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1Conference
المؤلفون: Garroux, Dominique, Ouaknine, Michel, Malik, Igor J., Fukada, Takashi, Odera, Masato, Ishigaki, Toshikazu, Ueda, Takeshi, Yoo, Woo Sik
المصدر: 2006 14th IEEE International Conference on Advanced Thermal Processing of Semiconductors ; page 255-262
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2Conference
المؤلفون: Malik, Igor J., Ouaknine, Michel, Ueda, Takeshi, Fukada, Takashi, Yoo, Woo Sik, Erbetta, Davide, Marangon, Tina
المصدر: 2006 14th IEEE International Conference on Advanced Thermal Processing of Semiconductors ; volume pv 1, page 229-235
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3Academic Journal
المؤلفون: Ouaknine, Michel, Malik, Igor J., Odera, Masato, Ishigaki, Toshikazu, Ueda, Takeshi, Fukada, Takashi, Yoo, Woo Sik, Soussan, Philippe, Muller, Philippe
المصدر: Microelectronic Engineering ; volume 84, issue 11, page 2646-2652 ; ISSN 0167-9317
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4Academic Journal
المؤلفون: Malik, Igor J., Ouaknine, Michel, Fukada, Takashi, Yoo, Woo Sik
المصدر: Microelectronic Engineering ; volume 84, issue 11, page 2729-2732 ; ISSN 0167-9317
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5Academic Journal
المصدر: Materials Science and Engineering: B ; volume 114-115, page 56-60 ; ISSN 0921-5107
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6Periodical
المؤلفون: Malik, Igor J., Ouaknine, Michel, Fukada, Takashi, Ueda, Takeshi, Sik, Woo, Press, Patrick, Binder, Robert
المصدر: ECS Transactions; April 2007, Vol. 6 Issue: 1 p451-457, 7p