المؤلفون: Gallois-Garreignot, Sebastien, Hu, Guojun, Fiori, Vincent, Sorrieul, Marika, Moutin, Caroline, Tavernier, Clement

المصدر: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

الاتاحة: http://dx.doi.org/10.1109/ectc.2015.7159726
http://xplorestaging.ieee.org/ielx7/7133058/7159553/07159726.pdf?arnumber=7159726

المؤلفون: Gallois-Garreignot, Sébastien, Benzima, Naceur, Benmussa, Etienne, Moutin, Caroline, Bouchard, Pierre-Olivier, Fiori, Vincent, Tavernier, Clément

المساهمون: STMicroelectronics Crolles (ST-CROLLES), STMicroelectronics Grenoble (ST-GRENOBLE), Centre de Mise en Forme des Matériaux (CEMEF), Mines Paris - PSL (École nationale supérieure des mines de Paris), Université Paris Sciences et Lettres (PSL)-Université Paris Sciences et Lettres (PSL)-Centre National de la Recherche Scientifique (CNRS)

المصدر: ISSN: 0026-2714.

مصطلحات موضوعية: FE Modeling, Failure mode, Failure analysis, Bump shear test, [SPI.MAT]Engineering Sciences [physics]/Materials

Relation: hal-01143756; https://minesparis-psl.hal.science/hal-01143756

الاتاحة: https://minesparis-psl.hal.science/hal-01143756
https://doi.org/10.1016/j.microrel.2015.03.008

المؤلفون: Sart, Clement, Gallois-Garreignot, Sebastien, Fiori, Vincent, Kermarrec, Olivier, Moutin, Caroline, Tavernier, Clement, Jaouen, Herve

المصدر: 2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p1594-1598, 5p