يعرض 1 - 20 نتائج من 24 نتيجة بحث عن '"Panu Pekko"', وقت الاستعلام: 0.58s تنقيح النتائج
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    المصدر: Jaakkola, A, Gorelick, S, Prunnila, M, Dekker, J, Pensala, T & Pekko, P 2014, Long term stability and quality factors of degenerately n-type doped silicon resonators . in IEEE International Frequency Control Symposium (FCS 2014) ., 6859866, IEEE Institute of Electrical and Electronic Engineers, IEEE International Frequency Control Symposium, IFCS 2014, Taipei, Taiwan, Province of China, 19/05/14 . https://doi.org/10.1109/FCS.2014.6859866

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    المصدر: Jaakkola, A, Prunnila, M, Pensala, T, Dekker, J & Pekko, P 2013, Experimental determination of the temperature dependency of the elastic constants of degenerately doped silicon . in Joint European Frequency and Time Forum & International Frequency Control Symposium, EFTF/IFC 2013 . IEEE Institute of Electrical and Electronic Engineers, pp. 421-424, Joint European Frequency and Time Forum and International Frequency Control Symposium, EFTF/IFC 2013, Prague, Czech Republic, 21/07/13 . https://doi.org/10.1109/EFTF-IFC.2013.6702116

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    المساهمون: Gusev, Evgeni, Garfunkel, Eric, Dideikin, Arthur

    المصدر: Kiihamäki, J, Kattelus, H, Blomberg, M, Puurunen, R, Laamanen, M, Pekko, P, Saarilahti, J, Ritala, H & Rissanen, A 2010, Low-Temperature Processes for MEMS Device Fabrication . in E Gusev, E Garfunkel & A Dideikin (eds), Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators . Springer, NATO Science for Peace and Security Series B: Physics and Biophysics, pp. 167-178, NATO Advanced Research Workshop on Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators, St. Petersburg, Russian Federation, 29/06/09 . https://doi.org/10.1007/978-90-481-3807-4_13
    NATO Science for Peace and Security Series B: Physics and Biophysics ISBN: 9789048138050

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    المصدر: Alastalo, A, Kyynäräinen, J, Seppä, H, Kärkkäinen, A, Pesonen, N, Lahdes, M, Vähä-Heikkilä, T, Pekko, P & Dekker, J 2004, Wideband microwave power sensor based on MEMS technology . in 2004 Conference on Precision Electromagnetic Measurements Digest . IEEE Institute of Electrical and Electronic Engineers, pp. 115-116, 2004 Conference on Precision Electromagnetic Measurements, CPEM 2004, London, United Kingdom, 27/06/04 . https://doi.org/10.1109/CPEM.2004.305487

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    المساهمون: Righini, Giancarlo C.

    المصدر: Yliniemi, S, Aalto, T, Heimala, P, Pekko, P, Jefimovs, K & Uusitupa, T 2003, Fabrication of photonic crystal waveguide elements on SOI . in G C Righini (ed.), Integrated Optical Devices : Fabrication and Testing . International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 4944, pp. 23-31, Photonics Fabrication Europe 2002 (PFE'02), Bruges, Belgium, 30/10/02 . https://doi.org/10.1117/12.468303

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    المصدر: Halme, J, Sillanpää, T, Pekko, P, Heikkinen, M & Oja, A 2002, ' Micromechanical acoustic emission sensors for condition monitoring ', Paper presented at 15th International Congress on Condition Monitoring and Diagnostic Engineering Management, COMADEM 2002, Birmingham, United Kingdom, 2/09/02-4/09/02 .
    VTT Technical Research Centre of Finland-PURE

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    Academic Journal
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    Academic Journal

    المصدر: Microsystem Technologies; Dec2005, Vol. 12 Issue 1/2, p169-172, 4p

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    المصدر: VTT Technical Research Centre of Finland-PURE
    Saarilahti, J, Sillanpää, T, Pekko, P & Kiihamäki, J 2004, Manufacturing and applications of surface-micromachined and SOI-based cMUTs . in 4th International Workshop on Micromachined Ultrasonic Trasducers (MUT-2004) : Florence, Italy, June 17-18, 2004 . ESAOTE .

    مصطلحات موضوعية: transducer, ultrasonic, cMUT, micromachined, MUT

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    المصدر: VTT Technical Research Centre of Finland-PURE
    Sillanpää, T, Pekko, P, Oja, A, Heikkinen, M, Kiihamäki, J, Halme, J & Seppä, H 2002, Micromechanical acoustic emission sensor . in Eurosensors XVI Book of Abstracts . vol. Part 1, Czech Technical University, pp. 205-206, 16th European Conference on Solid-State Transducers, Eurosensors XVI, Prague, Czech Republic, 15/09/02 .

    مصطلحات موضوعية: LTCC package, vibration sensor, acoustic emission