المؤلفون: S.N. Paisner, T.D. Fornes, K.A. Gilbert, N.D. Huffman

المصدر: 2008 Twenty-fourth Annual IEEE Semionductor Thermal Measurement and Management Symposium.

مصطلحات موضوعية: Materials science, business.industry, Particle packing, Interface (computing), Thermal, Thermal management of electronic devices and systems, Adhesive, Electronics, Current (fluid), Process engineering, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::53f61367c24b40464c4543fa42fafd0c
https://doi.org/10.1109/stherm.2008.4509372