المؤلفون: Antonini, Giulio, Ekman, Jonas, Scogna, Antonio Ciccomancini, Ruehli, Albert E.

المصدر: IEEE International Symposium on Electromagnetic Compatibility. :810-813

مصطلحات موضوعية: Industriell elektronik, Industrial Electronics

وصف الملف: electronic

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:ltu:diva-30574
https://ltu.diva-portal.org/smash/get/diva2:1003802/FULLTEXT01.pdf

المؤلفون: Ferranti, Francesco, Antonini, Giulio, Dhaene, Tom, Knockaert, Luc, Scogna, Antonio Ciccomancini

المصدر: 2011 IEEE International symposium on electromagnetic compatibility (EMC 2011) ; ISBN: 9781457708121

مصطلحات موضوعية: Technology and Engineering, IBCN, APPROXIMATION, PASSIVITY

وصف الملف: application/pdf

Relation: https://biblio.ugent.be/publication/1965684; http://hdl.handle.net/1854/LU-1965684; http://doi.org/10.1109/ISEMC.2011.6038301; https://biblio.ugent.be/publication/1965684/file/2952122

الاتاحة: https://biblio.ugent.be/publication/1965684
http://hdl.handle.net/1854/LU-1965684
https://doi.org/10.1109/ISEMC.2011.6038301
https://biblio.ugent.be/publication/1965684/file/2952122

المؤلفون: Ferranti, Francesco, Dhaene, Tom, Knockaert, Luc, Antonini, Giulio, Ciccomancini Scogna, Antonio Ciccomancini

المصدر: INTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERING ; ISSN: 1096-4290

مصطلحات موضوعية: Technology and Engineering, parametric macromodeling, APPROXIMATION, rational approximation, interpolation, design optimization, complex systems

وصف الملف: application/pdf

Relation: https://biblio.ugent.be/publication/2010718; http://hdl.handle.net/1854/LU-2010718; http://dx.doi.org/10.1002/mmce.20580; https://biblio.ugent.be/publication/2010718/file/2010760

الاتاحة: https://biblio.ugent.be/publication/2010718
http://hdl.handle.net/1854/LU-2010718
https://doi.org/10.1002/mmce.20580
https://biblio.ugent.be/publication/2010718/file/2010760

المؤلفون: WU, Tzong-Lin, FAN, Jun, PAULIS, Francesco de, WANG, Chuen-De, SCOGNA, Antonio Ciccomancini, ORLANDI, Antonio

المصدر: IEICE Transactions on Communications ; volume E93-B, issue 7, page 1678-1689 ; ISSN 0916-8516 1745-1345

الاتاحة: http://dx.doi.org/10.1587/transcom.e93.b.1678
http://www.jstage.jst.go.jp/article/transcom/E93.B/7/E93.B_7_1678/_pdf

المؤلفون: Srivastava, Nitin, Scogna, Antonio Ciccomancini, Shim, Hwanwoo, Baek, Albert, Lee, YongHyock, Kim, Dong Sub

المصدر: 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) ; volume 6, page 206-208

الاتاحة: http://dx.doi.org/10.1109/apemc.2017.7975463
http://xplorestaging.ieee.org/ielx7/7961935/7975403/07975463.pdf?arnumber=7975463

المؤلفون: Kim, Kiyeong, Shim, Hwan-Woo, Scogna, Antonio Ciccomancini, Hwang, Chulsoon

المصدر: Electrical and Computer Engineering Faculty Research & Creative Works

مصطلحات موضوعية: Mobile platform, RF interference (RFI), Ringing noise, Switched-mode power supply (SMPS), Electrical and Computer Engineering

Relation: https://scholarsmine.mst.edu/ele_comeng_facwork/3611; https://doi.org/10.1109/TCPMT.2018.2799330

الاتاحة: https://scholarsmine.mst.edu/ele_comeng_facwork/3611
https://doi.org/10.1109/TCPMT.2018.2799330

المؤلفون: Scogna, Antonio Ciccomancini, Kostka, Darryl, Troescher, Matthias, Steinhardt, Alexander, Trieb, Robert, Heinig, Andy, Henkel, Andreas

المصدر: 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) ; page 418-424

الاتاحة: http://dx.doi.org/10.1109/isemc.2016.7571684
http://xplorestaging.ieee.org/ielx7/7565235/7571555/07571684.pdf?arnumber=7571684

المؤلفون: Scogna, Antonio Ciccomancini, Teoh, LianKheng

المصدر: 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) ; page 1-4

الاتاحة: http://dx.doi.org/10.1109/sapiw.2016.7496273
http://xplorestaging.ieee.org/ielx7/7491916/7496230/07496273.pdf?arnumber=7496273

المؤلفون: Teoh, LianKheng, Chiang, ChunTong, Scogna, Antonio Ciccomancini, Khrone, Klaus, Lee, HsuenYen

المصدر: 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ; page 33-36

الاتاحة: http://dx.doi.org/10.1109/edaps.2014.7030808
http://xplorestaging.ieee.org/ielx7/7018205/7030792/07030808.pdf?arnumber=7030808

المؤلفون: Scogna, Antonio Ciccomancini, Zhang, Jianmin, Teoh, LianKheng

المصدر: 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ; volume 1, page 69-72

الاتاحة: http://dx.doi.org/10.1109/edaps.2012.6469386
http://xplorestaging.ieee.org/ielx7/6462538/6469379/06469386.pdf?arnumber=6469386

المؤلفون: Kostka, Darryl, Scogna, Antonio Ciccomancini, Paglia, Frank, Mutnury, Bhyrav

المصدر: 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems ; page 73-76

الاتاحة: http://dx.doi.org/10.1109/epeps.2011.6100190
http://xplorestaging.ieee.org/ielx5/6088024/6100155/06100190.pdf?arnumber=6100190

المؤلفون: Mutnury, Bhyrav, Paglia, Frank, Wang, Minchuan, Singh, Girish K., Scogna, Antonio Ciccomancini

المصدر: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) ; page 183-189

الاتاحة: http://dx.doi.org/10.1109/ectc.2011.5898511
http://xplorestaging.ieee.org/ielx5/5871442/5898472/05898511.pdf?arnumber=5898511

المؤلفون: Koledintseva, Marina, Vincent, Tracey, Scogna, Antonio Ciccomancini, Hinaga, Scott

المصدر: Electrical and Computer Engineering Faculty Research & Creative Works

مصطلحات موضوعية: Dielectric measurements, numerical analysis, printed circuit fabrication, rough surfaces, stripline, Electrical and Computer Engineering

وصف الملف: application/pdf

Relation: https://scholarsmine.mst.edu/ele_comeng_facwork/5113; https://scholarsmine.mst.edu/context/ele_comeng_facwork/article/6142/viewcontent/Method_of_Effective_Roughness_Dielectric_in_a_PCB_Measurement_and_Full_Wave_Simulation_Verificat.pdf

الاتاحة: https://scholarsmine.mst.edu/ele_comeng_facwork/5113
https://doi.org/10.1109/TEMC.2015.2412113
https://scholarsmine.mst.edu/context/ele_comeng_facwork/article/6142/viewcontent/Method_of_Effective_Roughness_Dielectric_in_a_PCB_Measurement_and_Full_Wave_Simulation_Verificat.pdf

المؤلفون: SCOGNA, Antonio Ciccomancini, ORLANDI, Antonio

المصدر: Volume: 17, Issue: 3 279-288
Turkish Journal of Electrical Engineering and Computer Science

مصطلحات موضوعية: Turk. J. Elec. Eng. & Comp. Sci.,17,(2009),279-288. Full text: pdf Other articles published in the same issue: Turk. J. Elec. Eng. & Comp. Sci.,vol.17,iss.3

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=tubitakulakb::20e55ace6e3ba4f59785ab8d2bb159bf
https://dergipark.org.tr/tr/pub/tbtkelektrik/issue/12078/144420

المؤلفون: Wang, Chuen-De, Yu, Yi-Min, de Paulis, Francesco, Scogna, Antonio Ciccomancini, Orlandi, Antonio, Chiou, Yih-Peng, Wu, Tzong-Lin

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology ; volume 2, issue 2, page 332-341 ; ISSN 2156-3950 2156-3985

الاتاحة: http://dx.doi.org/10.1109/tcpmt.2011.2176339
http://xplorestaging.ieee.org/ielx5/5503870/6142639/06111213.pdf?arnumber=6111213

المؤلفون: Zhang, Jianmin, Chen, Qinghua B., Qiu, Kelvin, Scogna, Antonio Ciccomancini, Schauer, Martin, Romo, Gerardo, Drewniak, James L., Orlandi, Antonio

المصدر: Electrical and Computer Engineering Faculty Research & Creative Works

مصطلحات موضوعية: Chip-to-Chip Communications, Design And Modeling, Design Rules, FR4 Substrates, High-Speed Channels, Low Loss, Micro-Probes, New Technologies, S-Parameters, Substrate Material, Time Domain, Design, Electromagnetic Compatibility, Electromagnetism, Electronic Equipment Manufacture, Printed Circuit Design, Scattering Parameters, Printed Circuit Boards, Electrical and Computer Engineering

Relation: https://scholarsmine.mst.edu/ele_comeng_facwork/2724; https://doi.org/10.1109/ISEMC.2010.5711320

الاتاحة: https://scholarsmine.mst.edu/ele_comeng_facwork/2724
https://doi.org/10.1109/ISEMC.2010.5711320

المؤلفون: SCOGNA, Antonio Ciccomancini, ORLANDI, Antonio

المصدر: Volume: 17, Issue: 3 279-288 ; 1300-0632 ; 1303-6203 ; Turkish Journal of Electrical Engineering and Computer Science

مصطلحات موضوعية: Turk. J. Elec. Eng. & Comp. Sci.,17,(2009),279-288. Full text: pdf Other articles published in the same issue: Turk. J. Elec. Eng. & Comp. Sci.,vol.17,iss.3.

وصف الملف: application/pdf

Relation: https://dergipark.org.tr/tr/download/article-file/125843; https://dergipark.org.tr/tr/pub/tbtkelektrik/issue/12078/144420

الاتاحة: https://dergipark.org.tr/tr/pub/tbtkelektrik/issue/12078/144420

المؤلفون: Antonini, Giulio, Scogna, Antonio Ciccomancini, Orlandi, Antonio, Ricchiuti, Vittorio, Selli, Giuseppe, Luan, Shaofeng, Drewniak, James L.

المصدر: Electrical and Computer Engineering Faculty Research & Creative Works

مصطلحات موضوعية: Computer Simulation, Frequency Domain Analysis, Printed Circuit Boards, Scattering Parameters, Time Domain Analysis, Equivalent Circuit Extraction, Eye-Pattern, Pseudo-Random Bit Sequence, SPICE, TDR, Transient Analysis, Networks (Circuits), Electrical and Computer Engineering

وصف الملف: application/pdf

Relation: https://scholarsmine.mst.edu/ele_comeng_facwork/1934; https://scholarsmine.mst.edu/context/ele_comeng_facwork/article/2933/viewcontent/Validation_of_Circuit_Extraction_Procedure_by_Means_of_Frequency.pdf

الاتاحة: https://scholarsmine.mst.edu/ele_comeng_facwork/1934
https://doi.org/10.1109/ISEMC.2005.1513469
https://scholarsmine.mst.edu/context/ele_comeng_facwork/article/2933/viewcontent/Validation_of_Circuit_Extraction_Procedure_by_Means_of_Frequency.pdf

المؤلفون: Luan, Shaofeng, Selli, Giuseppe, Drewniak, James L., de Luca, Andrea, Antonini, Giulio, Orlandi, Antonio, Scogna, Antonio Ciccomancini, Fan, Jun, Knighten, James L., Smith, Norman W., Alexander, Ray

المصدر: Electrical and Computer Engineering Faculty Research & Creative Works

مصطلحات موضوعية: PCB, SPICE, SPICE Via Model, Circuit Simulation, Differential Signaling, Digital Circuit System Designs, Full-Wave Modeling, High-Speed Digital Designs, Printed Circuit Boards, Printed Circuit Design, Signal Integrity, Via Transitions, Via Transition, Bit Error Rate, Capacitance, Data Transfer, Dielectric Materials, Inductance, Interfaces (Computer), Signal Processing, Electrical and Computer Engineering

وصف الملف: application/pdf

Relation: https://scholarsmine.mst.edu/ele_comeng_facwork/1619; https://scholarsmine.mst.edu/context/ele_comeng_facwork/article/2618/viewcontent/Extraction_of_a_SPICE_Via_Model_from_Full_wave_Modeling_for_Diffe.pdf

الاتاحة: https://scholarsmine.mst.edu/ele_comeng_facwork/1619
https://doi.org/10.1109/ISEMC.2004.1349862
https://scholarsmine.mst.edu/context/ele_comeng_facwork/article/2618/viewcontent/Extraction_of_a_SPICE_Via_Model_from_Full_wave_Modeling_for_Diffe.pdf

المؤلفون: Koledintseva, Marina Y., Vincent, Tracey, Scogna, Antonio Ciccomancini, Hinaga, Scott

المصدر: IEEE Transactions on Electromagnetic Compatibility; Aug2015, Vol. 57 Issue 4, p807-814, 8p

مصطلحات موضوعية: SURFACE roughness, COPPER foil, EXTRAPOLATION, DIELECTRIC measurements, SIMULATION methods & models, PRINTED circuit design