المؤلفون: Kreupl, F., Duesberg, G. S., Graham, A. P., Liebau, M., Unger, E., Seidel, R., Pamler, W., Hoenlein, W.

مصطلحات موضوعية: Condensed Matter - Materials Science

URL الوصول: http://arxiv.org/abs/cond-mat/0410360

المؤلفون: Boubekeur, H., Mikolajick, T., Pamler, W., Ho¨pfner, J., Frey, L., Ryssel, H.

المصدر: Journal of Applied Physics; 9/15/2002, Vol. 92 Issue 6, p3257, 9p, 1 Black and White Photograph, 3 Diagrams, 10 Graphs

مصطلحات موضوعية: PLATINUM electrodes, FERROELECTRICITY, BACKSCATTERING

المؤلفون: Pamler, W., Marinero, E. E.

المصدر: Journal of Applied Physics. 3/15/1987, Vol. 61 Issue 6, p2294. 7p. 4 Graphs.

مصطلحات موضوعية: *TELLURIUM, *THIN films

المؤلفون: Wendt, H., Cerva, H., Lehmann, V., Pamler, W.

المصدر: Journal of Applied Physics; 3/15/1989, Vol. 65 Issue 6, p2402, 4p

مصطلحات موضوعية: METAL inclusions, COPPER, SILICON oxide, DIFFUSION

المؤلفون: Kohlhase, A., Mändl, M., Pamler, W.

المصدر: Journal of Applied Physics; 3/15/1989, Vol. 65 Issue 6, p2464, 6p

مصطلحات موضوعية: TITANIUM nitride, FRACTURE mechanics, DIFFUSION

المؤلفون: Schloesser, T., Jakubowski, F., Kluge, J. v., Graham, A., Slesazeck, S., Popp, M., Baars, P., Muemmler, K., Moll, P., Wilson, K., Buerke, A., Koehler, D., Radecker, J., Erben, E., Zimmermann, U., Vorrath, T., Fischer, B., Aichmayr, G., Agaiby, R., Pamler, W., Schuster, T., Bergner, W., Mueller, W.

المصدر: 2008 IEEE International Electron Devices Meeting

الاتاحة: http://dx.doi.org/10.1109/iedm.2008.4796820
http://xplorestaging.ieee.org/ielx5/4786613/4796592/04796820.pdf?arnumber=4796820

المؤلفون: Stich, A., Gabric, Z., Pamler, W., Schindler, G., Traving, M., Engelhardt, M.

المصدر: 2006 International Interconnect Technology Conference ; volume 2005, page 134-136

الاتاحة: http://dx.doi.org/10.1109/iitc.2006.1648668
http://xplorestaging.ieee.org/ielx5/10964/34566/01648668.pdf?arnumber=1648668

المؤلفون: Guedj, C., Arnal, V., Girault, V., Imbert, G., Daamen, R., Hoofman, R.J.O.M., Gaillard, F., Gosset, L., Assous, M., Bouchu, D., Mitard, J., Toffoli, A., Jousseaume, V., Favennec, L., Stich, A., Pamler, W., Gabric, Z., Torres, J., Passemard, G., Arnaud, L.

المصدر: 2006 International Interconnect Technology Conference ; volume 45, page 207-209

الاتاحة: http://dx.doi.org/10.1109/iitc.2006.1648695
http://xplorestaging.ieee.org/ielx5/10964/34566/01648695.pdf?arnumber=1648695

المؤلفون: Seidel, R., Graham, A.P., Unger, E., Duesberg, G.S., Liebau, M., Steinhoegl, W., Pamler, W., Kreupl, F.

المصدر: 4th IEEE Conference on Nanotechnology, 2004. ; page 7-9

الاتاحة: http://dx.doi.org/10.1109/nano.2004.1392231
http://xplorestaging.ieee.org/ielx5/9589/30307/01392231.pdf?arnumber=1392231

المؤلفون: Rosner, W., Landgraf, E., Kretz, I., Dreeskomfeld, L., Schafer, H., Stadele, M., Schulz, T., Hofmann, F., Luyken, R.J., Specht, M., Hartwich, J., Pamler, W., Risch, L.

المصدر: International Semiconductor Device Research Symposium, 2003 ; volume 763, page 452-453

الاتاحة: http://dx.doi.org/10.1109/isdrs.2003.1272182
http://xplorestaging.ieee.org/ielx5/8974/28477/01272182.pdf?arnumber=1272182

المؤلفون: Gabric, Z., Pamler, W., Schindler, G., Steinhogl, W., Traving, M.

المصدر: Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) ; page 151-153

الاتاحة: http://dx.doi.org/10.1109/iitc.2004.1345723
http://xplorestaging.ieee.org/ielx5/9318/29623/01345723.pdf?arnumber=1345723

المؤلفون: Joswig, H., Pamler, W.

المصدر: Seventh International IEEE Conference on VLSI Multilevel Interconnection ; page 477

الاتاحة: http://dx.doi.org/10.1109/vmic.1990.127935
http://xplorestaging.ieee.org/ielx2/181/3586/00127935.pdf?arnumber=127935

المؤلفون: Pamler, W.

المصدر: 2001 6th International Symposium on Plasma- and Process-Induced Damage (IEEE Cat. No.01TH8538) ; page 94-99

الاتاحة: http://dx.doi.org/10.1109/ppid.2001.929987
http://xplorestaging.ieee.org/ielx5/7404/20112/00929987.pdf?arnumber=929987

المؤلفون: Boubekeur, H., Mikolajick, T., Höpfner, J., Dehm, C., Pamler, W., Steiner, J., Kilian, G., Kolbesen, B.O., Bauer, A., Frey, L., Ryssel, H.

مصطلحات موضوعية: geo, anthro-se

Time: 670, 620, 530, 669

Relation: https://publica.fraunhofer.de/handle/publica/338346

الاتاحة: https://publica.fraunhofer.de/handle/publica/338346

المؤلفون: Kilian, G., Kolbesen, B.O., Rommel, M., Pamler, W., Unger, E., Höpfner, A.

مصطلحات موضوعية: TXRF, Elymat, contamination, silicon

Time: 670, 620, 530

Relation: Satellite Symposium on Crystalline Defects and Contamination - Their Impact and Control in Device Manufacturing (DECON) 2001; European Solid-State Device Research Conference (ESSDERC) 2001; Crystalline defects and contamination. Their impact and control in device manufacturing III; https://publica.fraunhofer.de/handle/publica/339341

الاتاحة: https://publica.fraunhofer.de/handle/publica/339341

المؤلفون: Bollmann, D., Braun, R., Buchner, R., Cao-Minh, U., Engelhardt, M., Errmann, G., Grabl, T., Hieber, K., Hubner, H., Kawala, G., Kleiner, M., Klumpp, A., Kuhn, S., Landesberger, C., Lezec, H., Muth, W., Pamler, W., Popp, R., Renner, E., Ruhl, G., Sanger, A., Scheler, U., Schmidt, C., Schwarzl, S., Weber, J., Weber, W., Ramm, P.

المصدر: European Workshop Materials for Advanced Metallization, ; page 94-98

الاتاحة: http://dx.doi.org/10.1109/mam.1998.887612
http://xplorestaging.ieee.org/ielx5/4897/19178/00887612.pdf?arnumber=887612

المؤلفون: Bertagnolli, E., Bollmann, D., Braun, R., Buchner, R., Engelhardt, M., Grassl, T., Hieber, K., Kawala, G., Kleiner, M., Klumpp, A., Kuhn, S., Landesberger, C., Pamler, W., Popp, R., Ramm, P., Renner, E., Ruhl, G., Scheler, U., Schmidt, C., Schwarzl, S., Weber, J., Sänger, A.

مصطلحات موضوعية: CMOS integrated circuits, integrated circuit design, integrated circuit interconnections, integrated circuit metallisation, integrated circuit packaging, integrated circuit reliability, wafer bonding

Relation: International Symposium on Semiconductor Wafer Bonding 1997; Fourth International Symposium on Semiconductor Wafer Bonding 1997. Proceedings. Science, technology, and applications; https://publica.fraunhofer.de/handle/publica/330659

الاتاحة: https://publica.fraunhofer.de/handle/publica/330659

المؤلفون: Engelhardt, M., Hübner, H., Jacobs, H., Kleiner, M., Kühn, S., Pamler, W., Renner, E., Sänger, A., Scheler, U., Schmidt, C., Schwarzl, S., Weber, W., Braun, R., Grassl, T., Hieber, K., Kawala, G., Klumpp, A., Landesberger, C., Popp, R., Ramm, P., Ruhl, G., Weber, J.

Relation: International Colloquium on Plasma Processes (CIP) 1997; CIP '97. 11th International Colloquium on Plasma Processes. Proceedings; https://publica.fraunhofer.de/handle/publica/329259

الاتاحة: https://publica.fraunhofer.de/handle/publica/329259

المؤلفون: Bollmann, D., Braun, R., Buchner, R., Cao-Minh, U., Engelhardt, M., Errmann, G., Grassl, T., Hieber, K., Hübner, H., Kawala, G., Kleiner, M., Klumpp, A., Kuhn, S., Landesberger, C., Lezec, H., Muth, W., Pamler, W., Popp, R., Renner, E., Ruhl, G., Scheler, U., Schmidt, C., Schwarzl, S., Weber, J., Weber, W., Ramm, P., Sänger, A.

مصطلحات موضوعية: integrated circuit interconnections, integrated circuit metallisation, thermal analysis, wafer bonding

Relation: European Workshop on Materials for Advanced Metallization (MAM) 1997; MAM '97. Abstracts booklet; https://publica.fraunhofer.de/handle/publica/329153

الاتاحة: https://publica.fraunhofer.de/handle/publica/329153

المؤلفون: Weber, W.M., Geelhaar, Graham, A.P., L., Unger, E., Duesber, G.S., Liebau, M., Pamler, W., Cheze, C., Riechert, H., Lugli, P.

مصطلحات موضوعية: info:eu-repo/classification/ddc

Relation: https://mediatum.ub.tum.de/1237957

الاتاحة: https://mediatum.ub.tum.de/1237957
https://doi.org/10.1021/nl0613858
http://pubs.acs.org/doi/abs/10.1021/nl0613858;