المؤلفون: Lee, Jian-Hsing, Li, Ching-Ho, Liao, Chih-Cherng, Liao, Ting-Wei, Nidhi, Karuna, Chen, Ke-Horng

المصدر: IEEE Transactions on Magnetics ; volume 60, issue 1, page 1-5 ; ISSN 0018-9464 1941-0069

الاتاحة: https://doi.org/10.1109/tmag.2023.3313525
http://xplorestaging.ieee.org/ielx7/20/10388045/10269112.pdf?arnumber=10269112

المؤلفون: Liao, Chih-Cherng, Li, Ching-Ho, Nidhi, Karuna, Chuang, Chieh-Yao, Liao, Hsien-Feng, Jou, Yeh-Ning, Chen, Ke-Horng, Lee, Jian-Hsing

المصدر: IEEE Transactions on Device and Materials Reliability; December 2024, Vol. 24 Issue: 4 p472-479, 8p

المؤلفون: Lee, Jian-Hsing, Liao, Chih-Cherng, Lin, Wen-Hsin, Lin, Chih-Hsuan, Nidhi, Karuna, Jou, Yeh-Ning, Chen, Ke-Horng

المصدر: 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ; page 1-8

الاتاحة: http://dx.doi.org/10.1109/ipfa61654.2024.10691149
http://xplorestaging.ieee.org/ielx8/10690276/10690850/10691149.pdf?arnumber=10691149

المؤلفون: Lee, Jian-Hsing, Huang, Yeh-Jen, Hong, Li-Yang, Liao, Chih-Cherng, Lien, Brian, Nidhi, Karuna, Jou, Yeh-Ning, Chen, Ke-Horng

المصدر: 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ; page 1-6

الاتاحة: http://dx.doi.org/10.1109/ipfa61654.2024.10691316
http://xplorestaging.ieee.org/ielx8/10690276/10690850/10691316.pdf?arnumber=10691316

المؤلفون: Segan, Mehak, Nidhi, Karuna, Chawla, Bhavika, Nandi, Dhruva, Janardhanan, Rajiv

المصدر: International journal of health sciences; Special Issue I; 9361-9371 ; 2550-696X ; 2550-6978 ; 10.53730/ijhs.v6nS1.2022

مصطلحات موضوعية: knowledge, attitude, gender violence, married women

وصف الملف: application/pdf

Relation: https://sciencescholar.us/journal/index.php/ijhs/article/view/7134/3513; https://sciencescholar.us/journal/index.php/ijhs/article/view/7134

الاتاحة: https://sciencescholar.us/journal/index.php/ijhs/article/view/7134
https://doi.org/10.53730/ijhs.v6nS1.7134

المؤلفون: Gupta, Sujata, Taneja, Neha, Nidhi, Karuna

المصدر: International Journal Of Community Medicine And Public Health; Vol. 9 No. 2 (2022): February 2022; 684-688 ; 2394-6040 ; 2394-6032

مصطلحات موضوعية: NVBDCP, Pre-test, Post-test, Public health officers

وصف الملف: application/pdf

Relation: https://www.ijcmph.com/index.php/ijcmph/article/view/9365/5708; https://www.ijcmph.com/index.php/ijcmph/article/view/9365

الاتاحة: https://www.ijcmph.com/index.php/ijcmph/article/view/9365
https://doi.org/10.18203/2394-6040.ijcmph20220081

المؤلفون: Lee, Jian-Hsing, Liao, Chih-Cherng, Lin, Gong-Kai, Nidhi, Karuna, Chuang, Chieh-Yao, Huang, Shao-Chang, Chen, Ke-Horng

المساهمون: Vanguard International Semiconductor Corporation, Hsinchu, Taiwan

المصدر: IEEE Transactions on Electron Devices ; volume 71, issue 7, page 4247-4252 ; ISSN 0018-9383 1557-9646

الاتاحة: http://dx.doi.org/10.1109/ted.2024.3403949
http://xplorestaging.ieee.org/ielx7/16/10566499/10540459.pdf?arnumber=10540459

المؤلفون: Lee, Jian-Hsing, Nidhi, Karuna, Hung, Chung-Yu, Liao, Ting-Wei, Liu, Wu-Yang, Su, Hung-Der

المصدر: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

الاتاحة: http://dx.doi.org/10.1109/ipfa53173.2021.9617451
http://xplorestaging.ieee.org/ielx7/9617229/9617230/09617451.pdf?arnumber=9617451

المؤلفون: Lee, Jian-Hsing, Nidhi, Karuna, Lin, Tingyou, Liao, Hsueh-Chun, Tseng, Fu-Chun, Lee, Scott

المصدر: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

الاتاحة: http://dx.doi.org/10.1109/ipfa53173.2021.9617288
http://xplorestaging.ieee.org/ielx7/9617229/9617230/09617288.pdf?arnumber=9617288

المؤلفون: Chen, Chao-Yang, Lee, Jian-Hsing, Nidhi, Karuna, Bin, Tzer-Yaa, Lin, Geeng-Lih, Ker, Ming-Dou

المصدر: 2021 IEEE International Reliability Physics Symposium (IRPS)

الاتاحة: http://dx.doi.org/10.1109/irps46558.2021.9405113
http://xplorestaging.ieee.org/ielx7/9405068/9405088/09405113.pdf?arnumber=9405113

المؤلفون: Lee, Jian-Hsing, Nidhi, Karuna, Chen, Chun-Chih, Ker, Ming-Dou

المصدر: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

الاتاحة: http://dx.doi.org/10.1109/ipfa49335.2020.9260911
http://xplorestaging.ieee.org/ielx7/9260488/9260588/09260911.pdf?arnumber=9260911

المؤلفون: Lee, Jian-Hsing, Nidhi, Karuna, Ker, Ming-Dou

المصدر: IEEE Transactions on Electromagnetic Compatibility; December 2022, Vol. 64 Issue: 6 p1883-1889, 7p

المؤلفون: Lin, Tingyou, Su, Chauchin, Hung, Chung-Chih, Nidhi, Karuna, Tu, Chily, Huang, Shao-Chang

المصدر: 2019 Design, Automation & Test in Europe Conference & Exhibition (DATE) ; volume 17, page 1661-1666

الاتاحة: http://dx.doi.org/10.23919/date.2019.8714895
http://xplorestaging.ieee.org/ielx7/8704855/8714721/08714895.pdf?arnumber=8714895

المؤلفون: Huang, Shao-Chang, Liao, Chih-Cherng, Liao, Hsien-Feng, Weng, Shou-Peng, Nidhi, Karuna, Wang, Yu-Kai, Chen, Yi-Jen, Chiou, Hwa-Chyi, Jou, Yeh-Ning, Lee, Jian-Hsing

المصدر: 2019 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-TW)

الاتاحة: http://dx.doi.org/10.1109/icce-tw46550.2019.8991697
http://xplorestaging.ieee.org/ielx7/8966968/8991681/08991697.pdf?arnumber=8991697

المؤلفون: Nidhi, Karuna, Lee, Jian-Hsing, Huang, Shao-Chang, Ker, Ming-Dou

المساهمون: Vanguard International Semiconductor Corporation, Hsinchu, Taiwan

المصدر: IEEE Transactions on Device and Materials Reliability ; volume 20, issue 2, page 413-419 ; ISSN 1530-4388 1558-2574

الاتاحة: http://dx.doi.org/10.1109/tdmr.2020.2985306
http://xplorestaging.ieee.org/ielx7/7298/9109758/09060982.pdf?arnumber=9060982

المؤلفون: Lee, Jian-Hsing, Liao, Chih-Cherng, Shih, Ching-Kuei, Nidhi, Karuna, Li, Ching-Ho, Chen, Chun-Chih, Kan, Kai-Chuan, Chen, Ke-Horng

المصدر: IEEE Transactions on Electron Devices; October 2022, Vol. 69 Issue: 10 p5698-5704, 7p

المؤلفون: Nidhi, Karuna, Ker, Ming-Dou, Lin, Tingyou, Lee, Jian-Hsing

المساهمون: Ministry of Science and Technology, Taiwan

المصدر: IEEE Transactions on Electron Devices ; volume 65, issue 7, page 2948-2956 ; ISSN 0018-9383 1557-9646

الاتاحة: http://dx.doi.org/10.1109/ted.2018.2838545
http://xplorestaging.ieee.org/ielx7/16/8386725/08369346.pdf?arnumber=8369346

المؤلفون: Vijay, Kumar M P, Shreyas, Grama Srinath, Nidhi, Karuna, Agarwal, Neelam, Kumar, Ankit, Sheu, Gene, Yang, Shao-Ming, Mrinal, Aryadeep

المصدر: 2013 IEEE 8th Nanotechnology Materials and Devices Conference (NMDC) ; page 74-77

الاتاحة: http://dx.doi.org/10.1109/nmdc.2013.6707458
http://xplorestaging.ieee.org/ielx7/6695811/6707449/06707458.pdf?arnumber=6707458

المؤلفون: Nidhi, Karuna¹, Ker, Ming-Dou²

المصدر: IEEE Transactions on Electron Devices. Jul2017, Vol. 64 Issue 7, p2812-2819. 8p.

مصطلحات موضوعية: *COMPUTER-aided design, CMOS logic circuits, LOW voltage integrated circuits, FIELD-effect transistors, ROBUST statistics

المؤلفون: Khaund, Chinmoy, Shreyas, Grama Srinath, Vijay Kumar, M P, Agarwal, Neelam, Nidhi, Karuna, Yang, Shao Ming, Sheu, Gene

المصدر: 2013 IEEE 7th International Power Engineering & Optimization Conference (PEOCO); 2013, p288-292, 5p