المؤلفون: Tambone, R., Ferrara, A., Magrini, F., Hoffmann, A., Wood, A., Noebauer, G., Gondro, E., Hueting, R.J.E.

المصدر: 2023 35th International Conference on Microelectronic Test Structure (ICMTS)

الاتاحة: http://dx.doi.org/10.1109/icmts55420.2023.10094167
http://xplorestaging.ieee.org/ielx7/10094038/10094053/10094167.pdf?arnumber=10094167

المؤلفون: Pape, H., Noebauer, G.

المصدر: Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)

الاتاحة: http://dx.doi.org/10.1109/stherm.1999.762449
http://xplorestaging.ieee.org/ielx5/6173/16495/00762449.pdf?arnumber=762449

المؤلفون: Jeongwook Koh, Noebauer, G., Chul An

المصدر: 31st European Solid-State Device Research Conference ; page 495-498

الاتاحة: http://dx.doi.org/10.1109/essderc.2001.195309
http://xplorestaging.ieee.org/ielx5/10066/32281/01506691.pdf?arnumber=1506691

المؤلفون: Noebauer, G.

المصدر: Seventeenth Annual IEEE Semiconductor Thermal Measurement & Management Symposium (Cat. No.01CH37189); 2001, p126-133, 8p

المؤلفون: Pape, H., Noebauer, G.

المصدر: Fifteenth Annual IEEE Semiconductor Thermal Measurement & Management Symposium (Cat No99CH36306); 1999, p201-211, 11p