المؤلفون: Guo, Fei, Aygun, Kemal, Becker, W. Dale, Grivet Talocia, Stefano, Hejase, Jose A., Wong, Wui-Weng, Zhou, Tingdong, Barnes, Heidi, Peng, Zhen, Pelger, Alexander, Sahouli, Mohamed, Schutt-Aine, Jose, Ling, Feng, Griese, Elmar, Paladhi, Pavel Roy, Sharma, Rohit, Pham, Nam, Winkel, Thomas-Michael, Fledell, Evan, Hill, Michael J., Silva, Benjamin, Hu, Kaisheng, Aronsson, Jonatan, Liu, Chang, Jeong, Yiru, Yilmaz, Ali E.

المساهمون: Guo, Fei, Aygun, Kemal, Becker, W. Dale, Grivet Talocia, Stefano, Hejase, Jose A., Wong, Wui-Weng, Zhou, Tingdong, Barnes, Heidi, Peng, Zhen, Pelger, Alexander, Sahouli, Mohamed, Schutt-Aine, Jose, Ling, Feng, Griese, Elmar, Paladhi, Pavel Roy, Sharma, Rohit, Pham, Nam, Winkel, Thomas-Michael, Fledell, Evan, Hill, Michael J., Silva, Benjamin, Hu, Kaisheng, Aronsson, Jonatan, Liu, Chang, Jeong, Yiru, Yilmaz, Ali E.

مصطلحات موضوعية: benchmarking, scientific method, technical collaboration, validation, verification, computer-aided design

وصف الملف: ELETTRONICO

Relation: info:eu-repo/semantics/altIdentifier/isbn/978-1-6654-4269-5; info:eu-repo/semantics/altIdentifier/wos/WOS:000758515900015; ispartofbook:2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS); 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS); firstpage:1; lastpage:4; numberofpages:4; http://hdl.handle.net/11583/2947707; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85123175010; https://ieeexplore.ieee.org/document/9609142

الاتاحة: http://hdl.handle.net/11583/2947707
https://doi.org/10.1109/EPEPS51341.2021.9609142
https://ieeexplore.ieee.org/document/9609142

المؤلفون: Guo, Fei, Aygun, Kemal, Becker, W. Dale, Talocia, Stefano Grivet, Hejase, Jose A., Wong, Wui-Weng, Zhou, Tingdong, Barnes, Heidi, Peng, Zhen, Pelger, Alexander, Sahouli, Mohamed, Schutt-Aine, Jose, Ling, Feng, Griese, Elmar, Paladhi, Pavel Roy, Sharma, Rohit, Pham, Nam, Winkel, Thomas-Michael, Fledell, Evan, Hill, Michael J., Silva, Benjamin, Hu, Kaisheng, Aronsson, Jonatan, Liu, Chang, Jeong, Yiru, Yilmaz, Ali E.

المصدر: 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

الاتاحة: http://dx.doi.org/10.1109/epeps51341.2021.9609142
http://xplorestaging.ieee.org/ielx7/9607744/9609110/09609142.pdf?arnumber=9609142

المؤلفون: Hessel, Andreas, Scholz, Stefan, Pelger, Alexander, Pfander, Albert, Knoch, Joachim

المصدر: 2017 47th European Solid-State Device Research Conference (ESSDERC) ; page 272-275

الاتاحة: http://dx.doi.org/10.1109/essderc.2017.8066644
http://xplorestaging.ieee.org/ielx7/8059714/8066575/08066644.pdf?arnumber=8066644

المؤلفون: Hessel, Andreas, Scholz, Stefan, Pelger, Alexander, Pfander, Albert, Knoch, Joachim

المصدر: Piscataway, NJ : IEEE 272-275 (2017). doi:10.1109/ESSDERC.2017.8066644 ; 2017 47th European Solid-State Device Research Conference (ESSDERC) : 11-14 Sept. 2017 / [organizers: IMEC, KU Leuven MICAS ; technical co-sponsorship: IEEE] ; technical co-sponsorship: IEEE] 47. European Solid-State Device Research Conference, ESSDERC, Leuven, Belgium, 2017-09-11 - 2017-09-14

مصطلحات موضوعية: artificial nose, cantilever array, cantilever scaling, cantilever sensor, self-oscillation

جغرافية الموضوع: DE

Relation: info:eu-repo/semantics/altIdentifier/isbn/978-1-5090-5979-9; info:eu-repo/semantics/altIdentifier/isbn/978-1-5090-5978-2; info:eu-repo/semantics/altIdentifier/issn/1930-8876; info:eu-repo/semantics/altIdentifier/isbn/978-1-5090-5977-5; info:eu-repo/semantics/altIdentifier/issn/2378-6558; info:eu-repo/semantics/altIdentifier/wos/WOS:000426914100068; https://publications.rwth-aachen.de/record/717853; https://publications.rwth-aachen.de/search?p=id:%22RWTH-2018-221363%22

الاتاحة: https://publications.rwth-aachen.de/record/717853
https://publications.rwth-aachen.de/search?p=id:%22RWTH-2018-221363%22