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1
المؤلفون: Jia-Qiang Huang, Shui-Bao Liang, Cheng Wei, Min-Bo Zhou, Xin-Ping Zhang, Chang-Bo Ke
المصدر: Journal of Materials Research. 34:2775-2788
مصطلحات موضوعية: Materials science, Mechanical Engineering, Current crowding, Condensed Matter Physics, Electromigration, Stress (mechanics), Mechanics of Materials, Phase (matter), von Mises yield criterion, General Materials Science, Composite material, Electric current, Current density, Flip chip
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2
المؤلفون: Shui-Bao Liang, Chang-Bo Ke, Min-Bo Zhou, Chaohai Wei, X. P. Zhang
المصدر: IEEE Transactions on Device and Materials Reliability. 19:322-332
مصطلحات موضوعية: 010302 applied physics, Materials science, Silicon, chemistry.chemical_element, Plasticity, Microstructure, 01 natural sciences, Grain size, Electronic, Optical and Magnetic Materials, Stress (mechanics), chemistry, 0103 physical sciences, von Mises yield criterion, Electrical and Electronic Engineering, Deformation (engineering), Composite material, Safety, Risk, Reliability and Quality, Anisotropy
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3
المؤلفون: Changqing Liu, Li Zhang, Zhaoxia Zhou, Shui-Bao Liang, Xiaoxiao Han
المصدر: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
مصطلحات موضوعية: Temperature sensitivity, Materials science, 020209 energy, 020208 electrical & electronic engineering, 02 engineering and technology, Thermal management of electronic devices and systems, Thermal energy storage, Finite element method, Reliability (semiconductor), Power electronics, Heat transfer, 0202 electrical engineering, electronic engineering, information engineering, Composite material, Thermal analysis
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4
المؤلفون: Changqing Liu, Allan Liu, Yi Zhong, Zhaoxia Zhou, Stuart Robertson, Shui-Bao Liang
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Exothermic reaction, Work (thermodynamics), Materials science, 010401 analytical chemistry, 02 engineering and technology, Thermal transfer, 021001 nanoscience & nanotechnology, 01 natural sciences, 0104 chemical sciences, Phase (matter), Soldering, Thermal, Heat transfer, Coupling (piping), Composite material, 0210 nano-technology
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5
المؤلفون: Shui-Bao Liang, Canyu Liu, Yi Zhong, Stuart Robertson, Zhaoxia Zhou, Allan Liu, Changqing Liu
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Exothermic reaction, Materials science, NanoFoil, Stacking, 02 engineering and technology, 010402 general chemistry, 021001 nanoscience & nanotechnology, 01 natural sciences, Thermal expansion, 0104 chemical sciences, Reactive bonding, Reflow soldering, Soldering, Power electronics, Composite material, 0210 nano-technology
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6
المؤلفون: Shui-Bao Liang, Min-Bo Zhou, Jinhao Huang, X.P. Zhang, Chang-Bo Ke
المصدر: Microelectronics Reliability. 92:1-11
مصطلحات موضوعية: 010302 applied physics, Materials science, 020208 electrical & electronic engineering, 02 engineering and technology, Condensed Matter Physics, Microstructure, 01 natural sciences, Atomic and Molecular Physics, and Optics, Isothermal process, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Temperature gradient, Thermal conductivity, Heat flux, Phase (matter), 0103 physical sciences, Heat transfer, 0202 electrical engineering, electronic engineering, information engineering, Electrical and Electronic Engineering, Composite material, Safety, Risk, Reliability and Quality, Eutectic system
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7
المؤلفون: Zhaoxia Zhou, Changqing Liu, Han Jiang, Shui-Bao Liang, Liguo Zhao, Stuart Robertson
المصدر: Materials Letters. 307:131074
مصطلحات موضوعية: Materials science, Nanocomposite, Mechanical Engineering, Intermetallic, chemistry.chemical_element, Three-dimensional integrated circuit, Integrated circuit, Condensed Matter Physics, Microstructure, Copper, law.invention, chemistry, Mechanics of Materials, law, General Materials Science, Composite material, Joint (geology), Layer (electronics)
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8
المؤلفون: M. B. Zhou, Jinhao Huang, Shui-Bao Liang, X.P. Zhang
المصدر: Journal of Materials Science: Materials in Electronics. 29:7651-7660
مصطلحات موضوعية: 010302 applied physics, Interconnection, Materials science, Intermetallic, 02 engineering and technology, 021001 nanoscience & nanotechnology, Condensed Matter Physics, Microstructure, 01 natural sciences, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials, Premelting, Ball grid array, Soldering, 0103 physical sciences, Ball (bearing), Melting point, Electrical and Electronic Engineering, Composite material, 0210 nano-technology
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9
المؤلفون: Cheng Wei, Shui-Bao Liang, Chang-Bo Ke
المصدر: Materials Letters. 303:130517
مصطلحات موضوعية: Work (thermodynamics), Materials science, Condensed matter physics, Field (physics), Mechanical Engineering, Condensed Matter Physics, Temperature gradient, Thermal conductivity, Heat flux, Mechanics of Materials, Phase (matter), General Materials Science, Grain boundary, Anisotropy
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10
المؤلفون: Chang-Bo Ke, Shui-Bao Liang, Cheng Wei, Anil Kunwar
المصدر: Scripta Materialia. 203:114071
مصطلحات موضوعية: 010302 applied physics, Phase boundary, Materials science, Condensed matter physics, Mechanical Engineering, Metals and Alloys, Intermetallic, 02 engineering and technology, 021001 nanoscience & nanotechnology, Condensed Matter Physics, 01 natural sciences, Electromigration, Grain growth, Mechanics of Materials, Electrical resistivity and conductivity, Phase (matter), 0103 physical sciences, General Materials Science, Grain boundary, Electric current, 0210 nano-technology
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11
المؤلفون: Shui-Bao Liang, Xin-Ping Zhang, Wen-Jing Ma, Min-Bo Zhou, Chang-Bo Ke
المصدر: Microelectronics Reliability. 71:71-81
مصطلحات موضوعية: 010302 applied physics, Coalescence (physics), Surface diffusion, Materials science, Open-circuit voltage, 02 engineering and technology, Mechanics, 021001 nanoscience & nanotechnology, Condensed Matter Physics, 01 natural sciences, Atomic and Molecular Physics, and Optics, Surface energy, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Electric field, Soldering, 0103 physical sciences, Forensic engineering, Solder interconnect, Electrical and Electronic Engineering, 0210 nano-technology, Safety, Risk, Reliability and Quality, Voltage
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12
المؤلفون: Wen-jing Ma, Shui-Bao Liang, Min-Bo Zhou, Chang-bo Ke, Xin-Ping Zhang
المصدر: Transactions of Nonferrous Metals Society of China. 27:599-607
مصطلحات موضوعية: 010302 applied physics, Coalescence (physics), Materials science, Phase field crystal, Kirkendall effect, Growth kinetics, Metallurgy, Binary alloy, Metals and Alloys, Nucleation, 02 engineering and technology, Strain rate, 021001 nanoscience & nanotechnology, Geotechnical Engineering and Engineering Geology, Condensed Matter Physics, 01 natural sciences, 0103 physical sciences, Materials Chemistry, Exponent, Composite material, 0210 nano-technology
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13
المؤلفون: Chang-Bo Ke, Wen-Kai Le, Xiao Ma, Jie-Ying Zhou, Xin-Ping Zhang, Cheng Wei, Min-Bo Zhou, Shui-Bao Liang
المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Interconnection, Materials science, 02 engineering and technology, High Bandwidth Memory, 021001 nanoscience & nanotechnology, 01 natural sciences, Finite element method, Stress (mechanics), Stack (abstract data type), 0103 physical sciences, Volume fraction, von Mises yield criterion, Composite material, 0210 nano-technology, Joint (geology)
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14
المؤلفون: Changqing Liu, Cheng Wei, Shui-Bao Liang, Xin-Ping Zhang, Chang-Bo Ke
المصدر: 2018 7th Electronic System-Integration Technology Conference (ESTC).
مصطلحات موضوعية: Materials science, Soldering, Elastic energy, von Mises yield criterion, Temperature cycling, Composite material, Deformation (engineering), Microstructure, Anisotropy, Thermal expansion
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15
المؤلفون: Xin-Ping Zhang, Chang-Bo Ke, Shui-Bao Liang, Cheng Wei, Min-Bo Zhou
المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT).
مصطلحات موضوعية: 010302 applied physics, Materials science, 020502 materials, Diffusion, 02 engineering and technology, Microstructure, 01 natural sciences, Electromigration, Anode, Temperature gradient, 0205 materials engineering, Soldering, Phase (matter), 0103 physical sciences, Composite material, Electric current
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16
المؤلفون: Jie-Ying Zhou, Shui-Bao Liang, Cheng Wei, Han Jiang, Xin-Ping Zhang, Xiao Ma
المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT).
مصطلحات موضوعية: 010302 applied physics, Thermal fatigue, Materials science, 02 engineering and technology, Temperature cycling, 021001 nanoscience & nanotechnology, 01 natural sciences, Finite element method, Finite element simulation, Strain energy, Three dimensional simulation, 0103 physical sciences, Structured model, Composite material, 0210 nano-technology
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17
المؤلفون: Min-Bo Zhou, Chang-Bo Ke, Cheng Wei, Shui-Bao Liang, Xin-Ping Zhang
المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Materials science, Silicon, Through-silicon via, Delamination, Monte Carlo method, chemistry.chemical_element, 02 engineering and technology, 021001 nanoscience & nanotechnology, Microstructure, 01 natural sciences, Finite element method, Stress (mechanics), Cohesive zone model, chemistry, 0103 physical sciences, Composite material, 0210 nano-technology
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18
المؤلفون: Shui-Bao Liang, Cheng Wei, Min-Bo Zhou, Xin-Ping Zhang, Chang-Bo Ke
المصدر: 2017 18th International Conference on Electronic Packaging Technology (ICEPT).
مصطلحات موضوعية: Materials science, Silicon, 020208 electrical & electronic engineering, Monte Carlo method, Metallurgy, chemistry.chemical_element, Young's modulus, 02 engineering and technology, 021001 nanoscience & nanotechnology, Microstructure, Copper, Finite element method, Thermal expansion, symbols.namesake, Grain growth, chemistry, 0202 electrical engineering, electronic engineering, information engineering, symbols, 0210 nano-technology
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19
المؤلفون: Shui-Bao Liang, Xin-Ping Zhang, Chang-Bo Ke, Min-Bo Zhou
المصدر: 2017 18th International Conference on Electronic Packaging Technology (ICEPT).
مصطلحات موضوعية: Materials science, Physics::Instrumentation and Detectors, business.industry, 020208 electrical & electronic engineering, 02 engineering and technology, Structural engineering, 021001 nanoscience & nanotechnology, Electromigration, Computer Science::Other, Stress field, Stress (mechanics), Soldering, Void (composites), 0202 electrical engineering, electronic engineering, information engineering, Electric current, Composite material, 0210 nano-technology, business, Flip chip, Voltage
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20
المؤلفون: Shui-Bao Liang, Chang-Bo Ke, Bin Li, null Han-Jiang, Min-Bo Zhou, Xin-Ping Zhang
المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Fabrication, Materials science, Through-silicon via, Silicon, Annealing (metallurgy), 020208 electrical & electronic engineering, Metallurgy, chemistry.chemical_element, 02 engineering and technology, 021001 nanoscience & nanotechnology, Thermal expansion, Finite element method, Grain growth, chemistry, 0202 electrical engineering, electronic engineering, information engineering, Miniaturization, Composite material, 0210 nano-technology