المؤلفون: Tatsushiro Hirata, Shunichi Shibuki, Kyoko Izuha, Takashi Sakairi

المصدر: Proceedings of International Conference on Planarization/CMP Technology 2014.

مصطلحات موضوعية: Engineering, business.industry, Compatibility (mechanics), Process integration, Polishing, Wafer, Semiconductor device, Graphics, Process engineering, business, Finite element method, Planarity testing, Manufacturing engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4fe31beb0fdeaf617bc3b0e1c4036904
https://doi.org/10.1109/icpt.2014.7017238

المؤلفون: Noritsugu Takeshita, Jeff Wilson, Takashi Sakairi, Osama Hatem, Ruben Ghulghazaryan, M. Bora, Shunichi Shibuki, Norbert Strecker, Kyoko Izuha

المصدر: SPIE Proceedings.

مصطلحات موضوعية: Materials science, Process modeling, Robustness (computer science), Chemical-mechanical planarization, Design flow, Copper plating, Static timing analysis, Polishing, Chip, Simulation

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::85a2b175a2ee5ca5046621f76897736c
https://doi.org/10.1117/12.845653

المؤلفون: Tatsushiro Hirata, R. Furui, Y. Negoro, S. Arakawa, Takashi Sakairi, K. Hasegawa, H. Nishimura, Shunichi Shibuki, M. Fujii, T. Okamoto

المصدر: 2006 International Interconnect Technology Conference.

مصطلحات موضوعية: Permittivity, Materials science, chemistry, Chemical-mechanical planarization, Delamination, Polishing, chemistry.chemical_element, Adhesion, Dielectric, Composite material, Edge (geometry), Copper

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3ea0d0bc74ef8edc479e9e71d18addf0
https://doi.org/10.1109/iitc.2006.1648666

المؤلفون: Shinji Tawara, Naoki Toge, Takaaki Kozuki, Yuichi Yamamoto, Yasuaki Inoue, Shunichi Shibuki, Keiichi Maeda

المصدر: MRS Proceedings. 867

مصطلحات موضوعية: Materials science, Chemical-mechanical planarization, Metallurgy, Slurry, Conditioning, Conditioning process, Planarity testing

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::03cf9fbbeb714d6f11c04540f2b03f35
https://doi.org/10.1557/proc-867-w3.5