المؤلفون: M. Harmes, Shriram Ramanathan, Chang-min Park, P.R. Morrow, Mauro J. Kobrinsky

المصدر: IEEE Electron Device Letters. 27:335-337

مصطلحات موضوعية: Materials science, Wafer bonding, business.industry, Transistor, Stacking, Electrical engineering, Low-k dielectric, Integrated circuit, Electronic, Optical and Magnetic Materials, law.invention, CMOS, law, MOSFET, Optoelectronics, Wafer, Electrical and Electronic Engineering, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5decb5b2c5398792e7447d734427decb
https://doi.org/10.1109/led.2006.873424

المؤلفون: J.C. Robinson, F.L. Moore, P.R. Morrow, P.E. Williams, M.G. Raizen

المصدر: OSA Annual Meeting.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3b7c21c77b1f0028796aa215e9591ccd
https://doi.org/10.1364/oam.1993.mqq.3