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المصدر: Vähänen, S, Heikkinen, H, Pohjonen, H, Salonen, J & Savolainen-Pulli, S 2008, ' Rework of flip chip bonded radiation pixel detectors ', Nuclear Instruments and Methods in Physics Research. Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, vol. 591, no. 1, pp. 233-236 . https://doi.org/10.1016/j.nima.2008.03.087
مصطلحات موضوعية: Physics, Nuclear and High Energy Physics, flip chip, Pixel, business.industry, pixel detectors [radiation detectors], Detector, ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION, Process (computing), Rework, Hardware_PERFORMANCEANDRELIABILITY, rework, solder pumps, Chip, Particle detector, Reliability (semiconductor), Hardware_INTEGRATEDCIRCUITS, business, Instrumentation, Computer hardware, Flip chip, radiation detectors: pixel detectors
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المؤلفون: I. Suni, S. Vahanen, J. Salmi, Naoko Kanaya, G. Aglieri-Rinella, K. Wyllie, J. Salonen, T. Gys, L. Somerville, M. Campbell, C. Newby, S. Savolainen-Pulli, G. Arnau-Izquierdo, Petra Riedler, D. Piedigrossi
المصدر: Campbell, M, Rinella, G A, Izquierdo, G A, Gys, T, Kanaya, N, Newby, C, Piedigrossi, D, Riedler, P, Salmi, J, Salonen, J, Savolainen-Pulli, S, Somerville, L, Suni, I, Vähänen, S & Wyllie, K 2006, ' A fine pitch bump bonding process compatible with the manufacture of the pixel-HPD's for the LHCb RICH detector ', IEEE Transactions on Nuclear Science, vol. 56, no. 4, pp. 2296-2302 . https://doi.org/10.1109/NSSMIC.2004.1462278
مصطلحات موضوعية: Physics, Nuclear and High Energy Physics, Fabrication, Pixel, business.industry, Detector, Photodetector, Particle detector, Ring-imaging Cherenkov detector, Engineering, Optics, Nuclear Energy and Engineering, radiation detectors, Nuclear electronics, Optoelectronics, photodetectors, Detectors and Experimental Techniques, Electrical and Electronic Engineering, business, Bake-out, Cherenkov radiation