrong Karl J, J Gardner, L Akselrod

المصدر: Thin Solid Films. 320:26-30

مصطلحات موضوعية: geography, geography.geographical_feature_category, Metals and Alloys, chemistry.chemical_element, Mineralogy, Surfaces and Interfaces, Tungsten, equipment and supplies, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, law.invention, Barrier layer, chemistry, Volcano, law, Materials Chemistry, Barrier integrity, Area density, Composite material, Tin, Spark plug, Deposition (law)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b4af8f5e9a9ac2f2bcafa489f096ffe4
https://doi.org/10.1016/s0040-6090(97)01061-4

المؤلفون: Suketu A. Parikh

المصدر: Thin Solid Films. 320:58-62

مصطلحات موضوعية: Materials science, business.industry, Metals and Alloys, chemistry.chemical_element, Surfaces and Interfaces, Aspect ratio (image), Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, law.invention, chemistry, Sputtering, Aluminium, law, Chemical-mechanical planarization, Materials Chemistry, Deposition (phase transition), Optoelectronics, business, Tin, Spark plug, Wetting layer

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::91b3626abab4ec068e9872e072571350
https://doi.org/10.1016/s0040-6090(97)01065-1

المؤلفون: Suketu A. Parikh, M. Y. Lee, Peter Bennett

المصدر: Surface Science. 356:53-58

مصطلحات موضوعية: Auger electron spectroscopy, Reflection high-energy electron diffraction, Silicon, Annealing (metallurgy), Analytical chemistry, chemistry.chemical_element, Surfaces and Interfaces, Condensed Matter Physics, Surfaces, Coatings and Films, law.invention, chemistry.chemical_compound, chemistry, Electron diffraction, law, Silicide, Monolayer, Materials Chemistry, Scanning tunneling microscope

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::201f18c396c1728c35a74411e344dea9
https://doi.org/10.1016/0039-6028(96)00029-5

المؤلفون: Peter Bennett, Raymond J. Phaneuf, M. Y. Lee, K. Wurm, Suketu A. Parikh

المصدر: Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 13:1728-1732

مصطلحات موضوعية: Microscope, Materials science, Silicon, Bilayer, Analytical chemistry, chemistry.chemical_element, Surfaces and Interfaces, Condensed Matter Physics, Molecular physics, Surfaces, Coatings and Films, law.invention, Low-energy electron microscopy, chemistry, law, Phase (matter), Monolayer, Electron microscope, Phase diagram

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c89c5ffce476f50326d5177587e22445
https://doi.org/10.1116/1.579759

المؤلفون: Peter Bennett, Suketu A. Parikh, M. Y. Lee

المصدر: Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 13:1589-1594

مصطلحات موضوعية: Phase transition, Materials science, Silicon, Annealing (metallurgy), Refractory metals, chemistry.chemical_element, Surfaces and Interfaces, Condensed Matter Physics, Surfaces, Coatings and Films, law.invention, Metal, Crystallography, Transition metal, chemistry, law, visual_art, visual_art.visual_art_medium, Scanning tunneling microscope, Electron microscope

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9b01d06a9c043957d464762aafd846f8
https://doi.org/10.1116/1.579733

المؤلفون: Peter Bennett, David G. Cahill, Suketu A. Parikh, M. Y. Lee

المصدر: Surface Science. 312:377-386

مصطلحات موضوعية: Silicon, chemistry.chemical_element, Surfaces and Interfaces, Condensed Matter Physics, Kinetic energy, Epitaxy, Surfaces, Coatings and Films, chemistry.chemical_compound, Crystallography, chemistry, Atomic theory, Metastability, Monolayer, Silicide, Materials Chemistry, Cobalt

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::818d06bcd3c750b658b0591c3e2125c1
https://doi.org/10.1016/0039-6028(94)90729-3

المؤلفون: J Virtanen, Suketu A. Parikh

المصدر: Nanotechnology. 4:159-162

مصطلحات موضوعية: Coalescence (physics), Microscope, Nanostructure, Materials science, Condensed matter physics, business.industry, Astrophysics::High Energy Astrophysical Phenomena, Mechanical Engineering, Physics::Optics, Bioengineering, General Chemistry, law.invention, General Relativity and Quantum Cosmology, Optics, Transition metal, Mechanics of Materials, law, Nano, Surface structure, General Materials Science, Gold surface, Electrical and Electronic Engineering, business, Quantum tunnelling

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::68652f4740c38632c5846bf237a3186a
https://doi.org/10.1088/0957-4484/4/3/005

المؤلفون: Suketu A. Parikh, Peter Bennett, David G. Cahill

المصدر: Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 11:1680-1685

مصطلحات موضوعية: Silicon, Nucleation, chemistry.chemical_element, Crystal growth, Surfaces and Interfaces, Condensed Matter Physics, Epitaxy, Surfaces, Coatings and Films, law.invention, chemistry.chemical_compound, Crystallography, chemistry, Chemical physics, law, Silicide, Monolayer, Thin film, Scanning tunneling microscope

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c30970ee6924c10339489c83589a2416
https://doi.org/10.1116/1.578478

المؤلفون: Timothy W. Weidman, Michael P. Stewart, H.-W. Guo, Sunhom Paak, Suketu A. Parikh, L. Zhao, Rohit Mishra, Prabhat Kumar, Zhenhua Zhang, Hemant P. Mungekar

المصدر: 2010 35th IEEE Photovoltaic Specialists Conference.

مصطلحات موضوعية: Materials science, Silicon, business.industry, Contact resistance, chemistry.chemical_element, Carrier lifetime, Dielectric, Nitride, chemistry.chemical_compound, chemistry, Silicon nitride, Aluminium, Optoelectronics, business, Silicon oxide

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9dcf9b8999408c0cfce926f73ef204d9
https://doi.org/10.1109/pvsc.2010.5614195

المؤلفون: Raymond Hung, L. Zhang, Michael D. Armacost, Huixiong Dai, Kuo-Wei Liu, Suketu A. Parikh, G. Dixit, Deenesh Padhi, T. Pan, Mehul Naik

المصدر: Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729).

مصطلحات موضوعية: Stress (mechanics), Materials science, Yield (engineering), Dielectric strength, chemistry, Stress migration, Etching, Analytical chemistry, chemistry.chemical_element, Dielectric, Electromigration, Copper

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::738c9b759ebedf15266a2080cf43b5de
https://doi.org/10.1109/iitc.2004.1345684

المؤلفون: Suketu A. Parikh, N. Yoshida, G. Dixit, N. Maity, Joseph Yahalom, J. Yu, Srinivas Gandikota, Deenesh Padhi, J. Chen, K. Shankaranarayanan

المصدر: Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695).

مصطلحات موضوعية: Barrier layer, Surface diffusion, Materials science, chemistry, Copper interconnect, Electronic engineering, Grain boundary diffusion coefficient, chemistry.chemical_element, Grain boundary, Composite material, Layer (electronics), Electromigration, Copper

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::59ed5f5d34674f1dcf6dfaa4d2712d4d
https://doi.org/10.1109/iitc.2003.1219742

المؤلفون: Ling Chen, T. Vo, Peijun Ding, S. Rengarajan, Roderick C. Mosely, Suketu A. Parikh, Jay Chen, Tushar Mandrekar

المصدر: Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).

مصطلحات موضوعية: Barrier layer, Crystallography, Materials science, Scanning electron microscope, Stress migration, Copper plating, Copper interconnect, Wetting, Layer (electronics), Sheet resistance

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6ed84fdfaffe110247356d30e52053a2
https://doi.org/10.1109/iitc.2002.1014928

المؤلفون: Jimin Zhang, A. Schwarm, Suketu A. Parikh, H. Li, Martin Jay Seamons, Rong Pan, Arulkumar Shanmugasundram, J. Paik, M. Sarfaty, R. Hung

المصدر: 13th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference. Advancing the Science and Technology of Semiconductor Manufacturing. ASMC 2002 (Cat. No.02CH37259).

مصطلحات موضوعية: Engineering, Computer-integrated manufacturing, Automatic control, business.industry, Semiconductor device fabrication, Process capability index, Electronic engineering, Process control, Control engineering, business, Statistical process control, Process control monitoring, Advanced process control

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::08ea6c8aa7c11c84a0773b4b416641e8
https://doi.org/10.1109/asmc.2002.1001583

المؤلفون: Srinivas Gandikota, Robin Cheung, S. Ramanathan, Deenesh Padhi, Suketu A. Parikh, C. McGuirk, R. Emami, G. Dixit

المصدر: Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).

مصطلحات موضوعية: Materials science, Physics::Instrumentation and Detectors, Annealing (metallurgy), Metallurgy, chemistry.chemical_element, Copper, Grain size, Physics::Fluid Dynamics, Condensed Matter::Materials Science, chemistry, Residual stress, Condensed Matter::Superconductivity, Stress relaxation, Wafer, Electroplating, Current density

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a07556d386fbb624ea50e060878b2996
https://doi.org/10.1109/iitc.2002.1014932

المؤلفون: P. Li, Mehul Naik, V. Rana, D. Cheung, Suketu A. Parikh, T. Pan, P. Hey, F. Redeker, S. Jenq, J. Educato, B. Tang, D. Yost, I. Hashim

المصدر: Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247).

مصطلحات موضوعية: Materials science, Analytical chemistry, Diamond, chemistry.chemical_element, Dielectric, engineering.material, Capacitance, Electromigration, Copper, Electrical resistance and conductance, chemistry, Chemical-mechanical planarization, Electronic engineering, engineering, Wafer

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::de3fdb169df0b0fd2139171f41d56e16
https://doi.org/10.1109/iitc.1999.787115

المؤلفون: Deenesh Padhi, Suketu A. Parikh, A. Malik, G. Dixit, J. Chen, C. McGuirk, Srinivas Gandikota

المصدر: Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

مصطلحات موضوعية: Yield (engineering), Materials science, chemistry, Metallurgy, Electroless deposition, chemistry.chemical_element, Wafer, Electroplating, Layer (electronics), Copper, Characterization (materials science)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::350ae13c769dd66576bc1426932d2dbb
https://doi.org/10.1109/iitc.2001.930007

المؤلفون: G. Dixit, J. Chen, V. Rana, A. Wang, Kapila Wijekoon, R. Cheung, Suketu A. Parikh, J. Educato, B. Zheng

المصدر: Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

مصطلحات موضوعية: Materials science, Passivation, chemistry, Annealing (metallurgy), Chemical-mechanical planarization, Metallurgy, Copper interconnect, chemistry.chemical_element, Electroplating, Electromigration, Copper, Grain size

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4b021bf251f088dc21b9e126eb76f369
https://doi.org/10.1109/iitc.2001.930054