المؤلفون: Junmeng Guo, Jiahui Gan, Haoran Ruan, Xiaobo Yuan, Chuiyun Kong, Yang Liu, Meiying Su, Yabing Liu, Wei Liu, Bao Zhang, Yongle Zhang, Gang Cheng, Zuliang Du

المصدر: Exploration, Vol 2, Iss 6, Pp n/a-n/a (2022)

مصطلحات موضوعية: active ions, gas sensors, room temperature, metal oxide semiconductor, ZnO, Biotechnology, TP248.13-248.65

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2766-8509; https://doaj.org/toc/2766-2098

URL الوصول: https://doaj.org/article/1dbffd3846ea4c18afe28ba2e1f7ff63

المؤلفون: Yuching Huang, Andrew L. Mense, Lingzhu Deng, Meiying Su, Kuenho Shih, Jayne E. Bock

المصدر: Foods, Vol 10, Iss 10, p 2413 (2021)

مصطلحات موضوعية: reconstituted whole wheat flour, bran, bran particle size distribution, steamed bread, Chemical technology, TP1-1185

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2304-8158/10/10/2413; https://doaj.org/toc/2304-8158

URL الوصول: https://doaj.org/article/f15c7aa53bf0405c8b22aa2e23d29834

المؤلفون: Fang Hua, Qi Yan, Meiying Su, Bin Shi

المصدر: BMJ Open, Vol 9, Iss 10 (2019)

مصطلحات موضوعية: Medicine

وصف الملف: electronic resource

Relation: https://bmjopen.bmj.com/content/9/10/e029826.full; https://doaj.org/toc/2044-6055

URL الوصول: https://doaj.org/article/e54d7a8d631f43a88b6406eef02a54ef

المؤلفون: Chuan Chen, Meiying Su, Rui Ma, Yunyan Zhou, Jun Li, Liqiang Cao

المصدر: Materials; Volume 15; Issue 5; Pages: 1683

مصطلحات موضوعية: fan-out wafer-level packaging, viscoelastic, warpage, multi-die

وصف الملف: application/pdf

Relation: https://dx.doi.org/10.3390/ma15051683

الاتاحة: https://doi.org/10.3390/ma15051683

المؤلفون: Fengze Hou, Jun Li, Meiying Su, Liqiang Cao, Rui Ma, Rongwei Gao

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:368-374

مصطلحات موضوعية: Materials science, business.industry, Optoelectronics, Fan-out, Electrical and Electronic Engineering, business, Wafer-level packaging, Industrial and Manufacturing Engineering, Polyimide, Selection (genetic algorithm), Electronic, Optical and Magnetic Materials, Characterization (materials science)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f8a63235519376249605aba196c04f0f
https://doi.org/10.1109/tcpmt.2021.3127235

المؤلفون: Yuning Lin, Zhongying Zhang, Ying Li, Yongquan Chen, Meiying Su, Wenzhen Zhao

المصدر: Medicine. 101(46)

مصطلحات موضوعية: Gene Expression Regulation, Neoplastic, Stomach Neoplasms, Humans, Computational Biology, RNA, Long Noncoding, General Medicine, Adenocarcinoma, Prognosis, Biomarkers

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::df7adafe13bb434fb8fa22f63ff52ade
https://pubmed.ncbi.nlm.nih.gov/36401393

المؤلفون: Yunting Liu, Cheng Xu, Rui Ma, Binjie Shi, Meiying Su, Qidong Wang, Liqiang Cao

المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::87b5ba12aa9b05533abb664c8b4d99ae
https://doi.org/10.1109/estc55720.2022.9939460

المؤلفون: Donghui Liu, Fei Ding, Meiying Su, Rui Ma, Chuan Chen, Liqiang Cao

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::752334ea7226ca855d3580d408fb4aa3
https://doi.org/10.1109/icept56209.2022.9872614

المؤلفون: Jun Li, Rui Ma, Meiying Su, Liqiang Cao, Fengze Hou, Chuan Chen

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1000-1009

مصطلحات موضوعية: 010302 applied physics, Void (astronomy), Materials science, Microchannel, Thermal resistance, 020208 electrical & electronic engineering, 02 engineering and technology, Heat transfer coefficient, Mechanics, Heat sink, Thermal conduction, 01 natural sciences, Industrial and Manufacturing Engineering, Finite element method, Electronic, Optical and Magnetic Materials, Thermal conductivity, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Electrical and Electronic Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::611e254eb0e0589f115556d18ba98d0f
https://doi.org/10.1109/tcpmt.2020.2982012

المؤلفون: Liqiang Cao, Rui Ma, Meiying Su, Fengze Hou, Chuan Chen, Jun Li

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:435-443

مصطلحات موضوعية: Pressure drop, Convection, Materials science, Microchannel, Fin, 020209 energy, Thermal resistance, 02 engineering and technology, Mechanics, Heat transfer coefficient, 021001 nanoscience & nanotechnology, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Thermal, Heat transfer, 0202 electrical engineering, electronic engineering, information engineering, Electrical and Electronic Engineering, 0210 nano-technology

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::084061ee6cc1188350c93c29bf2fb6dd
https://doi.org/10.1109/tcpmt.2019.2950677

المؤلفون: Tingyu Lin, Braham Ferreira, Jun Li, Meiying Su, Guoqi Zhang, Fengze Hou, Wenbo Wang, Liqiang Cao

المساهمون: Power Electronics, Digital Society Institute

المصدر: IEEE Journal of Emerging and Selected Topics in Power Electronics, 8(1):19351787, 223-238. IEEE

مصطلحات موضوعية: 010302 applied physics, Interconnection, Computer science, Low parasitic inductance, 020208 electrical & electronic engineering, 22/2 OA procedure, Energy Engineering and Power Technology, SiC power module, 02 engineering and technology, Thermal management of electronic devices and systems, Scientific challenges, 01 natural sciences, Packaging schemes, chemistry.chemical_compound, High-efficient cooling, chemistry, Power module, 0103 physical sciences, MOSFET, Parasitic element, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, Silicon carbide, Electrical and Electronic Engineering, Material properties

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c651ac4282a8e384f5305af4114db88e
https://doi.org/10.1109/jestpe.2019.2947645

المؤلفون: Jun Li, Yonghao Li, Guoqi Zhang, Yang Song, Rui Ma, Wenbo Wang, Meiying Su, Zhonglin Han, Fengze Hou, Braham Ferreira, Chen Min, Liqiang Cao, Qidong Wang, Zhongyao Yu

المساهمون: Power Electronics, Digital Society Institute

المصدر: IEEE Journal of Emerging and Selected Topics in Power Electronics, 8(1):19376549, 367-380. IEEE
IEEE Journal of Emerging and Selected Topics in Power Electronics, 8(1)

مصطلحات موضوعية: printed circuit board (PCB)-embedded package, Materials science, Energy Engineering and Power Technology, 02 engineering and technology, Metal-oxide-semiconductor field-effect transistor, 01 natural sciences, Capacitance, Die (integrated circuit), law.invention, MOSFET, Parasitic capacitance, law, Printed Circuit Board (PCB), 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, static characterization, Electrical and Electronic Engineering, Power MOSFET, PCB-embedded package, 010302 applied physics, business.industry, 020208 electrical & electronic engineering, Transistor, Electro-thermo-mechanical codesign, 22/2 OA procedure, switching characterization, Power module, Parasitic element, Optoelectronics, phase-leg silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) power module, business, Phase-leg silicon carbide (SiC)

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::94d25e039df27e01b1c13f8f81cc278d
https://doi.org/10.1109/jestpe.2019.2952238

المؤلفون: Rongwei Gao, Rui Ma, Jun Li, Qidong Wang, Liqing Cao, Meiying Su

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::33b56fbde39198c9e7216f668c6c8dee
https://doi.org/10.1109/ectc51906.2022.00362

المؤلفون: Chuan Chen, Meiying Su, Rui Ma, Yunyan Zhou, Jun Li, Liqiang Cao

المصدر: Materials; Volume 15; Issue 5; Pages: 1683

مصطلحات موضوعية: fan-out wafer-level packaging, viscoelastic, warpage, multi-die, General Materials Science

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::be1b68ba1996570bb9c3647933cfd311
https://pubmed.ncbi.nlm.nih.gov/35268913

المؤلفون: Junmeng Guo, Jiahui Gan, Haoran Ruan, Xiaobo Yuan, Chuiyun Kong, Yang Liu, Meiying Su, Yabing Liu, Wei Liu, Bao Zhang, Yongle Zhang, Gang Cheng, Zuliang Du

المصدر: Exploration. 2:20210361

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::44fae09f9e0e03e4bf11da8b8e2b0f9d
https://doi.org/10.1002/exp.20210361

المؤلفون: Lingzhu Deng, Andrew L. Mense, Meiying Su, Yuching Huang, Jayne E. Bock, Kuenho Shih

المصدر: Foods
Foods, Vol 10, Iss 2413, p 2413 (2021)
Volume 10
Issue 10

مصطلحات موضوعية: chemistry.chemical_classification, Farinograph, Health (social science), Absorption of water, Bran, reconstituted whole wheat flour, Chemical technology, bran, Plant Science, TP1-1185, Steamed bread, Health Professions (miscellaneous), Microbiology, Gluten, Article, chemistry, Rheology, bran particle size distribution, Particle, steamed bread, Food science, Particle size, Food Science

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9333c172a534f0e27bc097526f916bdd
http://europepmc.org/articles/PMC8535908

المؤلفون: Yunqian Song, Rong Fu, Chuan Chen, Qidong Wang, Meiying Su, Fengze Hou, Xiaobin Zhang, Jun Li, Liqiang Cao

المصدر: Applied Thermal Engineering. 214:118852

مصطلحات موضوعية: Energy Engineering and Power Technology, Industrial and Manufacturing Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::386dfaa2af22ce888e845764c3b3e08b
https://doi.org/10.1016/j.applthermaleng.2022.118852

المؤلفون: Meiying Su, Ge Liu, Rui Ma, Liqiang Cao, Fengze Hou, Meiju Zhang, Jun Li, Chuan Chen, Xiaobo Liang

المصدر: 2020 21st International Conference on Electronic Packaging Technology (ICEPT).

مصطلحات موضوعية: Physics::Fluid Dynamics, Pressure drop, Materials science, Microchannel, Silicon, chemistry, Drop (liquid), Heat transfer, chemistry.chemical_element, Mechanics, Total pressure, Porosity, Volumetric flow rate

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::eb5cf42ea7a000d6faf4d50e5fda311c
https://doi.org/10.1109/icept50128.2020.9202999

المؤلفون: Tingyu Lin, Jun Li, Meiying Su, Liqiang Cao, Cheng Chen, Gengxin Tian, Chen Feng

المصدر: Microelectronics Reliability. 83:29-38

مصطلحات موضوعية: 010302 applied physics, business.product_category, Packaging engineering, business.industry, Computer science, Shell element, Process (computing), Fan-out, Mechanical engineering, 020206 networking & telecommunications, 02 engineering and technology, Condensed Matter Physics, 01 natural sciences, Atomic and Molecular Physics, and Optics, Finite element method, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Software, Consistency (statistics), 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Die (manufacturing), Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4f649396eb7b5292a2cb875ca690279e
https://doi.org/10.1016/j.microrel.2018.02.010

المؤلفون: Meiying Su, Liqiang Cao, Rui Ma, Fengze Hou, Jun Li, Chuan Chen

المصدر: Applied Thermal Engineering. 198:117457

مصطلحات موضوعية: Pressure drop, Microchannel, Materials science, Heat flux, Thermal resistance, Energy Engineering and Power Technology, Solder paste, Thermal grease, Composite material, Industrial and Manufacturing Engineering, Volumetric flow rate, Coolant

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6474e715caee8b17755ec75407b80b4b
https://doi.org/10.1016/j.applthermaleng.2021.117457