المؤلفون: Xie, X.F., Wang, Z.Y., Zhong, Z.Q., Pan, D.Y., Hou, G.Y., Xiao, Q.

المصدر: animal ; volume 18, issue 5, page 101151 ; ISSN 1751-7311

الاتاحة: http://dx.doi.org/10.1016/j.animal.2024.101151
https://api.elsevier.com/content/article/PII:S175173112400082X?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S175173112400082X?httpAccept=text/plain

المؤلفون: Jin, Y., Wang, Z.F., Lim, P.C., Pan, D.Y., Wei, J., Wong, C.K.

المصدر: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) ; page 301-306

الاتاحة: http://dx.doi.org/10.1109/eptc.2003.1271534
http://xplorestaging.ieee.org/ielx5/8973/28473/01271534.pdf?arnumber=1271534

المؤلفون: Wang, Z.F., Cao, W., Arulvanan, P., Jin, Y.F., Pan, D.Y., Wang, Z.P.

المصدر: 4th Electronics Packaging Technology Conference, 2002. ; volume 4755, page 96-100

الاتاحة: http://dx.doi.org/10.1109/eptc.2002.1185605
http://xplorestaging.ieee.org/ielx5/8446/26603/01185605.pdf?arnumber=1185605

المؤلفون: Geng, Y.L., Xu, D., Wang, X.Q., Pan, D.Y., Zhang, G.H., Yu, G.W.

المصدر: Journal of Crystal Growth ; volume 280, issue 1-2, page 266-270 ; ISSN 0022-0248

الاتاحة: http://dx.doi.org/10.1016/j.jcrysgro.2005.03.037
https://api.elsevier.com/content/article/PII:S0022024805003301?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0022024805003301?httpAccept=text/plain

المؤلفون: Jin, Y., Wang, Z.F., Lim, P.C., Pan, D.Y., Wei, J., Wong, C.K.

المصدر: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003); 2003, p301-306, 6p

المؤلفون: Wang, Z.F., Cao, W., Arulvanan, P., Jin, Y.F., Pan, D.Y., Wang, Z.P.

المصدر: 4th Electronics Packaging Technology Conference, 2002; 2002, p96-100, 5p