المؤلفون: Wei Chen, Ye Chen, Yixing Cao, Zhen Cui, Xuejun Fan, Guoqi Zhang, Jiajie Fan

المصدر: Frontiers in Materials, Vol 9 (2022)

مصطلحات موضوعية: LED packaging, silicone encapsulant, sulfur-rich, humidity, degradation mechanism, molecular dynamics, Technology

وصف الملف: electronic resource

Relation: https://www.frontiersin.org/articles/10.3389/fmats.2022.819294/full; https://doaj.org/toc/2296-8016

URL الوصول: https://doaj.org/article/290343bd290340bca27227f36727e66a

المؤلفون: Jiajie Fan, Ye Chen, Zhou Jing, Mesfin Seid Ibrahim, Miao Cai

المصدر: Polymer Testing, Vol 96, Iss , Pp 107090- (2021)

مصطلحات موضوعية: LED packaging, Silicone encapsulant, Lumen decay, Color shift, Gamma process, Polymers and polymer manufacture, TP1080-1185

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S0142941821000404; https://doaj.org/toc/0142-9418

URL الوصول: https://doaj.org/article/c9e936cba5b540f6a67865ea9dc10c16

المؤلفون: Mesfin Seid Ibrahim, Zhou Jing, Ye Chen, Miao Cai, Jiajie Fan

المصدر: Polymer Testing, Vol 96, Iss, Pp 107090-(2021)

مصطلحات موضوعية: Materials science, Polymers and Plastics, Gamma process, 02 engineering and technology, 010402 general chemistry, 01 natural sciences, chemistry.chemical_compound, Silicone, Thermal, Transmittance, Thermal stability, Composite material, Lumen decay, Moisture, Organic Chemistry, Humidity, 021001 nanoscience & nanotechnology, Color shift, 0104 chemical sciences, lcsh:TP1080-1185, chemistry, lcsh:Polymers and polymer manufacture, Degradation (geology), LED packaging, 0210 nano-technology, Silicone encapsulant

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::85e8a7ba969321c38840b27b21134454
http://www.sciencedirect.com/science/article/pii/S0142941821000404

المؤلفون: Zou, Sam H.Y., Tao, Mian, Lo, Chi Chuen, Lee, Shi-Wei Ricky

مصطلحات موضوعية: LED packaging, Silicone encapsulant, Adhesion strength, Reliability

Relation: http://repository.ust.hk/ir/Record/1783.1-61152; Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, 2013, article number 6756676, p. 1212-1216; https://doi.org/10.1109/ICEPT.2013.6756676; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2013&rft.spage=1212&rft.aulast=Zou&rft.aufirst=S.H.Y.&rft.atitle=Experimental+characterization+of+adhesion+strength+between+the+silicone+encapsulant+and+the+bottom+of+a+SMD+LED+leadframe+cup&rft.title=Proceedings+-+2013+14th+International+Conference+on+Electronic+Packaging+Technology,+ICEPT+2013; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000349907100269; http://www.scopus.com/record/display.url?eid=2-s2.0-84898048687&origin=inward

الاتاحة: http://repository.ust.hk/ir/Record/1783.1-61152
https://doi.org/10.1109/ICEPT.2013.6756676
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2013&rft.spage=1212&rft.aulast=Zou&rft.aufirst=S.H.Y.&rft.atitle=Experimental+characterization+of+adhesion+strength+between+the+silicone+encapsulant+and+the+bottom+of+a+SMD+LED+leadframe+cup&rft.title=Proceedings+-+2013+14th+International+Conference+on+Electronic+Packaging+Technology,+ICEPT+2013
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000349907100269
http://www.scopus.com/record/display.url?eid=2-s2.0-84898048687&origin=inward

المؤلفون: Chen, Wei (author), Chen, Ye (author), Cao, Yixing (author), Cui, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)

مصطلحات الفهرس: degradation mechanism, humidity, LED packaging, molecular dynamics, silicone encapsulant, sulfur-rich, journal article

URL: http://resolver.tudelft.nl/uuid:bf5aad15-88f5-42ab-8afb-943de92362a7
http://www.scopus.com/inward/record.url?scp=85126703484&partnerID=8YFLogxK
http://www.scopus.com/inward/record.url?scp=85126703484&partnerID=8YFLogxK
Frontiers in Materials--2296-8016--45802af3-c188-4a41-928f-80114acafe98