المؤلفون: Mauro J. Kobrinsky

المصدر: 2021 IEEE International Interconnect Technology Conference (IITC).

مصطلحات موضوعية: Interconnection, Market research, Materials science, business.industry, Reliability (computer networking), Node (networking), Key (cryptography), Systems engineering, New materials, business, Die (integrated circuit)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ce9e2b23ad901509fe9e557f1ec306aa
https://doi.org/10.1109/iitc51362.2021.9537483

المؤلفون: Rahim Kasim, Mauro J. Kobrinsky

المصدر: IRPS

مصطلحات موضوعية: ComputingMilieux_GENERAL, Back end of line, Reliability (statistics), Reliability engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1fae87c066c7a88122badf309f9b5e34
https://doi.org/10.1109/irps46558.2021.9405099

المؤلفون: Mauro J. Kobrinsky, Hui Jae Yoo, Michael Christenson, Ram Krishnamurthy, Mark A. Anders, Robert L. Bristol, Giselle Elbaz, Himanshu Kaul, Kevin L. Lin, Brandon Holybee, Miriam Reshotko

المصدر: 2020 IEEE International Electron Devices Meeting (IEDM).

مصطلحات موضوعية: Microprocessor, Interconnection, Materials science, business.industry, law, Hardware_INTEGRATEDCIRCUITS, Optoelectronics, Electrical measurements, business, Capacitance, law.invention, Power (physics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::74fc20d6e3c0de75cff1a4dc8a10dd9b
https://doi.org/10.1109/iedm13553.2020.9371946

المؤلفون: Matthew V. Metz, James S. Clarke, Mauro J. Kobrinsky, J. Bielefeld, Ramanan V. Chebiam, Marius K. Orlowski, Sean W. King, Carl H. Naylor, S. Vyas, John J. Plombon, R. Thapa, Vamseedhara Vemuri, James M. Blackwell, Ye Fan, David J. Michalak, Florian Gstrein, Nicholas C. Strandwitz, Michelle M. Paquette

المصدر: 2020 IEEE International Electron Devices Meeting (IEDM).

مصطلحات موضوعية: Permittivity, CMOS, Nanoelectronics, Computer science, Perspective (graphical), Cmos electronics, Dielectric, Engineering physics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::27238ad25a90f959569d7043165c8afd
https://doi.org/10.1109/iedm13553.2020.9371942

المؤلفون: Patrick Morrow, Bryan Black, Mauro J Kobrinsky, Sriram Muthukumar, Don Nelson, Chang-Min Park, Clair Webb

المساهمون: The Pennsylvania State University CiteSeerX Archives

المصدر: http://s3.amazonaws.com/zanran_storage/www.mrs.org/ContentPages/68071888.pdf.

وصف الملف: application/pdf

Relation: http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.1048.190; http://s3.amazonaws.com/zanran_storage/www.mrs.org/ContentPages/68071888.pdf

الاتاحة: http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.1048.190
http://s3.amazonaws.com/zanran_storage/www.mrs.org/ContentPages/68071888.pdf

المؤلفون: Kuan-neng Chen, Mauro J. Kobrinsky, On Barnett, Rafael Reif

المساهمون: The Pennsylvania State University CiteSeerX Archives

المصدر: http://www-mtl.mit.edu/~reif/papers/2004-knchen-IEEE-TED-manuscript.pdf.

وصف الملف: application/pdf

Relation: http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.126.5395; http://www-mtl.mit.edu/~reif/papers/2004-knchen-IEEE-TED-manuscript.pdf

الاتاحة: http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.126.5395
http://www-mtl.mit.edu/~reif/papers/2004-knchen-IEEE-TED-manuscript.pdf

المؤلفون: John J. Plombon, Hui Jae Yoo, Narendra Lakamraju, Colin T. Carver, B. Krist, Rahim Kasim, Kanwal Jit Singh, Tejaswi K. Indukuri, Jasmeet S. Chawla, Kevin L. Lin, James S. Clarke, Mauro J. Kobrinsky, J. Bielefeld, Hazel Lang, Kabir Nafees, M. Harmes, Jessica M. Torres, E. Mays, Jacob Faber, Christopher J. Jezewski, Alan Myers, Ramanan V. Chebiam

المصدر: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

مصطلحات موضوعية: Materials science, Dielectric strength, business.industry, Electrical engineering, Hardware_PERFORMANCEANDRELIABILITY, Dielectric, Planar capacitor, law.invention, Metal, Capacitor, Film capacitor, Planar, Hardware_GENERAL, law, visual_art, Hardware_INTEGRATEDCIRCUITS, visual_art.visual_art_medium, Optoelectronics, Thin film, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e47dcd35f8378b2ae8fafb82d3251683
https://doi.org/10.1109/iitc-mam.2015.7325646

المؤلفون: M. Harmes, Mauro J. Kobrinsky, Timothy Allen McMullen, R.J. Kamaladasa, John Dunklee, I. Tsamaret, D. Slottke

المصدر: IRPS

مصطلحات موضوعية: Correlation, Stress (mechanics), Acceleration, Engineering, Reliability (semiconductor), business.industry, Reticle, Wafer, business, Electromigration, Reliability engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b0e30234313e18938917482f938f1a66
https://doi.org/10.1109/irps.2015.7112806

المؤلفون: S. Chakravarty, M. Harmes, S. List, Mauro J. Kobrinsky, M. Mazumder, Dan Jiao

المصدر: IEEE Transactions on Advanced Packaging. 28:57-62

مصطلحات موضوعية: Optimal design, Engineering, business.industry, Computation, Capacitive sensing, Integrated circuit, law.invention, Microprocessor, law, Scattering parameters, Electronic engineering, System on a chip, Signal integrity, Electrical and Electronic Engineering, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bef38b2961b1285f9603370deb32738b
https://doi.org/10.1109/tadvp.2004.841672

المؤلفون: Tejaswi K. Indukuri, John J. Plombon, Alan Myers, Mauro J. Kobrinsky, Narendra Lakamraju, Kevin L. Lin, Kanwal Jit Singh, Hui Jae Yoo, Jacob Faber, Christopher J. Jezewski, M. Harmes, B. Krist, James S. Clarke, Ramanan V. Chebiam, Hazel Lang, Colin T. Carver

المصدر: IEEE International Interconnect Technology Conference.

مصطلحات موضوعية: Tantalum capacitor, Materials science, Fabrication, business.industry, Tantalum, chemistry.chemical_element, Time-dependent gate oxide breakdown, Dielectric, Copper, law.invention, Capacitor, chemistry, law, Electronic engineering, Optoelectronics, Thin film, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0d852e28e02fd964aa62b39c06b337a2
https://doi.org/10.1109/iitc.2014.6831864

المؤلفون: Gerhard Dehm, Carl L. Thompson, Mauro J. Kobrinsky, Eduard Arzt

المصدر: Acta Materialia. 49:3597-3607

مصطلحات موضوعية: Length scale, Materials science, Polymers and Plastics, Characteristic length, Condensed matter physics, Metals and Alloys, Plasticity, Grain size, Electronic, Optical and Magnetic Materials, Condensed Matter::Materials Science, Crystallography, Condensed Matter::Superconductivity, Ceramics and Composites, Crystallite, Thin film, Pinning points, Dislocation

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::079b92c1566f5badeecaab0be6c104c3
https://doi.org/10.1016/s1359-6454(01)00225-7

المؤلفون: Carl V. Thompson, Mihal E. Gross, Mauro J. Kobrinsky

المصدر: Journal of Applied Physics. 89:91-98

مصطلحات موضوعية: Stress (mechanics), Materials science, Passivation, Creep, business.industry, Copper interconnect, General Physics and Astronomy, Diffusion creep, Microelectronics, Temperature cycling, Composite material, Deformation (engineering), business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a2e884a02554d9d7dc770f7bc7f90426
https://doi.org/10.1063/1.1326856

المؤلفون: Carl V. Thompson, W. R. Fayad, Mauro J. Kobrinsky

المصدر: Physical Review B. 62:5221-5227

مصطلحات موضوعية: Bamboo, Grain growth, Materials science, law, Analytic model, Development (differential geometry), STRIPS, Composite material, Thin film, Microstructure, law.invention

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::462b52e0bf1680caa4f385c269a8be3a
https://doi.org/10.1103/physrevb.62.5221

المؤلفون: Carl V. Thompson, Mauro J. Kobrinsky

المصدر: Acta Materialia. 48:625-633

مصطلحات موضوعية: Materials science, Polymers and Plastics, Metals and Alloys, Plasticity, Grain size, Electronic, Optical and Magnetic Materials, Crystallography, Membrane, Volume (thermodynamics), Ceramics and Composites, Stress relaxation, Crystallite, Thin film, Dislocation, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a404f46d847db55618ba1197b3b51cdf
https://doi.org/10.1016/s1359-6454(99)00403-6

المؤلفون: M. Harmes, Shriram Ramanathan, Chang-min Park, P.R. Morrow, Mauro J. Kobrinsky

المصدر: IEEE Electron Device Letters. 27:335-337

مصطلحات موضوعية: Materials science, Wafer bonding, business.industry, Transistor, Stacking, Electrical engineering, Low-k dielectric, Integrated circuit, Electronic, Optical and Magnetic Materials, law.invention, CMOS, law, MOSFET, Optoelectronics, Wafer, Electrical and Electronic Engineering, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5decb5b2c5398792e7447d734427decb
https://doi.org/10.1109/led.2006.873424

المؤلفون: Peter L. D. Chang, Brian Corbett, Roger E. Nagle, Ibrahim Ban, Feras Eid, James O'Callaghan, William McFarlane, Mauro J. Kobrinsky, Ricky J. Tseng, Rawlings Brandon M, Michael R. Gleeson

المصدر: OFC
Scopus-Elsevier

مصطلحات موضوعية: Materials science, CMOS, law, business.industry, Photonic integrated circuit, Process (computing), Optoelectronics, Photonics, Polymer waveguide, Laser, business, Waveguide (optics), law.invention

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b48f892555c1fbae1d774dac4990b631
https://doi.org/10.1364/ofc.2014.th2a.41

المؤلفون: Ricky J. Tseng, Peter L. D. Chang, Bruce A. Block, Mauro J. Kobrinsky, Ibrahim Ban, Miriam Reshotko, Shawna M. Liff

المصدر: SPIE Proceedings.

مصطلحات موضوعية: Materials science, business.industry, Optical interconnect, Electro-optic modulator, Mach–Zehnder interferometer, Capacitance, law.invention, Resonator, Optics, law, Insertion loss, business, Low voltage, Waveguide

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::73b3037e2ec45254bdb1b6cffba9e645
https://doi.org/10.1117/12.2004489

المؤلفون: B. Krist, S. Suri, Sridhar Balakrishnan, Hui Jae Yoo, J. Bielefeld, Sean W. King, V. RamachandraRao, H. Hiramatsu, C. Ward, Kanwal Jit Singh, M. Harmes, Mauro J. Kobrinsky, P. Reese

المصدر: 2010 IEEE International Interconnect Technology Conference.

مصطلحات موضوعية: Interconnection, Yield (engineering), Materials science, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, ComputerApplications_COMPUTERSINOTHERSYSTEMS, Dielectric, Air gap (plumbing), Capacitance, Engineering physics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f6aa80711b00ee2dc16b91286d90f670
https://doi.org/10.1109/iitc.2010.5510708

المؤلفون: Carl V. Thompson, Mauro J. Kobrinsky

المصدر: Applied Physics Letters. 73:2429-2431

مصطلحات موضوعية: Surface diffusion, Materials science, Physics and Astronomy (miscellaneous), Transition temperature, Grain boundary diffusion coefficient, Grain boundary, Activation energy, Crystallite, Composite material, Thin film, Flow stress

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8eb45bbd84f660a5b300fcc60adea3a5
https://doi.org/10.1063/1.122471

المؤلفون: Bryan Black, Clair C. Webb, Sriram Muthukumar, Donald W. Nelson, Chang-min Park, Patrick Morrow, Mauro J. Kobrinsky

المصدر: Scopus-Elsevier

مصطلحات موضوعية: Interconnection, Materials science, business.industry, Transistor, Stacking, Memory bandwidth, law.invention, Stack (abstract data type), law, Hardware_INTEGRATEDCIRCUITS, Optoelectronics, Microelectronics, Wafer, Performance improvement, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::07dc713b2fa509b8c4987030fb915ad3
https://doi.org/10.1557/proc-0970-y03-02