المؤلفون: Schindler-Saefkow, Florian, Rost, F., Rzepka, Sven

Relation: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2019; 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019; EXC 1075; https://publica.fraunhofer.de/handle/publica/406016

الاتاحة: https://publica.fraunhofer.de/handle/publica/406016
https://doi.org/10.1109/EuroSimE.2019.8724554

المؤلفون: Döring, Ralf, Schindler-Saefkow, Florian, González-Huici, María, Simoni, Renato, Mateos-Nunez, David, Bin Khalid, Farhan

مصطلحات موضوعية: Beamforming Signalverarbeitung, Radar, Thermomechanische Belastung, Finite-Elemente-Methode, Zuverlässigkeit, Autonomes Fahrzeug, MIMO, Komprimierte Abtastung, Antennengruppe, Ortungstechnik, Radartechnik, Werkstoffmechanik, Materials science, Physics, Traffic engineering, Electrical engineering, Straßenfahrzeugtechnik

وصف الملف: application/pdf

الاتاحة: https://dx.doi.org/10.2314/kxp:1775686264
https://www.tib.eu/suchen/id/TIBKAT:1775686264/

المؤلفون: Zschenderlein, U., Baum, Mario, Schlottig, G., Schindler-Saefkow, Florian, Kumar, S.G., Wang, W.-S., Brunschwiler, T., Wunderle, Bernhard

Relation: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2016; 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016; https://publica.fraunhofer.de/handle/publica/394316

الاتاحة: https://publica.fraunhofer.de/handle/publica/394316
https://doi.org/10.1109/EuroSimE.2016.7463389

المؤلفون: Schindler-Saefkow, Florian, Pantou, Remi, Schlottig, G., Kumar, S., Brunschwiler, T., Keller, J., Wunderle, Bernhard, Rzepka, Sven

Relation: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2016; 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016; https://publica.fraunhofer.de/handle/publica/395987

الاتاحة: https://publica.fraunhofer.de/handle/publica/395987
https://doi.org/10.1109/EuroSimE.2016.7463384

المؤلفون: Brunschwiler, T., Zürcher, J., Zimmermann, Sven, Burg, B.R., Schlottig, G., Chen, X., Sinha, T., Baum, Mario, Hofmann, Christian, Pantou, Remi, Achen, A., Zschenderlein, U., Kumar, S., Wunderle, Bernhard, Haupt, M., Schindler-Saefkow, Florian, Strässle, R.

Relation: Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2016; 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016. Proceedings; https://publica.fraunhofer.de/handle/publica/395989

الاتاحة: https://publica.fraunhofer.de/handle/publica/395989
https://doi.org/10.1109/ITHERM.2016.7517541

المؤلفون: Kumar, S.G., Zschenderlein, U., Pantou, Remi, Brunschwiler, T., Schlottig, G., Schindler-Saefkow, Florian, Wunderle, Bernhard

Relation: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2015; 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015; https://publica.fraunhofer.de/handle/publica/391502

الاتاحة: https://publica.fraunhofer.de/handle/publica/391502
https://doi.org/10.1109/EuroSimE.2015.7103126

المؤلفون: Palczynska, Alicja, Schindler-Saefkow, Florian, Gromala, Przemyslaw, Kreyßig, Kerstin, Rzepka, Sven, Mayer, Dirk, Melz, Tobias

مصطلحات موضوعية: evaluation, Piezoresistive Silicon Stress Sensor

Time: 620

Relation: International Conference on Uncertainty in Mechanical Engineering (ICUME) 2015; Uncertainty in mechanical engineering II; https://publica.fraunhofer.de/handle/publica/408506

الاتاحة: https://publica.fraunhofer.de/handle/publica/408506
https://doi.org/10.4028/www.scientific.net/AMM.807.45

المؤلفون: Brunschwiler, Thomas, Schindler-Saefkow, Florian, Gordin, Rachel, Haupt, Marie, Schlottig, Gerd

المصدر: Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ; page 227-234

الاتاحة: http://dx.doi.org/10.1109/itherm.2014.6892286
http://xplorestaging.ieee.org/ielx7/6882079/6892251/06892286.pdf?arnumber=6892286

المؤلفون: Schindler-Saefkow, Florian, Rost, F., Rezaie-Adli, A., Jansen, K.M.B., Wunderle, Bernhard, Keller, J., Rzepka, Sven, Michel, Bernd

Relation: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2014; 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014; https://publica.fraunhofer.de/handle/publica/384787

الاتاحة: https://publica.fraunhofer.de/handle/publica/384787
https://doi.org/10.1109/EuroSimE.2014.6813807

المؤلفون: Rezaie Adli, A.R., Jansen, K.M.B., Schindler-Saefkow, Florian, Rost, F.

Relation: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2014; 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014; https://publica.fraunhofer.de/handle/publica/384784

الاتاحة: https://publica.fraunhofer.de/handle/publica/384784
https://doi.org/10.1109/EuroSimE.2014.6813837

المؤلفون: Schindler-Saefkow, Florian, Rost, F., Schingale, A., Wolf, D., Wunderle, Bernhard, Keller, J., Michel, Bernd, Rzepka, Sven

Relation: Electronics System Integration Technology Conference (ESTC) 2014; ESTC 2014, Electronics System Integration Technology Conference; https://publica.fraunhofer.de/handle/publica/387768

الاتاحة: https://publica.fraunhofer.de/handle/publica/387768
https://doi.org/10.1109/ESTC.2014.6962814

المؤلفون: Schlottig, Gerd, Schindler-Saefkow, Florian, Zurcher, Jonas, Michel, Bruno, Brunschwiler, Thomas

المصدر: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) ; page 560-564

الاتاحة: http://dx.doi.org/10.1109/eptc.2013.6745782
http://xplorestaging.ieee.org/ielx7/6732180/6745670/06745782.pdf?arnumber=6745782

المؤلفون: Schindler-Saefkow, Florian, Rost, F., Otto, Alexander, Keller, J., Winkler, T., Wunderle, Bernhard, Michel, Bernd, Rzepka, Sven

Relation: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) 2013; 19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013; https://publica.fraunhofer.de/handle/publica/382300

الاتاحة: https://publica.fraunhofer.de/handle/publica/382300
https://doi.org/10.1109/THERMINIC.2013.6675235

المؤلفون: Schindler-Saefkow, Florian, Rost, F., Otto, Alexander, Faust, W., Wunderle, Bernhard, Michel, Bernd, Rzepka, Sven

Relation: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2012; 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012; https://publica.fraunhofer.de/handle/publica/375980

الاتاحة: https://publica.fraunhofer.de/handle/publica/375980
https://doi.org/10.1109/ESimE.2012.6191746

المؤلفون: Hintz, M., Dudek, Rainer, Koch, I., Schindler-Saefkow, Florian, Steinke, A.

Relation: Electronics System Integration Technology Conference (ESTC) 2010; 3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.2; https://publica.fraunhofer.de/handle/publica/370194

الاتاحة: https://publica.fraunhofer.de/handle/publica/370194
https://doi.org/10.1109/ESTC.2010.5642886

المؤلفون: Vogel, Dietmar, Maus, Ingrid, Schindler-Saefkow, Florian, Michel, Bernd

المساهمون: Quan, Chenggen, Qian, Kemao, Asundi, Anand K., Chau, Fook S.

المصدر: SPIE Proceedings ; Fourth International Conference on Experimental Mechanics ; ISSN 0277-786X

الاتاحة: http://dx.doi.org/10.1117/12.851853

المؤلفون: Schindler-Saefkow, Florian, Rost, F., Otto, Alexander, Pantou, Remi, Mroßko, R., Wunderle, Bernhard, Michel, Bernd, Rzepka, Sven, Keller, J.

Time: 621

Relation: International Conference on Materials for Advanced Technologies (ICMAT) 2013; Microelectronics reliability; https://publica.fraunhofer.de/handle/publica/236577

الاتاحة: https://publica.fraunhofer.de/handle/publica/236577
https://doi.org/10.1016/j.microrel.2014.02.022

المؤلفون: Schindler-Saefkow, Florian

الاتاحة: https://dx.doi.org/10.13140/rg.2.1.4464.4960
http://rgdoi.net/10.13140/RG.2.1.4464.4960

المؤلفون: Brunschwiler, Thomas, Zurcher, Jonas, Zimmermann, Severin, Burg, Brian R., Schlottig, Gerd, Xi Chen, Sinha, Tuhin, Baum, Mario, Hofmann, Christian, Pantou, Remi, Achen, Albert, Zschenderlein, Uwe, Kumar, Sridhar, Wunderle, Bernhard, Haupt, Marie, Schindler-Saefkow, Florian, Strassle, Rahel

المصدر: 2016 15th IEEE Intersociety Conference on Thermal & Thermomechanical Phenomena in Electronic Systems (ITherm); 2016, p140-150, 11p

المؤلفون: Brunschwiler, Thomas, Zürcher, Jonas, Del Carro, Luca, Schlottig, Gerd, Burg, Brian, Zimmermann, Severin, Zschenderlein, Uwe, Wunderle, Bernhard, Schindler-Saefkow, Florian, Stässle, Rahel

المصدر: Journal of Electronic Packaging; Dec2016, Vol. 138 Issue 4, p1-10, 10p

مصطلحات موضوعية: PERCOLATION, ENERGY dissipation, THERMAL gradient measurment, THERMAL resistance, MOLECULAR self-assembly