المؤلفون: Xu, Hao, Kuczynska, Marta, Schafet, Natalja, Welschinger, Fabian, Hohe, Jörg

المصدر: Journal of Composite Materials ; volume 56, issue 20, page 3113-3125 ; ISSN 0021-9983 1530-793X

الاتاحة: https://doi.org/10.1177/00219983221109327
https://journals.sagepub.com/doi/pdf/10.1177/00219983221109327
https://journals.sagepub.com/doi/full-xml/10.1177/00219983221109327

المؤلفون: Xu, Hao, Kuczynska, Marta, Schafet, Natalja, Welschinger, Fabian, Hohe, Jörg

المصدر: Composites Science and Technology ; volume 213, page 108958 ; ISSN 0266-3538

الاتاحة: http://dx.doi.org/10.1016/j.compscitech.2021.108958
https://api.elsevier.com/content/article/PII:S0266353821003146?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0266353821003146?httpAccept=text/plain

المؤلفون: Kuczynska, Marta, Schafet, Natalja, Becker, Ulrich, Metasch, René, Röllig, Mike, Kabakchiev, Alexander, Weihe, Stefan

مصطلحات موضوعية: solder joints, measured hysteresis, operating temperature, acceleration factor

Relation: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2017; 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017; https://publica.fraunhofer.de/handle/publica/396893

الاتاحة: https://publica.fraunhofer.de/handle/publica/396893
https://doi.org/10.1109/EuroSimE.2017.7926260

المؤلفون: Metasch, René, Röllig, Mike, Kuczynska, Marta, Schafet, Natalja, Becker, Ulrich, Meier, Karsten, Panchenko, Iuliana

مصطلحات موضوعية: TMF, thermal mechanical fatigue, solder characterization, life time prediction, thermal cycling and fatigue

Time: 620, 666

Relation: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2017; 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017; iQPro; ThermiPower; 03WKP25B; 16ES0460; https://publica.fraunhofer.de/handle/publica/396886

الاتاحة: https://publica.fraunhofer.de/handle/publica/396886
https://doi.org/10.1109/EuroSimE.2017.7926287

المؤلفون: Kuczynska, Marta, Schafet, Natalja, Becker, Ulrich, Metasch, René, Röllig, Mike, Kabakchiev, Alexander, Weihe, Stefan

مصطلحات موضوعية: solder joint, measured hysteresis, operating temperature, acceleration factor, PBGA, thermo-mechanical fatigue, solder joints lifetime prediction, thermo-mechanical simulation, Weichlötverbindung, Materialtest, Prüfbedingung, In-Situ-Messung, Beschleunigung, Arbeitstemperatur, Scherbelastung, isotherme Bedingung, Werkstoffmodell, Ball-Grid-Array, Zinnlot, Werkstoffverschlechterung, Regelarmatur, Steuereinrichtung, Ausbreiteinrichtung, Versuchsaufbau

Time: 620, 621, 666

Relation: Microelectronics reliability; https://publica.fraunhofer.de/handle/publica/256310

الاتاحة: https://publica.fraunhofer.de/handle/publica/256310
https://doi.org/10.1016/j.microrel.2018.06.007