المؤلفون: Kidu Gebrecherkos Weldeanenia, Samuel Kinde Kassegne, Perumalla Janaki Ramulu

المصدر: Engineering Reports, Vol 7, Iss 1, Pp n/a-n/a (2025)

مصطلحات موضوعية: fluctuation reduction, microstructure evolution indicator, optimum process parameters, parametric sweep optimization, SLM‐Ti6Al4V alloy simulation, solidification parameters, Engineering (General). Civil engineering (General), TA1-2040, Electronic computers. Computer science, QA75.5-76.95

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2577-8196

URL الوصول: https://doaj.org/article/ec9b853a1c074895a69aa409ba8a024e