المؤلفون: Dai, Haitao, Kegerreis, Corey, Gamage, Deepal Wehella, Egan, Jonathan, Nielsen, Max, Chen, Yuan, Tuckerman, David, Peek, Sherman E., Yelamanchili, Bhargav, Hamilton, Michael, Das, Rabindra, Herr, Anna, Herr, Quentin

مصطلحات موضوعية: Condensed Matter - Superconductivity

URL الوصول: http://arxiv.org/abs/2109.01808

المؤلفون: Mahdi, Muntasir, Peek, Sherman E., Shah, Archit, Tillman, Chase C., Sellers, John A., Christy, Andrew, Xiong, Yuzan, Do, Nga T., Kim, Tae Hee, Zhang, Wei, Hamilton, Michael C.

المصدر: IEEE Transactions on Applied Superconductivity ; page 1-6 ; ISSN 1051-8223 1558-2515 2378-7074

الاتاحة: https://doi.org/10.1109/tasc.2025.3532579
http://xplorestaging.ieee.org/ielx8/77/6353170/10848307.pdf?arnumber=10848307

المؤلفون: Shah, Archit, Peek, Sherman E., Yelamanchili, Bhargav, Gupta, Vaibhav, Tuckerman, David B., Cantaloube, Chris, Sellers, John A., Hamilton, Michael C.

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ; page 276-282

الاتاحة: https://doi.org/10.1109/ectc51906.2022.00052
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816510.pdf?arnumber=9816510

المؤلفون: Mahdi, Muntasir, Yelamanchili, Bhargav, Shah, Archit, Peek, Sherman E., Xiong, Yuzan, Christy, Andrew, Nguyen, Dan-Chi, Kim, Tae Hee, Zhang, Wei, Hamilton, Michael C.

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

الاتاحة: http://dx.doi.org/10.1109/ectc51529.2024.00381
http://xplorestaging.ieee.org/ielx8/10564841/10564831/10564935.pdf?arnumber=10564935

المؤلفون: Peek, Sherman E., Shah, Archit, Yelamanchili, Bhargav, Gupta, Vaibhav, Sellers, John A., Tuckerman, David B., Hamilton, Michael C.

المصدر: IOP Conference Series: Materials Science and Engineering ; volume 1241, issue 1, page 012027 ; ISSN 1757-8981 1757-899X

الاتاحة: http://dx.doi.org/10.1088/1757-899x/1241/1/012027
https://iopscience.iop.org/article/10.1088/1757-899X/1241/1/012027
https://iopscience.iop.org/article/10.1088/1757-899X/1241/1/012027/pdf

المؤلفون: Yelamanchili, Bhargav, Shah, Archit, Peek, Sherman E., Gupta, Vaibhav, Sellers, John A., Tuckerman, David B., Hamilton, Michael C.

المساهمون: Microsoft

المصدر: IEEE Transactions on Applied Superconductivity ; volume 32, issue 4, page 1-5 ; ISSN 1051-8223 1558-2515 2378-7074

الاتاحة: https://doi.org/10.1109/tasc.2022.3149729
http://xplorestaging.ieee.org/ielx7/77/9646455/09707666.pdf?arnumber=9707666

المؤلفون: Shah, Archit, Gupta, Vaibhav, Yelamanchili, Bhargav, Peek, Sherman E., Chowdhury, Md. Fahim F., Rashid, Asmaul Smitha, Goteti, Uday S., Sellers, John A., Tuckerman, David B., Hamilton, Michael C.

المصدر: IEEE Transactions on Applied Superconductivity ; volume 31, issue 5, page 1-6 ; ISSN 1051-8223 1558-2515 2378-7074

الاتاحة: https://doi.org/10.1109/tasc.2021.3062566
http://xplorestaging.ieee.org/ielx7/77/9351575/09364737.pdf?arnumber=9364737

المؤلفون: Hamilton, Michael C., Yelamanchili, Bhargav, Shah, Archit, Peek, Sherman E., Bankson, Stephen, Tillman, Chase C.

المصدر: 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022

الاتاحة: http://dx.doi.org/10.1109/ims37962.2022.9865377
http://xplorestaging.ieee.org/ielx7/9865233/9865240/09865377.pdf?arnumber=9865377

المؤلفون: Hughes, George D., Peek, Sherman E., Shah, Archit, Hamilton, Michael C., Adams, Mark L.

المصدر: IEEE Transactions on Applied Superconductivity; 2024, Vol. 34 Issue: 3 p1-6, 6p

المؤلفون: Peek, Sherman E., Ward, Jacob, Bankson, Stephen, Shah, Archit, Sellers, John A., Adams, Mark L., Hamilton, Michael C.

المساهمون: Office of Naval Research

المصدر: Journal of Materials Research ; volume 37, issue 12, page 1978-1985 ; ISSN 0884-2914 2044-5326

الاتاحة: http://dx.doi.org/10.1557/s43578-022-00610-5
https://link.springer.com/content/pdf/10.1557/s43578-022-00610-5.pdf
https://link.springer.com/article/10.1557/s43578-022-00610-5/fulltext.html

المؤلفون: Schmidgall, Emma R., Griggio, Flavio, Thiel, George H., Peek, Sherman E., Yelamanchili, Bhargav, Shah, Archit, Gupta, Vaibhav, Sellers, John A., Hamilton, Michael C., Tuckerman, David B., d'Hollosy, Samuel

المصدر: 2021 IEEE International Reliability Physics Symposium (IRPS)

الاتاحة: http://dx.doi.org/10.1109/irps46558.2021.9405090
http://xplorestaging.ieee.org/ielx7/9405068/9405088/09405090.pdf?arnumber=9405090

المؤلفون: Peek, Sherman E., Shah, Archit, Gleason, Grant, Ward, Jacob, Adams, Mark L., Hamilton, Michael C.

المصدر: IEEE Transactions on Applied Superconductivity; August 2023, Vol. 33 Issue: 5 p1-5, 5p

المؤلفون: Goyal, Harshil, Peek, Sherman E., Sellers, John A., Hamilton, Michael C.

المصدر: IEEE Transactions on Applied Superconductivity; August 2023, Vol. 33 Issue: 5 p1-5, 5p