المؤلفون: Lee, Jong-Hyup¹ (AUTHOR) 20225308@student.anu.ac.kr, Ham, Ju-Been¹ (AUTHOR), Kim, Young-Cheon¹ (AUTHOR) kimyc@anu.ac.kr

المصدر: Materials (1996-1944). Jan2025, Vol. 18 Issue 1, p154. 13p.

مصطلحات موضوعية: *SUBSTRATES (Materials science), *RELIABILITY of electronics, *METALLIC films, *FINITE element method, *STRESS concentration

المؤلفون: Klimtová, Markéta¹ (AUTHOR) klimtma2@fel.cvut.cz, Veselý, Petr¹ (AUTHOR), Králová, Iva¹ (AUTHOR), Dušek, Karel¹ (AUTHOR)

المصدر: Materials (1996-1944). Sep2024, Vol. 17 Issue 17, p4242. 19p.

مصطلحات موضوعية: *RELIABILITY of electronics, *PRINTED circuits, *WATER testing, *WATER use, *DENDRITIC crystals

المصدر: Productronic. 6/4/2024, p32-34. 3p.

مصطلحات موضوعية: *RISK assessment, SINTERING, RELIABILITY of electronics, POWER electronics, ENVIRONMENTAL risk

المؤلفون: Marques, Cleiton¹ (AUTHOR) cleiton-magano.marques@umontpellier.fr, Wrobel, Frédéric¹ (AUTHOR) alain.michez@umontpellier.fr, Aguiar, Ygor² (AUTHOR) ygor.aguiar@cern.ch, Michez, Alain¹ (AUTHOR) jerome.boch@umontpellier.fr, Boch, Jérôme¹ (AUTHOR) frederic.saigne@umontpellier.fr, Saigné, Frédéric¹ (AUTHOR), García Alía, Rubén² (AUTHOR) ruben.garcia.alia@cern.ch

المصدر: Eng. Mar2024, Vol. 5 Issue 1, p319-332. 14p.

مصطلحات موضوعية: *PROTONS, *RELIABILITY of electronics, *DIFFERENTIAL cross sections, *ION energy

المؤلفون: Chen, Cong, Cai, Yumeng, Sun, Peng, Zhao, Zhibin

المصدر: IET Power Electronics (Wiley-Blackwell); 11/25/2024, Vol. 17 Issue 15, p2393-2404, 12p

مصطلحات موضوعية: THERMAL stresses, CHARGE exchange, THRESHOLD voltage, RELIABILITY of electronics, SEMICONDUCTOR devices

Alternate Title: Kosmik radiasiyanın kosmik gəmilərinin elektronikasına təsiri: ölçmə proseslərinə mənfi təsirlər və məlumatların korlanmasının azaldılması strategiyaları. (Azerbaijani)

المؤلفون: Ahmadzade, Elnur

المصدر: Scientific Work / Elmi Iş; 2024, Vol. 18 Issue 11, p165-173, 9p

مصطلحات موضوعية: COSMIC rays, ASTROPHYSICAL radiation, RELIABILITY of electronics, SPACE environment, SYSTEM failures

المؤلفون: Ventimiglia, Marco, Scuto, Alfio, Sorrentino, Giuseppe, Belverde, Gaetano, Iannuzzo, Francesco, Rizzo, Santi Agatino

المصدر: Electronics (2079-9292); Oct2024, Vol. 13 Issue 19, p3902, 18p

مصطلحات موضوعية: SWITCHING power supplies, FIELD-effect transistors, RELIABILITY of electronics, POWER electronics, ELECTRIC potential measurement

Alternate Title: MULTI-LEVEL FLEXIBLE ELECTRICITY DISTRIBUTION SYSTEMS. (English)

المؤلفون: Жаркін, А. Ф., Попов, В. А., Ярмолюк, О. С., Палачов, С. О., Наталич, В. О.

المصدر: Technical Electrodynamics / Tekhnichna Elektrodynamika; Sep/Oct2024, Issue 5, p63-68, 6p

مصطلحات موضوعية: POWER resources, RELIABILITY of electronics, POWER electronics, CONSUMERS, MICROGRIDS

المؤلفون: Patel, Hardik, Shah, Ankit

المصدر: Advanced Control for Applications; Sep2024, Vol. 6 Issue 3, p1-14, 14p

مصطلحات موضوعية: FIELD programmable gate arrays, RELIABILITY of electronics, LYAPUNOV stability, POWER electronics, LYAPUNOV functions

المؤلفون: Ahmedi, Arsim¹ (AUTHOR) arsim.ahmedi@manchester.ac.uk, Barnes, Mike¹ (AUTHOR) mike.barnes@manchester.ac.uk, Levi, Victor¹ (AUTHOR) victor.levi@manchester.ac.uk, Carmona Sanchez, Jesus¹ (AUTHOR) carmonaipn@live.com.mx, Ng, Chong² (AUTHOR) chong.ng@ore.catapult.org.uk, McKeever, Paul² (AUTHOR) paul.mckeever@ore.catapult.org.uk

المصدر: IEEE Transactions on Energy Conversion. Sep2022, Vol. 37 Issue 3, p1764-1776. 13p.

مصطلحات موضوعية: RELIABILITY of electronics, POWER electronics, WIND turbines, THERMOCYCLING, BIPOLAR transistors

المؤلفون: Wang, Zekun¹ zzw0043@auburn.edu, Zhao, Rong² rzz0015@auburn.edu, Yu, Yan³ yan.yu.work@outlook.com, Wang, Shiming⁴ smwang@shou.edu.cn, Yao, Yuanzhi⁵ yzy0040@auburn.edu

المصدر: IEEE Transactions on Components, Packaging & Manufacturing Technology. Sep2022, Vol. 12 Issue 9, p1557-1566. 10p.

مصطلحات موضوعية: WHISKERS, RELIABILITY of electronics, CRYSTAL whiskers, DIGITAL divide, MATERIAL plasticity, RECRYSTALLIZATION (Metallurgy)

المؤلفون: Ring, Rosalinda M. jmj4papa@yahoo.com

المصدر: Electronic Device Failure Analysis. Nov2024, Vol. 26 Issue 4, p54-55. 2p.

مصطلحات موضوعية: *RELIABILITY of electronics, *FAILURE analysis

المؤلفون: Butnicu, Dan

المصدر: Energies (19961073); Aug2024, Vol. 17 Issue 16, p3957, 14p

مصطلحات موضوعية: ELECTROLYTIC capacitors, CAPACITOR banks, DC-to-DC converters, RELIABILITY of electronics, INDUSTRIAL electronics

المؤلفون: Scognamillo, C.¹ (AUTHOR), Catalano, A.P.¹ (AUTHOR) antoniopio.catalano@unina.it, Codecasa, L.² (AUTHOR), Castellazzi, A.³ (AUTHOR), d'Alessandro, V.¹ (AUTHOR)

المصدر: Microelectronics Reliability. Jan2025, Vol. 164, pN.PAG-N.PAG. 1p.

مصطلحات موضوعية: *BREAKDOWN voltage, *RELIABILITY of electronics, *POWER electronics, *METAL oxide semiconductor field-effect transistors, *SILICON carbide

المؤلفون: Chen, Rui¹, Chow, Justin H.¹, Zhou, Yi¹, Meth, Jeffrey S.², Sitaraman, Suresh K.¹ suresh.sitaraman@me.gatech.edu

المصدر: IEEE Transactions on Components, Packaging & Manufacturing Technology. Nov2021, Vol. 11 Issue 11, p1877-1888. 12p.

مصطلحات موضوعية: FLEXIBLE electronics, RELIABILITY of electronics, FLEXIBLE display systems, RESISTANCE to change, POLYETHYLENE terephthalate

المؤلفون: Ganesan, Dhanushkodi¹ dhanush.sameer@nic.in, Ramalingam, Velraj² velrajr@annauniv.edu

المصدر: IEEE Transactions on Components, Packaging & Manufacturing Technology. Sep2021, Vol. 11 Issue 9, p1471-1479. 9p.

مصطلحات موضوعية: SOLAR thermal energy, RELIABILITY of electronics, COMPUTATIONAL fluid dynamics, POWER amplifiers, GEOMETRIC surfaces, HEAT flux

المصدر: Ace Analyser: Company News. 5/10/2024, pN.PAG-N.PAG. 1p.

مصطلحات موضوعية: RELIABILITY of electronics, MICROWAVES, SEMICONDUCTORS

الشركة/الكيان: TELEDYNE Technologies Inc. 022039341 TDY

المؤلفون: Kumaresan, Vigneshwarram^1,2 (AUTHOR), Sreekantan, Srimala¹ (AUTHOR) srimala@usm.my, Devarajan, Mutharasu² (AUTHOR), Mohamed, Khairudin³ (AUTHOR)

المصدر: Materials Technology. Aug2022, Vol. 37 Issue 9, p970-979. 10p.

مصطلحات موضوعية: *ELECTRONIC packaging, *RELIABILITY of electronics, *GRAPHENE oxide, *PERMITTIVITY, *POWER density

المؤلفون: Camden, Eric¹

المصدر: SMT007 Magazine. Nov2021, Vol. 36 Issue 11, p20-24. 4p.

مصطلحات موضوعية: *SURFACE mount technology, RELIABILITY of electronics, SCIENTIFIC method

المؤلفون: Tilford, Tim¹ t.tilford@gre.ac.uk, Stoyanov, Stoyan¹, Braun, Jessica², Janhsen, Jan Christoph¹, Patel, Mayur K.¹, Bailey, Chris¹

المصدر: IEEE Transactions on Components, Packaging & Manufacturing Technology. Feb2021, Vol. 11 Issue 2, p351-362. 12p.

مصطلحات موضوعية: *ELECTRONIC packaging, RELIABILITY of electronics, PRINT materials, STRAINS & stresses (Mechanics), THERMOCYCLING, INK-jet printing, ELASTIC modulus