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المؤلفون: Lucile Arnaud, Chantal Karam, F. Servant, Severine Cheramy, S. Borel, Frank Fournel, Thierry Mourier, C. Dubarry, N. Bresson, Mathilde Gottardi, G. Mauguen, M. Assous
المصدر: MRS Communications. 10:549-557
مصطلحات موضوعية: Interconnection, Fabrication, Materials science, business.industry, Copper interconnect, Stacking, 02 engineering and technology, 010402 general chemistry, 021001 nanoscience & nanotechnology, 01 natural sciences, 0104 chemical sciences, Stack (abstract data type), Etching (microfabrication), Optoelectronics, General Materials Science, Wafer, 0210 nano-technology, business, Lithography
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المؤلفون: Mathilde Gottardi, Gilles Romero, Pierre-Emile Philip, Céline Doussot, Sophie Verrun, Thierry Mourier, Gaelle Guittet, Vincent Mevellec
المصدر: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2019:000077-000103
مصطلحات موضوعية: Materials science, business.industry, Key (cryptography), Optoelectronics, Pharmacology (medical), business, Deposition (chemistry), Layer (electronics)
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المؤلفون: Didier Campos, P. Coudrain, Yorrick Exbrayat, Lucile Arnaud, Stephane Minoret, F. Ponthenier, Andrea Vinci, Severine Cheramy, Alain Gueugnot, Daniel Scevola, Cesar Fuguet Tortolero, P. Chausse, Roselyne Segaud, Giovanni Romano, Christophe Aumont, Didier Lattard, Jean Charbonnier, Pierre-Emile Philip, C. Ribiere, Arnaud Garnier, Jean Michailos, Mathilde Gottardi, Raphael Eleouet, Frédéric Berger, Eric Guthmuller, Gilles Simon, Jerome Beltritti, Gilles Romero, Maxime Argoud, Denis Dutoit, Alexis Farcy, Nacima Allouti, Therry Mourier, Remi Velard, Pascal Vivet, Corinne Legalland
المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Through-silicon via, business.industry, Computer science, 020208 electrical & electronic engineering, Process (computing), 02 engineering and technology, 01 natural sciences, Silicon interposer, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Technology integration, Interposer, business, Computer hardware
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المؤلفون: Mathilde Gottardi, Stephane Minoret, C. Ribiere, Gilles Romero, Thierry Mourier, Pierre-Emile Philip
المصدر: 2018 IEEE International Interconnect Technology Conference (IITC).
مصطلحات موضوعية: Front and back ends, Back end of line, Materials science, Process (engineering), Interposer, Silicon on insulator, Wafer, Image warping, Engineering physics, Aspect ratio (image)
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المؤلفون: Mathilde Gottardi, Pierre Bleuet, Thierry Mourier, D. Laloum, F. Lorut, C. Ribiere
المصدر: International Symposium on Microelectronics. 2014:000641-000646
مصطلحات موضوعية: Materials science, Fabrication, Silicon, chemistry, Scanning electron microscope, Automotive Engineering, Miniaturization, Process (computing), chemistry.chemical_element, Nanotechnology, Tomography, Focused ion beam, Characterization (materials science)
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المؤلفون: H. Feldis, Stephane Minoret, N. Sillon, R. Eleouet, Daniel Scevola, Perceval Coudrain, T. Enot, R. Segaud, Mathilde Gottardi, I. Charbonnier, A. Charpentier, C. Ribiere, D. Marseilhan, M. Assous, V. Loup, Gilles Romero, Thierry Mourier, Nacima Allouti, J. P. Bally, M. Pellat, A. Roman, L. Gabette, C. Laviron, Thomas Magis, E. Dupuy, B. Martin, C. Ratin
المصدر: 2013 IEEE International Interconnect Technology Conference - IITC.
مصطلحات موضوعية: Engineering, Reliability (semiconductor), business.industry, Process (engineering), Process integration, Interposer, Systems engineering, State (computer science), business, Realization (systems), Manufacturing engineering, Toolbox, Line (electrical engineering)