المؤلفون: Hajime Kobayashi, Kouichi Saitou, Mayumi Nakasato, Ryosuke Usui, Takahiro Fujii, Tetsuya Yamamoto, Yasunori Inoue, Yasuyuki Yanase, Yoshio Okayama, 中里 真弓, 井上 恭典, 小林 初, 山本 哲也, 岡山 芳央, 柳瀬 康行, 臼井 良輔, 藤井 隆弘, 齋藤 浩一

المصدر: Proceedings of JIEP Annual Meeting. 2009, :56

المؤلفون: Kouichi Saitou, Mayumi Nakasato, Ryosuke Usui, Yasunori Inoue, Yasuyuki Yanase, Yoshio Okayama, 中里 真弓, 井上 恭典, 岡山 芳央, 柳瀬 康行, 臼井 良輔, 齋藤 浩一

المصدر: Proceedings of JIEP Annual Meeting. 2008, :253

المؤلفون: Atsunobu Suzuki, Hajime Kobayashi, Kouichi Saito, Mayumi Nakasato, Ryosuke Usui, Takahiro Fujii, Yasuyuki Yanase, Yoshio Okayama, 中里 真弓, 小林 初, 岡山 芳央, 柳瀬 康行, 臼井 良輔, 藤井 隆弘, 鈴木 敦順, 齋藤 浩一

المصدر: Proceedings of JIEP Annual Meeting. 2010, :174

المؤلفون: Akira Yamauchi, Mayumi Nakasato, Shinya Yamasaki, 中里 真弓, 山内 昭, 山崎 信哉

المصدر: 日本海水学会誌 / Bulletin of the Society of Sea Water Science, Japan. 2009, 63(2):82

المؤلفون: Yoshio Okayama, Yasuyuki Yanase, Kouichi Saitou, Hajime Kobayashi, Mayumi Nakasato, Tetsuya Yamamoto, Ryosuke Usui, Yasunori Inoue

المصدر: 2009 59th Electronic Components and Technology Conference ; page 892-897

الاتاحة: http://dx.doi.org/10.1109/ectc.2009.5074118
http://xplorestaging.ieee.org/ielx5/5066986/5073977/05074118.pdf?arnumber=5074118

المؤلفون: Tetsuya Yamamoto, Hajime Kobayashi, Yasunori Inoue, Ryosuke Usui, Yoshio Okayama, Mayumi Nakasato, Yasuyuki Yanase, Kouichi Saitou

المصدر: 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Stress (mechanics), Printed circuit board, Materials science, Wafer-scale integration, Wafer dicing, Wafer, Temperature cycling, Composite material, Wafer-level packaging, Electrical connection

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cf58b4af20443e16dc71d09a6e415659
https://doi.org/10.1109/ectc.2010.5490960

المؤلفون: Y. Igarashi, Mayumi Nakasato, N. Takakusaki, Y. Kohara, A. Nishida, Yasunori Inoue, Ryosuke Usui, H. Mizuhara, T. Nakamura, T. Kusabe

المصدر: 2007 Proceedings 57th Electronic Components and Technology Conference.

مصطلحات موضوعية: Substrate (building), Thermal conductivity, Materials science, Thermal resistance, visual_art, visual_art.visual_art_medium, Ceramic, Composite material, Thin film, Daisy chain, Electrical conductor, Voltage

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e23485e8b6745b7d95d113335f701f09
https://doi.org/10.1109/ectc.2007.373971