نتائج البحث - "P. Weckx"

1

Academic Journal

Oxytocin Exposure in Labor and Its Relationship with Cognitive Impairment and the Genetic Architecture of Autism

المؤلفون: García-Alcón, Alicia (ORCID 0000-0003-1777-1795), González-Peñas, Javier, Weckx, Elisa, Penzol, M. J., Gurriarán, Xaquín, Costas, Javier, Díaz-Caneja, Covadonga M., Moreno, Carmen, Hernández, Patricia, Arango, Celso, Parellada, Mara

المصدر: Journal of Autism and Developmental Disorders. Jan 2023 53(1):66-79.

Peer Reviewed: Y

Page Count: 14

Descriptors: Genetics, Autism Spectrum Disorders, Prenatal Influences, Prenatal Care, Birth, Risk, Symptoms (Individual Disorders), Cognitive Development

2

Report

Thermodynamic behavior of short oligonucleotides in microarray hybridizations can be described using Gibbs free energy in a nearest-neighbor model

المؤلفون: Weckx, S., Carlon, E., De Vuyst, L., Van Hummelen, P.

المصدر: J. Phys. Chem. B 111, 13583 (2007)

مصطلحات موضوعية: Quantitative Biology - Biomolecules, Quantitative Biology - Quantitative Methods

URL الوصول: http://arxiv.org/abs/0711.2525

View record in Arxiv

3

Academic Journal

A Digital Twin of an Off Highway Vehicle based on a Low Cost Camera.

المؤلفون: Robyns, Steven, Heerwegh, Wouter, Weckx, Sam

المصدر: Procedia Computer Science; 2024, Vol. 232, p2366-2375, 10p

مصطلحات موضوعية: DIGITAL twins, CONSTRUCTION equipment industry, COMPUTER-aided design, GEOMETRIC modeling, CAMERAS

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4

Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs)

المؤلفون: S. Mishra, V. Sankatali, B. Vermeersch, M. Brunion, M. Lofrano, D. Abdi, H. Oprins, D. Biswas, O. Zografos, G. Hiblot, G. Van Der Plas, P. Weckx, G. Hellings, J. Myers, F. Catthoor, J. Ryckaert

المصدر: 2023 IEEE International Reliability Physics Symposium (IRPS).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::51dc6f7a95aa95aaa7ca984bcb7bb854
https://doi.org/10.1109/irps48203.2023.10117979

View record in OpenAIRE

5

Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network

المؤلفون: R. Chen, M. Lofrano, G. Mirabelli, G. Sisto, S. Yang, A. Jourdain, F. Schleicher, A. Veloso, O. Zografos, P. Weckx, G. Hiblot, G. Van der Plas, G. Hellings, J. Ryckaert, E. Beyne

المصدر: 2022 International Electron Devices Meeting (IEDM).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6de2c189d547620a20fa7349bceaab9b
https://doi.org/10.1109/iedm45625.2022.10019349

View record in OpenAIRE

6

Periodical

An exploratory analysis of parental autism traits, age at conception and polygenic background in Autism Spectrum Disorders

المؤلفون: García-Alcón, Alicia, González-Peñas, Javier, Penzol, María José, Gerez, Diego, Burdeus, Mónica, Weckx, Elisa, Andreu-Bernabeu, Álvaro, Moreno, Carmen, Parellada, Mara

المصدر: Spanish Journal of Psychiatry and Mental Health; January-March 2024, Vol. 17 Issue: 1 p28-34, 7p

7

Periodical

Egg allergy and yellow fever vaccination

المؤلفون: Cançado, Bárbara L.B., Aranda, Carolina S., Mallozi, Marcia C., Weckx, Lily Y., Solé, Dirceu

المصدر: Jornal de Pediatria; January-February 2024, Vol. 100 Issue: 1 p60-66, 7p

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8

Periodical

Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC

المؤلفون: Venkateswarlu, Sankatali, Mishra, Subrat, Oprins, Herman, Vermeersch, Bjorn, Brunion, Moritz, Han, Jun-Han, Stan, Mircea R., Biswas, Dwaipayan, Weckx, Pieter, Catthoor, Francky

المصدر: IEEE Transactions on Very Large Scale Integration Systems; December 2023, Vol. 31 Issue: 12 p1896-1904, 9p

9

Backside PDN and 2.5D MIMCAP to Double Boost 2D and 3D ICs IR-Drop beyond 2nm Node

المؤلفون: R. Chen, G. Sisto, M. Stucchi, A. Jourdain, K. Miyaguchi, P. Schuddinck, P. Woeltgens, H. Lin, N. Kakarla, A. Veloso, D. Milojevic, O. Zografos, P. Weckx, G. Hellings, G. Van Der Plas, J. Ryckaert, E. Beyne

المصدر: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8e8999a3bf4a73fc76a5aace1823e48e
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830328

View record in OpenAIRE

10

Academic Journal

A Questionnaire for Screening a Broad Range of DSM-Defined Anxiety Disorder Symptoms in Clinically Referred Children and Adolescents

المؤلفون: Muris, Peter, Dreessen, Laura, Bogels, Susan, Weckx, Miryam, van Melick, Marion

المصدر: Journal of Child Psychology and Psychiatry. May 2004 45(4):813-820.

Peer Reviewed: Y

Page Count: 8

Descriptors: Anxiety Disorders, Check Lists, Emotional Disturbances, Validity, Child Behavior, Adolescents, Measures (Individuals), Anxiety, Questionnaires, Children, Reliability, Symptoms (Individual Disorders), Referral, Scores, Correlation, Identification, Prediction

Assessment and Survey Identifiers: Child Behavior Checklist

11

Periodical

CFET SRAM With Double-Sided Interconnect Design and DTCO Benchmark

المؤلفون: Liu, Hsiao-Hsuan, Schuddinck, Pieter, Pei, Zhenlin, Verschueren, Lynn, Mertens, Hans, Salahuddin, Shairfe M., Hiblot, Gaspard, Xiang, Yang, Chan, Boon Teik, Subramanian, Sujith, Weckx, Pieter, Hellings, Geert, Bardon, Marie Garcia, Ryckaert, Julien, Pan, Chenyun, Catthoor, Francky

المصدر: IEEE Transactions on Electron Devices; October 2023, Vol. 70 Issue: 10 p5099-5106, 8p

12

Academic Journal

An intelligent data capturing framework to improve condition monitoring and anomaly detection for industrial machines.

المؤلفون: Robyns, Steven, Helsen, Stijn, Weckx, Sam, Bhoi, Sachin Kumar, Baghdadi, Mohamed El, Hegazy, Omar, De Smet, Jasper

المصدر: Procedia Computer Science; 2023, Vol. 217, p709-719, 11p

مصطلحات موضوعية: REDUNDANCY in engineering, ANOMALY detection (Computer security), MACHINING, MACHINERY

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13

Periodical

Physical design level PPA evaluation of buried power rail at 2nm node

المؤلفون: Kim, Ryoung-Han, Lafferty, Neal V., Sisto, Giuliano, Zografos, Odysseas, Weckx, Pieter, Hellings, Geert, Ryckaert, Julien

المصدر: Proceedings of SPIE; April 2023, Vol. 12495 Issue: 1 p124951X-124951X-8, 1124568p

14

Periodical

Cost analysis of device options and scaling boosters below the A14 technology node

المؤلفون: Kim, Ryoung-Han, Lafferty, Neal V., Mirabelli, G., Vandooren, A., Roda Neve, C., Gonzalez, V. V., Mertens, H., Farokhnejad, A., Schuddinck, P., Murdoch, G., Salahuddin, S. M., Zografos, O., Ragnarsson, L., Weckx, P., Tokei, Z., Hellings, G., Ryckaert, J.

المصدر: Proceedings of SPIE; April 2023, Vol. 12495 Issue: 1 p124951K-124951K-5, 1124565p

15

Periodical

Design-technology co-optimization overview of CFET architecture

المؤلفون: Kim, Ryoung-Han, Lafferty, Neal V., Mirabelli, G., Schuddinck, P., Liu, H.-H., Yang, S., Zografos, O., Salahuddin, S. M., Weckx, P., Hiblot, G., Hellings, G., Ryckaert, J.

المصدر: Proceedings of SPIE; April 2023, Vol. 12495 Issue: 1 p124950M-124950M-7, 1124558p

16

Periodical

DTCO of sequential and monolithic CFET SRAM

المؤلفون: Kim, Ryoung-Han, Lafferty, Neal V., Liu, Hsiao-Hsuan, Salahuddin, Shairfe M., Chan, Boon Teik, Schuddinck, Pieter, Xiang, Yang, Weckx, Pieter, Hellings, Geert, Catthoor, Francky

المصدر: Proceedings of SPIE; April 2023, Vol. 12495 Issue: 1 p124950Z-124950Z-7, 1124558p

17

Periodical

System-level evaluation of 3D power delivery network at 2nm node

المؤلفون: Kim, Ryoung-Han, Lafferty, Neal V., Sisto, Giuliano, Chen, Rongmei, Milojevic, Dragomir, Zografos, Odysseas, Weckx, Pieter, Hellings, Geert, Ryckaert, Julien

المصدر: Proceedings of SPIE; April 2023, Vol. 12495 Issue: 1 p124950Y-124950Y-11, 12370062p

18

Periodical

3D SRAM Macro Design in 3D Nanofabric Process Technology

المؤلفون: Abdi, Dawit Burusie, Salahuddin, Shairfe M., Boemmels, Juergen, Giacomin, Edouard, Weckx, Pieter, Ryckaert, Julien, Hellings, Geert, Catthoor, Francky

المصدر: Circuits and Systems I: Regular Papers, IEEE Transactions on; 2023, Vol. 70 Issue: 7 p2858-2867, 10p

19

Periodical

Increasing Functionality of Wafer’s Backside: Analysis of Si and WS₂ Backside Power-Switch

المؤلفون: Mirabelli, G., Chen, R., Ahmed, Z., Chehab, B., Zografos, O., Hiblot, G., Weckx, P., Hellings, G., Ryckaert, J.

المصدر: IEEE Transactions on Electron Devices; 2023, Vol. 70 Issue: 7 p3970-3974, 5p

20

Periodical

CFET SRAM DTCO, Interconnect Guideline, and Benchmark for CMOS Scaling

المؤلفون: Liu, Hsiao-Hsuan, Salahuddin, Shairfe M., Chan, Boon Teik, Schuddinck, Pieter, Xiang, Yang, Hellings, Geert, Weckx, Pieter, Ryckaert, Julien, Catthoor, Francky

المصدر: IEEE Transactions on Electron Devices; 2023, Vol. 70 Issue: 3 p883-890, 8p

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