المؤلفون: Ganpat Louhar, Suresh Yadav, Rajeev Malik, R.K. Yadav

المصدر: International Journal of Current Microbiology and Applied Sciences. 8:2817-2826

مصطلحات موضوعية: Soil series, Distribution (number theory), Environmental science, Heavy metals, Soil science

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::058a573716c20e1e6493dcf480a6bf4c
https://doi.org/10.20546/ijcmas.2019.802.331

المؤلفون: Victor Chan, Ken Rim, Meikei Ieong, Sam Yang, Rajeev Malik, Young Way Teh, Min Yang, Qiqing, Christine Ouyang

المساهمون: The Pennsylvania State University CiteSeerX Archives

المصدر: http://www.ewh.ieee.org/r5/denver/sscs/References/2005_09_Chan.pdf.

وصف الملف: application/pdf

Relation: http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.1078.6586; http://www.ewh.ieee.org/r5/denver/sscs/References/2005_09_Chan.pdf

الاتاحة: http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.1078.6586
http://www.ewh.ieee.org/r5/denver/sscs/References/2005_09_Chan.pdf

المؤلفون: Rajeev Malik, Deepesh Kumar Yadav, Jaya Yadav

المصدر: Prabandhan: Indian Journal of Management. 12:23

مصطلحات موضوعية: E-HRM, Perception, media_common.quotation_subject, Paradigm shift, Business administration, Psychology, General Business, Management and Accounting, media_common

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1f6ee69bff2d70ce945d7df834cfff82
https://doi.org/10.17010/pijom/2019/v12i2/141754

المؤلفون: Michael V. Aquilino, Brian W. Messenger, Paul D. Agnello, Oh Jung Kwon, Bhupesh Chandra, T. Tzou, T. Kirahata, Shreesh Narasimha, Daniel J. Poindexter, S.S. Iyer, Erik A. Nelson, William Y. Chang, Geng Wang, K. V. Hawkins, Jaeger Daniel, Gregory G. Freeman, S. Rombawa, Chengwen Pei, Rajendran Krishnasamy, W. Davies, Karen A. Nummy, James P. Norum, Paul C. Parries, Norman Robson, Jinping Liu, X. Wang, Rajeev Malik, Christopher D. Sheraw, X. Chen, Jeffrey B. Johnson, Xin Li, W. Kong, Ming Yin, N. Arnold, Edward P. Maciejewski, Katsunori Onishi

المصدر: 2014 IEEE International Electron Devices Meeting.

مصطلحات موضوعية: Dynamic random-access memory, Engineering, Bit cell, Hardware_MEMORYSTRUCTURES, business.industry, Silicon on insulator, eDRAM, Capacitance, law.invention, law, Embedded system, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, IBM, business, Scaling, Dram

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::66ec91f5b274f3f393e4cdb66ce3356c
https://doi.org/10.1109/iedm.2014.7047083

المؤلفون: Erdogan Guljari, Rajeev Malik

المصدر: Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 15:2219-2225

مصطلحات موضوعية: Jet (fluid), Materials science, Analytical chemistry, Surfaces and Interfaces, Activation energy, Substrate (electronics), Condensed Matter Physics, Epitaxy, Molecular physics, Surfaces, Coatings and Films, Atomic layer epitaxy, Thin film, Diffusion (business), Molecular beam epitaxy

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c528f5cf03a3e5aa0f2ae626e290d0f7
https://doi.org/10.1116/1.580537

المؤلفون: Basanth Jagannathan, D. Faken, N. Zhan, Manoj Kumar, B. Cipriany, James P. Norum, K. Greiner, S. Breit, Karen A. Nummy, D. Fried, Shreesh Narasimha, B. Zhang, Rajeev Malik, Paul D. Agnello, Gregory Costrini, J. Meiring, Katsunori Onishi, H. Nanjundappa, Ahmed N. Noemaun, Christopher D. Sheraw, Stephen S. Furkay

المصدر: 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD).

مصطلحات موضوعية: Process variation, Engineering, Multivariate statistics, Fabrication, Yield (engineering), CMOS, business.industry, Electronic engineering, Virtual metrology, Silicon on insulator, Process window, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e1abce879f5e1cafa7541e0a6f16ff19
https://doi.org/10.1109/sispad.2013.6650583

المؤلفون: Erdogan Gulari, S. H. Li, Jasprit Singh, Palla K. Bhattacharya, Rajeev Malik

المصدر: Journal of Crystal Growth. 150:984-988

مصطلحات موضوعية: Arrhenius equation, Reflection high-energy electron diffraction, Silicon, business.industry, Analytical chemistry, chemistry.chemical_element, Substrate (electronics), Condensed Matter Physics, Epitaxy, Inorganic Chemistry, symbols.namesake, Optics, Electron diffraction, chemistry, Transmission electron microscopy, Materials Chemistry, symbols, Thin film, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::49edb93c191af19bebf9b1b087dfd778
https://doi.org/10.1016/0022-0248(95)80087-s

المؤلفون: Michael V. Aquilino, Jaeger Daniel, J. Koshy, E. Engbrecht, Edward P. Maciejewski, L. Zhuang, Mahender Kumar, G. Costrini, J. Gill, Paul D. Agnello, Rajeev Malik, Jin Cai, Gregory G. Freeman, S. Lucarini, N. Arnold, Geng Wang, David M. Fried, Matthew W. Stoker, R. Bolam, Dimitris P. Ioannou, Katsunori Onishi, Paul C. Parries, Richard Wise, Alvin G. Thomas, Min Dai, Viorel Ontalus, Jessica Dechene, Shreesh Narasimha, Robert R. Robison, Judson R. Holt, Dechao Guo, Paul Chang, Naftali E. Lustig, Michael P. Chudzik, Basanth Jagannathan, Paul S. McLaughlin, Bernard A. Engel, Xiaolin Li, Amit Kumar, W. Kong, Rishikesh Krishnan, Barry P. Linder, J. Norum, C. DeWan, Claude Ortolland, Karen A. Nummy, Michael A. Gribelyuk, Jae Gon Lee, Christopher D. Sheraw, G. Han, C-H. Lin, Benjamin Cipriany, Takashi Ando, N. Habib, J. Johnson

المصدر: 2012 International Electron Devices Meeting.

مصطلحات موضوعية: Hardware_MEMORYSTRUCTURES, Materials science, Memory hierarchy, business.industry, Copper interconnect, Electrical engineering, Silicon on insulator, Hardware_PERFORMANCEANDRELIABILITY, PMOS logic, CMOS, MOSFET, Hardware_INTEGRATEDCIRCUITS, business, Dram, NMOS logic, Hardware_LOGICDESIGN

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8c61f3f0814bd02ce1388effadad931e
https://doi.org/10.1109/iedm.2012.6478971

المؤلفون: Rajeev Malik, Rishikesh Krishnan, Sunfei Fang, Bernhard Wunder, Kevin McStay, Yanli Zhang, Sadanand V. Deshpande, Douglas Daley, Herbert L. Ho, Sneha Gupta, Paul C. Parries, Balaji Jayaraman, Sungjae Lee, Puneet Goyal, John E. Barth, Scott R. Stiffler, Paul D. Agnello, Subramanian S. Iyer

المصدر: ICICDT

مصطلحات موضوعية: Materials science, Equivalent series resistance, business.industry, Electrical engineering, Silicon on insulator, Hardware_PERFORMANCEANDRELIABILITY, eDRAM, Decoupling capacitor, Capacitance, law.invention, Capacitor, Hardware_GENERAL, law, Trench, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, business, Metal gate

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::83d6b2dd06f89254c9ba9a3578b0ab30
https://doi.org/10.1109/icicdt.2012.6232872

المؤلفون: Pallab Bhattacharya, Erdogan Gulari, S. H. Li, Rajeev Malik

المصدر: Journal of Applied Physics. 73:5193-5196

مصطلحات موضوعية: Analytical chemistry, General Physics and Astronomy, chemistry.chemical_element, Germanium, Crystal growth, Substrate (electronics), Epitaxy, chemistry.chemical_compound, chemistry, Germane, Physical chemistry, Disilane, Thin film, Molecular beam epitaxy

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6c1a8c1fb838012ec4b4c14700de7ba3
https://doi.org/10.1063/1.353745

المؤلفون: Gregory G. Freeman, Chengwen Pei, S.S. Iyer, J. Safran, Rajeev Malik, Geng Wang, Carl J. Radens, Paul C. Parries

المصدر: 2010 IEEE International SOI Conference (SOI).

مصطلحات موضوعية: Hardware_MEMORYSTRUCTURES, Computer science, business.industry, CPU cache, Universal memory, Embedded system, Silicon on insulator, Embedded memory, Static random-access memory, Cache, eDRAM, business, Chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b3742f129b8efd84bc708202a7849b5d
https://doi.org/10.1109/soi.2010.5641468

المؤلفون: S.S. Iyer, Ravi M. Todi, Rajeev Malik, Erik A. Nelson, Rishikesh Krishnan, Sunfei Fang, Byeong Y. Kim, R. Takalkar, D. Anand, Oh-Jung Kwon, Michael P. Chudzik, Nauman Zafar Butt, Scott R. Stiffler, Herbert L. Ho, Joseph Ervin, Siddarth A. Krishnan, Babar A. Khan, Alberto Cestero, Gregory G. Freeman, Geng Wang, Karen A. Nummy, J. Sim, Amanda L. Tessier, Jin Liu, W. Kong, Paul C. Parries, Kevin McStay

المصدر: 2009 IEEE International Electron Devices Meeting (IEDM).

مصطلحات موضوعية: Computer science, business.industry, Transistor, Electrical engineering, Silicon on insulator, Hardware_PERFORMANCEANDRELIABILITY, eDRAM, law.invention, Capacitor, Hardware_GENERAL, law, Logic gate, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Node (circuits), business, Metal gate, Dram

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2d6cc411a517f48787c659ad0590ab81
https://doi.org/10.1109/iedm.2009.5424375

المؤلفون: Uday V. Shenoy, Rajeev Malik

المصدر: Industrial & Engineering Chemistry Research. 30:1950-1954

مصطلحات موضوعية: Physics, Classical mechanics, Power-law fluid, General Chemical Engineering, General Chemistry, Couette flow, Industrial and Manufacturing Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::51b582ff3a932c0d1f1e2b6fd1e8cf2d
https://doi.org/10.1021/ie00056a043

المؤلفون: J.A. Patrick, Allen H. Gabor, D. Slisher, T. Su, Chien Yu, D. Wehella-Gamage, C. Collins, E. Meyette, George Richard Goth, P. Lindo, R. Van Roijen, M. Rutten, V. Nastasi, R. Amos, Qingyun Yang, Rich Wise, T. Rust, Brian L. Tessier, D.P. Prakash, Shahid Butt, Bryant C. Colwill, A. Santiago, B. Davies, Amanda Piper, Jeffrey J. Brown, N. Le, Kevin E. Mello, A. Chan, J. Tetzloff, R. Gehres, Rajeev Malik, R. Divakaruni

المصدر: The 17th Annual SEMI/IEEE ASMC 2006 Conference.

مصطلحات موضوعية: Engineering, Yield (engineering), business.industry, Process design, Automotive engineering, law.invention, Dual (category theory), Power (physics), Microprocessor, CMOS, law, Electronic engineering, IBM, business, Electronic circuit

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a25d0c4d8d5325534258d76aee5e2c95
https://doi.org/10.1109/asmc.2006.1638793

المؤلفون: K. Rim, Sam Yang, Qiqing, Young Way Teh, Min Yang, Meikei Ieong, Victor Chan, Rajeev Malik

المصدر: CICC

مصطلحات موضوعية: Stress (mechanics), Electron mobility, Substrate (building), Strain engineering, Materials science, CMOS, Strain (chemistry), Process (engineering), Electronic engineering, Performance improvement

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4f649af6cf1ba8b4c44e03043813db23
https://doi.org/10.1109/cicc.2005.1568758

المؤلفون: K. K. Linder, Erdogan Gulari, Jae-Sung Rieh, P. K. Bhattacharya, Rajeev Malik

المصدر: Applied Physics Letters. 70:1149-1151

مصطلحات موضوعية: In situ, Materials science, Physics and Astronomy (miscellaneous), Silicon, business.industry, Doping, chemistry.chemical_element, Condensed Matter::Materials Science, chemistry.chemical_compound, chemistry, Rectification, Junction diodes, Condensed Matter::Superconductivity, Optoelectronics, Condensed Matter::Strongly Correlated Electrons, Supersonic speed, business, Phosphine, Molecular beam epitaxy

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5ef3da071448f0a977a8a3b991b4d6dc
https://doi.org/10.1063/1.119074

المؤلفون: Rajeev Malik, Erdogan Gulari

المصدر: Applied Physics Letters. 68:3156-3158

مصطلحات موضوعية: Jet (fluid), Materials science, Physics and Astronomy (miscellaneous), Silicon, business.industry, Layer by layer, Analytical chemistry, chemistry.chemical_element, Crystal structure, Epitaxy, Condensed Matter::Materials Science, chemistry, Condensed Matter::Superconductivity, Optoelectronics, Supersonic speed, Growth rate, business, Choked flow

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6375af180e85706596baffb7eae2bc09
https://doi.org/10.1063/1.115809

المؤلفون: Kenneth J. Giewont, James P. Norum, Paul D. Agnello, Jonathan K. Winslow, Rajeev Malik, Shreesh Narasimha, E. R. Engbrecht, Karen Nummy, M. Lagus, Paul Chang, B. Morgenfeld, Gregory G. Freeman, Geng Wang, Paul C. Parries, David F. Hilscher, Timothy J. McArdle

المصدر: IBM Journal of Research and Development. 59:5:1-5:14

مصطلحات موضوعية: Interconnection, General Computer Science, Silicon, Computer science, Gate dielectric, Silicon on insulator, chemistry.chemical_element, Hardware_PERFORMANCEANDRELIABILITY, Substrate (electronics), Power (physics), chemistry, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, IBM, Dram

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::52f6862c3f18b98f91a79f2c211f6b5c
https://doi.org/10.1147/jrd.2014.2380252

المؤلفون: Chan, V., Ken Rim, Meikei Ieong, Sam Yang, Rajeev Malik, Young Way Teh, Min Yang, Qiqing

المصدر: Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005; 2005, p667-674, 8p

المؤلفون: Manuel Valdivieso, Robert Keating, Rajeev Malik

المصدر: Seminars in Respiratory and Critical Care Medicine. 4:64-75

مصطلحات موضوعية: Pulmonary and Respiratory Medicine, Oncology, medicine.medical_specialty, business.industry, Internal medicine, medicine, Critical Care and Intensive Care Medicine, Lung cancer, medicine.disease, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fdf76cd0dc1fdb68d593a3d308837f00
https://doi.org/10.1055/s-2007-1012468