المؤلفون: Sunwu Xu, Yifei Li, Xinyi Jing, Kyung-Wook Paik, Peng He, Shuye Zhang

المصدر: Journal of Materials Research and Technology, Vol 29, Iss , Pp 2272-2278 (2024)

مصطلحات موضوعية: Sn-Bi-In alloy, Low-melting lead-free solder, Microstructure, Strengthening, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785424003107; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/8b3e6d6731154d6986373a33ed6199bb

المؤلفون: Tianhan Hu, Shun Li, Zhen Li, Guanzhi Wu, Ping Zhu, Wufeng Dong, Yu Sun, Jiayi Zhou, Bingjia Wu, Bingge Zhao, Kai Ding, Yulai Gao

المصدر: Journal of Materials Research and Technology, Vol 26, Iss , Pp 5902-5909 (2023)

مصطلحات موضوعية: Sn–Bi solder alloy, Ag addition, In addition, Mechanical properties, Ag3Sn phase, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785423021233; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/dfc43d9535f044e594db1fc0de0785ac

المؤلفون: Akira Yamauchi, Masashi Kurose

المصدر: Materials; Volume 15; Issue 3; Pages: 884

مصطلحات موضوعية: Sn–Bi-based alloy, superplasticity, tensile property, deformation, low-melting-point solder

وصف الملف: application/pdf

Relation: https://dx.doi.org/10.3390/ma15030884

الاتاحة: https://doi.org/10.3390/ma15030884

المؤلفون: Akira YAMAUCHI, Ayumu HONDA, 山内 啓, 本多 歩

المصدر: The Proceedings of Conference of Kanto Branch. 2022, :15