المؤلفون: Xunyuan Zhang, B. Peethala, Takeshi Nogami, James J. Demarest, O. van der Straten, Xiaoxuan Sun, Chao-Kun Hu, Xuan Lin, Marinus Hopstaken, Motoyama Koichi, James J. Kelly, Paul S. McLaughlin

المصدر: ECS Transactions. 80:297-309

مصطلحات موضوعية: Interconnection, Chemistry, Bilayer, Nanotechnology, Dissolution

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::829d54c86b521cff0c8ec762ba695bcd
https://doi.org/10.1149/08004.0297ecst

المؤلفون: Lynne Gignac, Hosadurga Shobha, Paul S. McLaughlin, M. Ali, Chao-Kun Hu, James J. Demarest, C. M. Breslin, Y. Ostrovski, G. Lian, J. Benedict, X.-H. Liu, Jiamin Ni, Cyril Cabral, Motoyama Koichi

المصدر: 2018 IEEE International Electron Devices Meeting (IEDM).

مصطلحات موضوعية: 010302 applied physics, Materials science, business.industry, Alloy, 02 engineering and technology, Activation energy, engineering.material, 021001 nanoscience & nanotechnology, Thermal diffusivity, 01 natural sciences, Electromigration, CMOS, Electrical resistivity and conductivity, 0103 physical sciences, engineering, Optoelectronics, Node (circuits), 0210 nano-technology, business, Scaling

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f03817fcd189540ad782b449873da287
https://doi.org/10.1109/iedm.2018.8614678

المؤلفون: Paul S. McLaughlin, Thomas J. Haigh, Devika Sil, Huai Huang, Nicholas A. Lanzillo, Raghuveer R. Patlolla, Pranita Kerber, Hosadurga Shobha, James Chingwei Li, C. B. Pcethala, Yongan Xu, Donald F. Canaperi, James J. Demarest, Elbert E. Huang, Chanro Park, Clevenger Leigh Anne H, Benjamin D. Briggs, Licausi Nicholas, Jae Gon Lee, M. Ali, Son Nguyen, Young-Wug Kim, Theodorus E. Standaert, C. T. Le, G. Lian, Griselda Bonilla, Errol Todd Ryan, Han You, David L. Rath

المصدر: 2018 IEEE International Interconnect Technology Conference (IITC).

مصطلحات موضوعية: Line resistance, Materials science, Electrical resistivity and conductivity, business.industry, Audio time-scale/pitch modification, Optoelectronics, Insulator (electricity), Dielectric, business, Scaling, Electronic mail, Exponential function

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1274e1c098e6a464c29d7db0ba284e69
https://doi.org/10.1109/iitc.2018.8430476

المؤلفون: Yongan Xu, Peethala Cornelius Brown, Hosadurga Shobha, Chanro Park, Huai Huang, Devika Sil, Pranita Kerber, Raghuveer R. Patlolla, David L. Rath, Clevenger Leigh Anne H, M. Ali, James Chingwei Li, Jae Gon Lee, Paul S. McLaughlin, Benjamin D. Briggs, Thomas J. Haigh, C. T. Le, G. Lian, Theodorus E. Standaert, Son Nguyen, Nicholas A. Lanzillo, Licausi Nicholas, Donald F. Canaperi, Elbert E. Huang, Errol Todd Ryan, Han You, Griselda Bonilla, James J. Demarest, Young-Wug Kim

المصدر: 2017 IEEE International Electron Devices Meeting (IEDM).

مصطلحات موضوعية: 010302 applied physics, business.industry, Time-dependent gate oxide breakdown, Insulator (electricity), 02 engineering and technology, Overlay, Dielectric, 021001 nanoscience & nanotechnology, 01 natural sciences, 0103 physical sciences, Optoelectronics, 0210 nano-technology, Contact area, business, Scaling, Critical dimension

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f1f8dc8cee4ebcaca4c79a7edeb4570c
https://doi.org/10.1109/iedm.2017.8268388

المؤلفون: Donald F. Canaperi, Raghuveer R. Patlolla, Daniel C. Edelstein, Griselda Bonilla, Huai Huang, Wei Wang, E. Todd Ryan, Paul S. McLaughlin, Xunyuan Zhang, Juntao Li, Terry A. Spooner, Eric G. Liniger, Frank W. Mont, Chao-Kun Hu, C. Labelle

المصدر: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

مصطلحات موضوعية: 010302 applied physics, Materials science, Dielectric strength, business.industry, Electrical engineering, Copper interconnect, chemistry.chemical_element, Time-dependent gate oxide breakdown, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, Electromigration, Ruthenium, Laser linewidth, chemistry, Electrical resistivity and conductivity, 0103 physical sciences, Optoelectronics, 0210 nano-technology, business, Temperature coefficient

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::38407d3e5ed6268183f862873faae6ac
https://doi.org/10.1109/iitc-amc.2016.7507650

المؤلفون: Dileep N. Netrabile, Timothy D. Sullivan, Paul S. McLaughlin, Jeanne P. Bickford, Peter A. Habitz, Baozhen Li

المصدر: IEEE Transactions on Device and Materials Reliability. 11:86-91

مصطلحات موضوعية: Engineering, business.industry, InformationSystems_INFORMATIONSYSTEMSAPPLICATIONS, Failure probability, ComputerApplications_COMPUTERSINOTHERSYSTEMS, Integrated circuit design, Chip, Electromigration, Electronic, Optical and Magnetic Materials, Reliability engineering, Reliability (semiconductor), Chip-scale package, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ce2fcecedb291a010a8c21fd53289351
https://doi.org/10.1109/tdmr.2010.2093526

المؤلفون: Vamsi Paruchuri, Juntao Li, Takeshi Nogami, Daniel C. Edelstein, Terry A. Spooner, Stephan A. Cohen, Theodorus E. Standaert, Moosung M. Chae, James J. Kelly, Terence Kane, Donald F. Canaperi, Elbert E. Huang, Benjamin D. Briggs, Raghuveer R. Patlolla, Deepika Priyadarshini, Sevim Korkmaz, Paul S. McLaughlin, Christopher Parks, Christopher J. Penny, Anita Madan, Xunyuan Zhang, Hosadurga Shobha, Wei Wang, Son Nguyen, Thomas M. Shaw

المصدر: 2015 IEEE International Electron Devices Meeting (IEDM).

مصطلحات موضوعية: Self forming, Atomic layer deposition, Materials science, chemistry, business.industry, Optoelectronics, chemistry.chemical_element, Nanotechnology, Node (circuits), business, Cobalt, Wetting layer

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f55e6617005625c40a3affb699b4b476
https://doi.org/10.1109/iedm.2015.7409651

المؤلفون: Gregory G. Freeman, E. J. Nowak, L. Sigal, Daniel J. Poindexter, Narasimha Rao Mavilla, C-H. Lin, Mohit Bajaj, Suresh Gundapaneni, James D. Warnock, Steven W. Mittl, Richard A. Wachnik, C. Scott, Noah Zamdmer, Paul S. McLaughlin, Siyuranga O. Koswatta, Sungjae Lee, J. Johnson

المصدر: 2015 IEEE International Electron Devices Meeting (IEDM).

مصطلحات موضوعية: Stress (mechanics), Mean time between failures, Reliability (semiconductor), Materials science, Electronic engineering, Degradation (geology), State (computer science), Self heating, Electromigration, Temperature measurement

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0484137733726941aea4a283056a8530
https://doi.org/10.1109/iedm.2015.7409740

المؤلفون: Clevenger Lawrence A, James J. Demarest, Kaushik Chanda, Birendra N. Agarwala, Chao-Kun Hu, Du B. Nguyen, Chih-Chao Yang, Paul S. McLaughlin, H. S. Rathore

المصدر: ECS Transactions. 1:77-91

مصطلحات موضوعية: Materials science, chemistry, business.industry, chemistry.chemical_element, Optoelectronics, Dielectric, business, Copper, Electromigration

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b9376e3cd4aec012353f09a0ecdf5a63
https://doi.org/10.1149/1.2218480

المؤلفون: Baozhen Li, Xiao Hu Liu, Junjing Bao, Paul S. McLaughlin, R. G. Filippi, Ping-Chuan Wang, Lijuan Zhang

المصدر: 2013 IEEE International Reliability Physics Symposium (IRPS).

مصطلحات موضوعية: Void (astronomy), Materials science, chemistry.chemical_element, Activation energy, Electromigration, Copper, Cathode, Anode, law.invention, Compressive strength, chemistry, law, Extrusion, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::25f00bd4b7d1b46cc117427f4a2021c4
https://doi.org/10.1109/irps.2013.6531954

المؤلفون: Michael V. Aquilino, Jaeger Daniel, J. Koshy, E. Engbrecht, Edward P. Maciejewski, L. Zhuang, Mahender Kumar, G. Costrini, J. Gill, Paul D. Agnello, Rajeev Malik, Jin Cai, Gregory G. Freeman, S. Lucarini, N. Arnold, Geng Wang, David M. Fried, Matthew W. Stoker, R. Bolam, Dimitris P. Ioannou, Katsunori Onishi, Paul C. Parries, Richard Wise, Alvin G. Thomas, Min Dai, Viorel Ontalus, Jessica Dechene, Shreesh Narasimha, Robert R. Robison, Judson R. Holt, Dechao Guo, Paul Chang, Naftali E. Lustig, Michael P. Chudzik, Basanth Jagannathan, Paul S. McLaughlin, Bernard A. Engel, Xiaolin Li, Amit Kumar, W. Kong, Rishikesh Krishnan, Barry P. Linder, J. Norum, C. DeWan, Claude Ortolland, Karen A. Nummy, Michael A. Gribelyuk, Jae Gon Lee, Christopher D. Sheraw, G. Han, C-H. Lin, Benjamin Cipriany, Takashi Ando, N. Habib, J. Johnson

المصدر: 2012 International Electron Devices Meeting.

مصطلحات موضوعية: Hardware_MEMORYSTRUCTURES, Materials science, Memory hierarchy, business.industry, Copper interconnect, Electrical engineering, Silicon on insulator, Hardware_PERFORMANCEANDRELIABILITY, PMOS logic, CMOS, MOSFET, Hardware_INTEGRATEDCIRCUITS, business, Dram, NMOS logic, Hardware_LOGICDESIGN

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8c61f3f0814bd02ce1388effadad931e
https://doi.org/10.1109/iedm.2012.6478971

المؤلفون: B. Redder, Ping-Chuan Wang, R. G. Filippi, Paul S. McLaughlin, A. Brendler, J. Poulin, James R. Lloyd, James J. Demarest

المصدر: 2011 International Reliability Physics Symposium.

مصطلحات موضوعية: Materials science, chemistry, Metallurgy, chemistry.chemical_element, Copper, Electromigration

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::18465abaed1ba5ace3fba426e109548f
https://doi.org/10.1109/irps.2011.5784438

المؤلفون: Oluwafemi O. Ogunsola, Fen Chen, Andrew H. Simon, Shaoning Yao, Stephan Grunow, Tom C. Lee, Baozhen Li, Paul S. McLaughlin, Matthew Angyal, Vincent J. McGahay, Cathryn Christiansen

المصدر: MRS Proceedings. 1335

مصطلحات موضوعية: Materials science, Stress migration, Metallurgy, Alloy, engineering, Interconnect technology, Node (circuits), engineering.material, Electromigration, Shut down

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f2f1ae5aedfda0e9da1312fcfc0b12ff
https://doi.org/10.1557/opl.2011.1261

المؤلفون: R. G. Filippi, B. Redder, Paul S. McLaughlin, Ping-Chuan Wang, J. Poulin, A. Brendler, James R. Lloyd, James J. Demarest

المصدر: 2009 IEEE International Reliability Physics Symposium.

مصطلحات موضوعية: Void (astronomy), Materials science, Log-normal distribution, Nucleation, Copper interconnect, Electronic engineering, Dielectric, Composite material, Electromigration, Current density, Failure mode and effects analysis

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::84e029923a8217395eaaa22d9587ec87
https://doi.org/10.1109/irps.2009.5173295

المؤلفون: Anthony K. Stamper, M. Shinosky, Alvin W. Strong, James R. Lloyd, F. Chen, Paul S. McLaughlin, Kaushik Chanda, Ravi Achanta, O. Bravo, Sujatha Sankaran, Z.X. He, E. Gebreselasie

المصدر: 2008 IEEE International Reliability Physics Symposium.

مصطلحات موضوعية: Stress (mechanics), Materials science, Electric field, Electronic engineering, Time-dependent gate oxide breakdown, Curvature, Scaling, Intensity (heat transfer), Finite element method, Line (formation), Computational physics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::14a40c6fc87174845367130d7d0b6b24
https://doi.org/10.1109/relphy.2008.4558874

المؤلفون: Eva E. Simonyi, William F. Landers, T. H. Ivers, Thomas M. Shaw, K. Ida, D. Jung, Sujatha Sankaran, Kaushal Patel, Johnny Widodo, Naftali E. Lustig, M. Chae, Kaushik Chanda, G. A. Biery, Wan-jae Park, J. Sucharitaves, W. Liu, T. Ko, Christos D. Dimitrakopoulos, M. Kelling, Stephen M. Gates, R. G. Filippi, D. Nielsen, John A. Fitzsimmons, O. Bravo, M. Beck, Satya V. Nitta, Terry A. Spooner, L. Economikos, T. Bolom, Alfred Grill, John G. Pellerin, X. Liu, Eric G. Liniger, G. Matusiewicz, E. Kaltalioglu, C. Tian, Mukta G. Farooq, F. Chen, David L. Rath, Griselda Bonilla, D. Nguyen, Nicholas C. M. Fuller, P. Davis, S. Arai, Daniel C. Edelstein, J.P. Doyle, Kevin S. Petrarca, P. Ong, Kaushik A. Kumar, H. Wendt, L. Wiggins, V. Patel, Stephan Grunow, W. Li, L. Nicholson, I. Melville, Sanjay Mehta, Stephen E. Greco, J. Werking, Robert L. Wisnieff, B. Moon, Darryl D. Restaino, S. Marokkey, R. Hannon, Myoung-Bum Lee, Theodorus E. Standaert, Shom Ponoth, Paul S. McLaughlin, R. Augur, P. V. McLaughlin, C. Labelle, A. Cowley, H. Shoba, S. Rhee, K. Malone, Stephan A. Cohen, Michael Lane, E.T. Ryan, H. Landis, Larry Clevenger, James R. Lloyd, James J. Demarest, Andrew H. Simon, K. Miyata

المصدر: 2006 International Electron Devices Meeting.

مصطلحات موضوعية: Back end of line, Reliability (semiconductor), Materials science, CMOS, Homogeneous, business.industry, Plasma-enhanced chemical vapor deposition, Electronic engineering, Copper interconnect, Optoelectronics, Node (circuits), Parasitic extraction, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::78f866f42f2dc1939f7fea86854709e4
https://doi.org/10.1109/iedm.2006.346782

المؤلفون: Jason Gill, Timothy D. Sullivan, Paul S. McLaughlin, Cathryn Christiansen, Baozhen Li

المصدر: 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual..

مصطلحات موضوعية: Interconnection, Materials science, business.industry, Contact resistance, Electronic engineering, Copper interconnect, Redundancy (engineering), Optoelectronics, business, Line extension, Shape of the distribution, Electromigration, Top cap

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f0727ec0d9f4ca4846bb9dbc9a28b278
https://doi.org/10.1109/relphy.2005.1493056

المؤلفون: Jason Gill, Vincent J. McGahay, Yanfeng Wang, Alexander J. Swinton, Richard A. Wachnik, Edward Barth, R. Rosenberg, X.-H. Liu, H. S. Rathore, Paul S. McLaughlin, J.F. McGrath, Brett H. Engel, Michael Lane, G. Goth, Terry A. Spooner, William F. Landers, Conal E. Murray, Ping-Chuan Wang, Timothy M. Shaw, C. Barile, James R. Lloyd, T. H. Ivers, John M. Aitken, G. A. Biery, James J. Demarest, R. Goldblatt, Charles R. Davis, R. G. Filippi, L. Nicholson

المصدر: 2004 IEEE International Reliability Physics Symposium. Proceedings.

مصطلحات موضوعية: Stress (mechanics), Reliability (semiconductor), Materials science, Yield (engineering), chemistry, Electronic engineering, Copper interconnect, Low-k dielectric, chemistry.chemical_element, Dielectric, Atmospheric temperature range, Composite material, Copper

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::942a3df374b515e5dcd81e19921190cb
https://doi.org/10.1109/relphy.2004.1315302

المؤلفون: Ian D. Melville, Henry A. Nye, Edward Barth, Paul S. McLaughlin, John A. Fitzsimmons, X. Chen, Vincent J. McGahay, T. H. Ivers, G. A. Biery, D.K. Manger, T.C. Chen, A. McDonald, E.N. Levine, Spooner Terry A, Ronald D. Goldblatt, S.E. Greco, C. DeWan

المصدر: Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407).

مصطلحات موضوعية: Materials science, business.industry, Electrical engineering, Copper interconnect, Silicon on insulator, chemistry.chemical_element, Fluorosilicate glass, Copper, Reliability (semiconductor), chemistry, CMOS, Hardware_INTEGRATEDCIRCUITS, Optoelectronics, Node (circuits), Static random-access memory, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2a0970f1f15214c5bdd917df14396507
https://doi.org/10.1109/iitc.2000.854330

المؤلفون: Shafaat Ahmed, Qiang Huang, Tien Cheng, Paul Findeis, Craig R Gruszecki, Andrew H Simon, Paul S Mclaughlin, Naftali Lustig, Edward Engbrecht, Mark N Lakritz, Pei I Wang, Christa L Montgomery, Surbhi Mittal, Frieder H Baumann, Connie-Nga Truong, Brett C. Baker-O'neal, Sarah L Grunow, Michael P Chudzik, Stephan Grunow

المصدر: ECS Meeting Abstracts. :1442-1442

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::51fb99006c7cbd5eff93b09966dd045f
https://doi.org/10.1149/ma2014-01/39/1442