المؤلفون: Schletz, Andreas

وصف الملف: application/pdf

Relation: Cluster-Schulung "Anwendertraining zur Wide-Bandgap Systemintegration"; https://publica.fraunhofer.de/handle/publica/430400; https://doi.org/10.24406/publica-679

الاتاحة: https://publica.fraunhofer.de/handle/publica/430400
https://doi.org/10.24406/publica-679

المؤلفون: Schletz, Andreas, Endruschat, Achim, Heckel, Thomas

وصف الملف: application/pdf

Relation: Tutorial "Wide-Bandgap User Training" 2022; https://publica.fraunhofer.de/handle/publica/430402; https://doi.org/10.24406/publica-680

الاتاحة: https://publica.fraunhofer.de/handle/publica/430402
https://doi.org/10.24406/publica-680

المؤلفون: Schletz, Andreas, Bayer, Christoph, Hutzler, Aaron

وصف الملف: application/pdf

Relation: Cluster-Schulung "Anwendertraining zur Wide-Bandgap Systemintegration"; https://publica.fraunhofer.de/handle/publica/430403; https://doi.org/10.24406/publica-681

الاتاحة: https://publica.fraunhofer.de/handle/publica/430403
https://doi.org/10.24406/publica-681

المؤلفون: Breuer, Jakob, Dresel, Fabian, Schletz, Andreas, Leib, Jμrgen, Eckardt, Bernd, März, Martin

المصدر: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) ; page 1-6

الاتاحة: http://dx.doi.org/10.1109/estc60143.2024.10712017
http://xplorestaging.ieee.org/ielx8/10711924/10711994/10712017.pdf?arnumber=10712017

المؤلفون: Ziesche, Steffen, Reinhardt, Kathrin, Varghese, Jobin, Manhica, Birgit, Schletz, Andreas

مصطلحات موضوعية: power electronics, embedding, SiC, LTCC, ULTCC, Multilayer Ceramics

Relation: European Microelectronics & Packaging Conference 2023; #PLACEHOLDER_PARENT_METADATA_VALUE#; 24th European Microelectronics & Packaging Conference (EMPC 2023); https://publica.fraunhofer.de/handle/publica/464130

الاتاحة: https://publica.fraunhofer.de/handle/publica/464130
https://doi.org/10.23919/EMPC55870.2023.10418439

المؤلفون: Du, He, Letz, Sebastian, Baker, Nick, Goetz, Thomas, Iannuzzo, Francesco, Schletz, Andreas

المصدر: Du , H , Letz , S , Baker , N , Goetz , T , Iannuzzo , F & Schletz , A 2020 , ' Effect of short-circuit degradation on the remaining useful lifetime of SiC MOSFETs and its failure analysis ' , Microelectronics Reliability , vol. 114 , 113784 , pp. 1-5 . https://doi.org/10.1016/j.microrel.2020.113784

مصطلحات موضوعية: Silicon Carbide (SiC), Power MOSFET, Degradation, Short-Circuit, Failure Analysis

وصف الملف: application/pdf

الاتاحة: https://vbn.aau.dk/da/publications/7725a3d2-4197-4177-a04b-085a04bce8b7
https://doi.org/10.1016/j.microrel.2020.113784
https://vbn.aau.dk/ws/files/408869499/HDU_MR2020.pdf
http://www.scopus.com/inward/record.url?scp=85096357518&partnerID=8YFLogxK

المؤلفون: Zhao, Dawei, Letz, Sebastian, Leib, Jürgen, Schletz, Andreas

مصطلحات موضوعية: bond wire lift-off, chip stress, FE-modelling, Lifetime, Power cycling capability, solder fatigue, Thinning SiC chip, variation of thickness

Relation: Microelectronics reliability; https://publica.fraunhofer.de/handle/publica/452466

الاتاحة: https://publica.fraunhofer.de/handle/publica/452466
https://doi.org/10.1016/j.microrel.2023.115091

المؤلفون: Müller, Jonas, Letz, Sebastian A., Flaviu-Bogdan, Simon, Bayer, Christoph F., Schletz, Andreas, Görlich, Jens, Nishimura, Takatoshi

المساهمون: Publica

المصدر: Journal of Microelectronics and Electronic Packaging. 19:18-24

مصطلحات موضوعية: FEM, power electronics packaging, silver sintering, Computer Networks and Communications, printed circuit board, Electrical and Electronic Engineering, die bonding, GaN package, HEMT, nanoscale sintering paste, Numerical analysis, Electronic, Optical and Magnetic Materials

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d3b2024990c780171f4ee808f45c1a54
https://doi.org/10.4071/imaps.1675410

المؤلفون: Lenz, Christian, Ziesche, Steffen, Reinhardt, Kathrin, Körner, Stefan, Schletz, Andreas, Bach, Hoang Linh, Schmidt, Ingo, Simon-Najasek, Michél

مصطلحات موضوعية: LTCC, SiC-semiconductor, embedding, pre-package, power electronics

Relation: Electronics System-Integration Technology Conference 2022; #PLACEHOLDER_PARENT_METADATA_VALUE#; IEEE 9th Electronics System- Integration Technology Conference, ESTC 2022. Conference Proceedings; https://publica.fraunhofer.de/handle/publica/429941

الاتاحة: https://publica.fraunhofer.de/handle/publica/429941
https://doi.org/10.1109/ESTC55720.2022.9939430

المؤلفون: Dresel, Fabian, Leib, Jürgen, Schletz, Andreas, Böttge, Bianca, Klengel, Sandy

Relation: International Conference on Integrated Power Electronics Systems 2022; #PLACEHOLDER_PARENT_METADATA_VALUE#; CIPS 2022, 12th International Conference on Integrated Power Electronics Systems. Proceedings; https://publica.fraunhofer.de/handle/publica/417950

الاتاحة: https://publica.fraunhofer.de/handle/publica/417950

المؤلفون: Dresel, Fabian, Müller, Jonas, Leib, Jürgen, Schletz, Andreas

مصطلحات موضوعية: Intelligent robots, Joining, Power electronics, Printed circuit boards, Reliability, Silver, Soldering, Sintering

Relation: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management 2022; #PLACEHOLDER_PARENT_METADATA_VALUE#; PCIM Europe 2022, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Proceedings; https://publica.fraunhofer.de/handle/publica/418582

الاتاحة: https://publica.fraunhofer.de/handle/publica/418582
https://doi.org/10.30420/565822084

المؤلفون: Bach, Hoang Linh, Huang, Anqi, Teng, Yue, Rauh, Hubert, Schletz, Andreas, Jank, Michael P. M., März, Martin

مصطلحات موضوعية: chip embedding, cost-effective rapid prototyping, High performance packages, high temperature, multilayer DBC, plug-and-play adaption, WBG packaging, DDC::600 Technik, Medizin, angewandte Wissenschaften::600 Technik::600 Technik, Technologie

Relation: Workshop on Wide Bandgap Power Devices & Applications 2022; #PLACEHOLDER_PARENT_METADATA_VALUE#; IEEE 9th Workshop on Wide Bandgap Power Devices & Applications, WiPDA 2022; https://publica.fraunhofer.de/handle/publica/430391

الاتاحة: https://publica.fraunhofer.de/handle/publica/430391
https://doi.org/10.1109/WiPDA56483.2022.9955257

المؤلفون: Yu, Zechun, Tan, Ying Zhao, Bayer, Christoph Friedrich, Rauh, Hubert, Schletz, Andreas, März, Martin, Birlem, Olav

مصطلحات موضوعية: power electronics, die attach, Cu nanowires, Cu-Cu bonding, plastic deformation, porosity, KlettSintering, temperature distribution, films, wires, sintering, reliability, copper, bonding

Time: 670, 620, 530

Relation: Electronics Packaging Technology Conference (EPTC) 2021; IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021; https://publica.fraunhofer.de/handle/publica/417342

الاتاحة: https://publica.fraunhofer.de/handle/publica/417342
https://doi.org/10.1109/EPTC53413.2021.9663890

المؤلفون: Schletz, Andreas

مصطلحات موضوعية: power module, characterizing tests, environmental tests, lifetime tests, power cycle

Time: 670, 620, 530

وصف الملف: application/pdf

Relation: Tutorial "Wide-Bandgap User Training" 2021; https://publica.fraunhofer.de/handle/publica/411243

الاتاحة: https://publica.fraunhofer.de/handle/publica/411243
https://doi.org/10.24406/publica-fhg-411243

المؤلفون: Schletz, Andreas, Endruschat, Achim, Heckel, Thomas

مصطلحات موضوعية: SiC power modules, GaN, power electronics packaging

Time: 670, 620, 530

وصف الملف: application/pdf

Relation: Tutorial "Wide-Bandgap User Training" 2021; https://publica.fraunhofer.de/handle/publica/411241

الاتاحة: https://publica.fraunhofer.de/handle/publica/411241
https://doi.org/10.24406/publica-fhg-411241

المؤلفون: Schletz, Andreas, Bayer, Christoph Friedrich, Hutzler, Aaron

مصطلحات موضوعية: power semiconductors, DC-link capacitor, electrical insulation, die attach, high temperature

Time: 670, 620, 530

وصف الملف: application/pdf

Relation: Tutorial "Wide-Bandgap User Training" 2021; https://publica.fraunhofer.de/handle/publica/411242

الاتاحة: https://publica.fraunhofer.de/handle/publica/411242
https://doi.org/10.24406/publica-fhg-411242

المؤلفون: Yu, Zechun, Xu, Tian, Letz, Sebastian, Bayer, Christoph Friedrich, Schletz, Andreas, März, Martin

مصطلحات موضوعية: Ag-Ag direct bonding, thin-film metallization, void morphology, image segmentation, ImageJ

Time: 670, 620, 530

وصف الملف: application/pdf

Relation: European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) 2021; https://publica.fraunhofer.de/handle/publica/412534

الاتاحة: https://publica.fraunhofer.de/handle/publica/412534
https://doi.org/10.24406/publica-fhg-412534

المؤلفون: Lenz, Christian, Ziesche, Steffen, Schletz, Andreas, Linh Bach, Hoang, Erlbacher, Tobias

المصدر: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ; volume 42, page 1-5

الاتاحة: http://dx.doi.org/10.1109/estc48849.2020.9229653
http://xplorestaging.ieee.org/ielx7/9229482/9229650/09229653.pdf?arnumber=9229653

المؤلفون: Yu, Zechun, Zeng, Weijian, Zhao, Dawei, Zhang, Zheng, Bayer, Christoph Friedrich, Schletz, Andreas, März, Martin

Time: 670, 620, 530

Relation: Electronics System-Integration Technology Conference (ESTC) 2020; IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020. Proceedings; https://publica.fraunhofer.de/handle/publica/409089

الاتاحة: https://publica.fraunhofer.de/handle/publica/409089
https://doi.org/10.1109/ESTC48849.2020.9229753

المؤلفون: Schletz, Andreas

مصطلحات موضوعية: power module, characterizing tests, environmental tests, lifetime tests, power cycle

Time: 670, 620, 530

وصف الملف: application/pdf

Relation: Tutorial "Wide-Bandgap User Training" 2020; https://publica.fraunhofer.de/handle/publica/409022

الاتاحة: https://publica.fraunhofer.de/handle/publica/409022
https://doi.org/10.24406/publica-fhg-409022