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1Academic Journal
المصدر: Mechanika., Kaunas : KTU, 2022, vol. 28, no. 6, p. 439-446. ; ISSN 1392-1207 ; eISSN 2029-6983
مصطلحات موضوعية: heat and moisture transfer, temperature, relative humidity, electronics enclosures, thermal resistance
وصف الملف: application/pdf
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2Academic Journal
المصدر: Mechanika., Kaunas : KTU, 2022, vol. 28, no. 5, p. 369-377. ; ISSN 1392-1207 ; eISSN 2029-6983
مصطلحات موضوعية: absorption and desorption, temperature, diffusion, electronics enclosures, heat and moisture transport, RC approach, solubility
وصف الملف: application/pdf
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3Academic Journal
المؤلفون: Conseil, Helene, Staliulionis, Zygimantas, Jellesen, Morten Stendahl, Jabbaribehnam, Mirmasoud, Hattel, Jesper Henri, Ambat, Rajan
المصدر: Conseil , H , Staliulionis , Z , Jellesen , M S , Jabbaribehnam , M , Hattel , J H & Ambat , R 2017 , ' Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions ' , I E E E Transactions on Components, Packaging and Manufacturing Technology , vol. 7 , no. 3 , pp. 412 - 423 . https://doi.org/10.1109/TCPMT.2017.2655447
وصف الملف: application/pdf
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4Academic Journal
المصدر: Staliulionis , Z , Mohanty , S , Hattel , J H & Miliauskas , G 2022 , Numerical Modelling of Humidity Behaviour in the Electronics Housing . in Proceedings of the 26th International Conference Electronics . IEEE , 26th International Conference Electronics , Palanga , Lithuania , 13/06/2022 . https://doi.org/10.1109/IEEECONF55059.2022.9810469
مصطلحات موضوعية: Humidity, Heat and mass transfer, RC approach, Electronics enclosures, Diffusion, Absorption and desorption
Relation: https://orbit.dtu.dk/en/publications/da09bcc4-ca6e-41ee-976f-fe4cfb8242cc; urn:ISBN:978-1-6654-8321-6
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5Academic Journal
المصدر: Staliulionis , Z , Jabbaribehnam , M & Hattel , J H 2016 , ' Moisture ingress into electronics enclosures under isothermal conditions ' , A I P Conference Proceedings Series , vol. 1738 , 030041 . https://doi.org/10.1063/1.4951797
وصف الملف: application/pdf
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6Conference
المصدر: EUROCORR 2018: Applied science with constant awareness, 9-13 September 2018, Krakow, Poland: annual congress of the European Federation of Corrosion, Gdansk : Polish Corrosion Society, 2018, p. 1
مصطلحات موضوعية: semi-empirical models, humidity ingress, electronic enclosures
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7Academic Journal
المؤلفون: Mohanty, Sankhya, Staliulionis, Zygimantas, Nasirabadi, Parizad S., Ambat, Rajan, Hattel, Jesper H.
المصدر: Proceedings of the 2016 IEEE 18th electronics packaging technology conference (EPTC), 30 November - 3 December 2016, Singapore, Piscataway, NJ : IEEE, 2016, p. 483-487 ; ISBN 9781509043705 ; eISBN 9781509043699
مصطلحات موضوعية: electronic enclosure, thermal and moisture management, calibrated models
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8Academic Journal
المؤلفون: Staliulionis, Zygimantas, Joshy, Salil, Ambat, Rajan, Jabbaribehnam, Mirmasoud, Mohanty, Sankhya, Hattel, Jesper Henri
المصدر: Staliulionis , Z , Joshy , S , Ambat , R , Jabbaribehnam , M , Mohanty , S & Hattel , J H 2016 , Analysis of moisture transport between connected enclosures under a forced thermal gradient . in Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC) . IEEE , pp. 320-324 , 18th Electronics Packaging Technology Conference (EPTC) , Singapore , Singapore , 30/11/2016 . https://doi.org/10.1109/EPTC.2016.7861497
Relation: https://orbit.dtu.dk/en/publications/adbed96c-1193-4d76-aded-8f06adfe0b32; urn:ISBN:978-1-5090-4369-9
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9Academic Journal
المصدر: Staliulionis , Z , Jabbaribehnam , M & Hattel , J H 2016 , Mathematical modelling of coupled heat and mass transport into an electronic enclosure . in Proceedings of the 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2016 . IEEE , pp. 323-326 , 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2016 , Budapest , Hungary , 21/09/2016 . https://doi.org/10.1109/THERMINIC.2016.7749076
Relation: https://orbit.dtu.dk/en/publications/a6edc602-0236-4da3-b873-3d29734aeb41; urn:ISBN:978-1-5090-5450-3
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10Academic Journal
المؤلفون: Staliulionis, Zygimantas, Zhang, Zhe, Pittini, Riccardo, Andersen, Michael A. E., Noreika, A., Tarvydas, P.
المصدر: Staliulionis , Z , Zhang , Z , Pittini , R , Andersen , M A E , Noreika , A & Tarvydas , P 2014 , ' Thermal Modeling and Design of On-board DC-DC Power Converter using Finite Element Method ' , Elektronika ir Elektrotechnika . https://doi.org/10.5755/j01.eee
مصطلحات موضوعية: Power electronic converters, Temperature measurement, Thermal modeling, Finite Element Method
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11Academic Journal
المصدر: Pittini , R , Zhang , Z , Staliulionis , Z & Andersen , M A E 2014 , Power Cycling and Thermal Stresses Analysis for High Efficiency DC/DC Converter (IFBBC) in Repetitive Avalanche Conditions . in Proceedings of 18th International Conference ELECTRONICS 2014 . Kaunas University of Technology , pp. 33-38 , 18th International Conference ELECTRONICS 2014 , Kaunas , Lithuania , 16/06/2014 . https://doi.org/10.5755/e01.9786090210819
Relation: https://orbit.dtu.dk/en/publications/ff1223cb-f7b4-4a9d-b7a7-3eca21508f80; urn:ISBN:978-609-02-1065-9
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12Academic Journal
المؤلفون: Staliulionis, Žygimantas
المصدر: Telekomunikacijos ir elektronika - 2012 = Telecommunications and electronics - 2012 : studentų mokslinės konferencijos programa ir pranešimų medžiaga / Kauno technologijos universitetas, Kaunas : Technologija, 2012, p. 103-108 ; ISBN 9786090203040
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13Academic Journal
المؤلفون: Steponėnas, Matas, Staliulionis, Žygimantas, Juška, Vaclovas
المصدر: Telekomunikacijos ir elektronika - 2011 = Telecommunications and electronics - 2011 : studentų mokslinės konferencijos programa ir pranešimų medžiaga / Kauno technologijos universitetas, Kaunas : Technologija, 2011, p. 80-82 ; ISBN 9789955259664
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14Electronic Resource