المؤلفون: Wilson W. S. Ho, Lisa Chan, Niamh Corduff, Wang-Tak Lau, Michael U. Martin, Clifton Ming Tay, Sandy Wang, Raymond Wu

المصدر: Toxins, Vol 15, Iss 7, p 456 (2023)

مصطلحات موضوعية: botulinum neurotoxin A, immunoresistance, secondary non-response, neutralizing antibodies, Medicine

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2072-6651/15/7/456; https://doaj.org/toc/2072-6651

URL الوصول: https://doaj.org/article/1d7bfe7b12254036bc48fb9971ad1108

المؤلفون: Sandy, Wang Shuqin

المصدر: Words & Silences / Palabras y Silencios; 2022/2023, Vol. 11 Issue 1, p1-5, 5p

مصطلحات موضوعية: SHRINES, GERMANS, WOMEN in war, WORLD War I, LEGENDS

المؤلفون: Munyi Shea, Sarah J. Hickman, Julie R. LaFollette, Sherry Wang, Sandy Wang, Viviana Jimenez, Y. Joel Wong

المصدر: Psychology of Women Quarterly. 38:275-291

مصطلحات موضوعية: media_common.quotation_subject, Perspective (graphical), Discriminant validity, Life satisfaction, Social constructionism, Femininity, Developmental psychology, Gender Studies, Distress, Arts and Humanities (miscellaneous), Developmental and Educational Psychology, Personal experience, Construct (philosophy), Psychology, General Psychology, media_common

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::30fa0f3ae73e6152a9a15996f3007f6e
https://doi.org/10.1177/0361684313509591

المؤلفون: Sandy Wang, R.R.-B. Sheen, Oscal T.-C. Chen

المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 10:435-453

مصطلحات موضوعية: Digital electronics, Adder, Digital signal processor, business.industry, Computer science, Ripple, Transistor, Integrated circuit, 32-bit, law.invention, Application-specific integrated circuit, CMOS, Hardware and Architecture, law, Low-power electronics, Electronic engineering, Serial binary adder, Carry-save adder, Hardware_ARITHMETICANDLOGICSTRUCTURES, Electrical and Electronic Engineering, business, Software, Electronic circuit

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0ff87e6265e171cfb195b75edb8e182d
https://doi.org/10.1109/tvlsi.2003.809138

المؤلفون: Sandy Wang, Yi-Wen Wu, Chen, O.T.-C., Ruey-Liang Ma

المصدر: Proceedings of the 43rd IEEE Midwest Symposium on Circuits and Systems (Cat.No.CH37144) ; volume 1, page 88-92

الاتاحة: http://dx.doi.org/10.1109/mwscas.2000.951593
http://xplorestaging.ieee.org/ielx5/7554/20582/00951593.pdf?arnumber=951593

المؤلفون: Ser Choong Chong, Inbal Herer, Soon Wee Ho, Adi Baram, Sandy Wang, Paing Myo, C. S. Premachandran, Justin Wee, Ling Xie

المصدر: 2010 12th Electronics Packaging Technology Conference.

مصطلحات موضوعية: Materials science, Silicon, business.industry, Electronic packaging, Magnetic separation, chemistry.chemical_element, Epoxy, Chip, law.invention, chemistry, Projector, law, Deflection (engineering), visual_art, Magnet, Electronic engineering, visual_art.visual_art_medium, Optoelectronics, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::729adaa2ea4741c7d7d8cf01fc4fe4f3
https://doi.org/10.1109/eptc.2010.5702734

المؤلفون: T. C. Chai, S.L. Yeow, John H. Lau, S. C. Chong, C. S. Premachandran, Xiaowu Zhang, Vincent Lee, V.K. Sekhar, C. Lee, V. Kripesh, Sandy Wang, Damaruganath Pinjala, Leong Ching Wai

المصدر: 2008 10th Electronics Packaging Technology Conference.

مصطلحات موضوعية: Interconnection, Wire bonding, Materials science, business.industry, Ball grid array, Delamination, Electronic packaging, Mechanical engineering, Wafer dicing, Structural engineering, business, Die (integrated circuit), Bevel

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::23f5fca0f9883ebda21f73f2a6477ac5
https://doi.org/10.1109/eptc.2008.4763464

المؤلفون: Xiaowu Zhang, John H. Lau, S. C. Chong, J. Madhukumar, W.L. Teo, C.S. Premachandran, V. Kripesh, Meei Ling Thew, Sandy Wang, V.R. Srinivas, Phyo Phyo Thaw, Leong Ching Wai, Ying Ying Liu, M.J. Jong, Eipa Myo, C.K. Foo

المصدر: 2008 10th Electronics Packaging Technology Conference.

مصطلحات موضوعية: Interconnection, Wire bonding, business.product_category, Materials science, Metallurgy, Intermetallic, chemistry.chemical_element, Copper, chemistry, Aluminium, Ball (bearing), Immersion (virtual reality), Die (manufacturing), business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::33e937fe3a77acd95b49f077c839b97c
https://doi.org/10.1109/eptc.2008.4763553

المؤلفون: Kelvin Wei Sheng Chen, J.H. Lau, A. Khairyanto, Xu Yingshun, Malini Olivo, Sandy Wang, C.S. Premachandran, Colin J. R. Sheppard, Janak Singh, Chen Nanguang

المصدر: 2008 58th Electronic Components and Technology Conference.

مصطلحات موضوعية: Microelectromechanical systems, Depth of focus, Materials science, medicine.diagnostic_test, business.industry, Curvature, eye diseases, Optics, Optical coherence tomography, medicine, Optoelectronics, Gradient-index optics, Tomography, Optical tomography, business, Beam (structure)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1203420712e7dbdd2b1e886195d714d9
https://doi.org/10.1109/ectc.2008.4550072

المؤلفون: Chen, O.T.-C., Sandy Wang, Yi-Wen Wu

المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems ; volume 11, issue 3, page 418-433 ; ISSN 1063-8210 1557-9999

الاتاحة: http://dx.doi.org/10.1109/tvlsi.2003.810788
http://xplorestaging.ieee.org/ielx5/92/27383/01218215.pdf?arnumber=1218215

المؤلفون: Guang Hong Lu, Feng Liu, Qi Sandy Wang

المصدر: Applied Physics Letters. 92:211906

مصطلحات موضوعية: Materials science, Physics and Astronomy (miscellaneous), Silicon, Precipitation (chemistry), Doping, Binding energy, chemistry.chemical_element, Trapping, chemistry, Chemical physics, Vacancy defect, Atomic physics, Diffusion (business), Arsenic

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::251b3ded94d5e015821bbba646c20c9e
https://doi.org/10.1063/1.2937308

المؤلفون: Feng Liu, Qi Sandy Wang, Decai Yu, Hamza Yilmaz, Guang Hong Lu, Lugang Bai

المصدر: Applied Physics Letters. 91:061926

مصطلحات موضوعية: Materials science, Physics and Astronomy (miscellaneous), Silicon, Dopant, Diffusion barrier, business.industry, Doping, chemistry.chemical_element, Nanotechnology, Barrier layer, chemistry, Vacancy defect, Optoelectronics, Wafer, Diffusion (business), business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::23abf614908ede71b27082d945a858cc
https://doi.org/10.1063/1.2769392

المؤلفون: Xiaowu Zhang, Premachandran, C.S., Ser-Choong Chong, Leong Ching Wai, Lee, V., Chai, T.C., Kripesh, V., Lau, J.H., Sekhar, V.K., Sandy Wang, Pinjala, D., Charles Lee, Yeow, S.L.

المصدر: 2008 10th Electronics Packaging Technology Conference; 2008, p379-386, 8p

المؤلفون: Mathew Nelson, Christopher Raio, Sandy Wang

المصدر: Critical Ultrasound Journal. 3(3):161-162

مصطلحات موضوعية: medicine.medical_specialty, Superior vena cava syndrome, Percutaneous, Radiological and Ultrasound Technology, Intravenous drug, medicine.diagnostic_test, business.industry, Deep vein, education, Interventional radiology, Internal jugular vein thrombosis, medicine.disease, Thrombosis, medicine.anatomical_structure, cardiovascular system, medicine, Radiology, medicine.symptom, business, Internal jugular vein

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fd3202eabaa164e5f5a99657a8637bcc

المؤلفون: Sandy Wang, Yi-Wen Wu, Chen, O.T.-C., Ruey-Liang Ma

المصدر: Proceedings of the 43rd IEEE Midwest Symposium on Circuits & Systems (Cat.No.CH37144); 2000, p88-88, 1p

المساهمون: Sandy Wang Wang, Sandy Hsiu-Chi (Creator)

مصطلحات موضوعية: Exhibition catalogs, Industrial Design

جغرافية الموضوع: Vancouver

وصف الملف: nonprojected graphic; image/jpeg

الاتاحة: https://ecuad.arcabc.ca/islandora/object/ecuad%3A5527