يعرض 1 - 13 نتائج من 13 نتيجة بحث عن '"Manrique, Milton"', وقت الاستعلام: 0.42s تنقيح النتائج
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    Academic Journal

    المؤلفون: Serna Manrique, Milton David

    المساهمون: Restrepo Parra, Elisabeth, Escobar Rincón, Daniel, Laboratorio de Fisica del Plasma

    وصف الملف: application/pdf

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Petrov, “Phase composition and microstructure of polycrystalline and epitaxial TaNx layers grown on oxidized Si(001) and MgO(001) by reactive magnetron sputter deposition,” Thin Solid Films, vol. 402, no. 1–2, pp. 172–182, 2002, doi:10.1016/S0040-6090(01)01618-2.; C. Stampfl and A. J. Freeman, “Stable and metastable structures of the multiphase tantalum nitride system,” Phys. Rev. B - Condens. Matter Mater. Phys., vol. 71, no. 2, pp. 4–8, 2005, doi:10.1103/PhysRevB.71.024111; M. Nikravesh, G. H. Akbari, and A. Poladi, “A comprehensive study on the surface tribology of Ta thin film using molecular dynamics simulation: The effect of TaN interlayer, power and temperature,” Tribol. Int., vol. 105, no. August 2016, pp. 185–192, 2017, doi:10.1016/j.triboint.2016.10.010.; E. Liu, G. Jin, X. Cui, Q. Xiao, and T. Shao, “Effect of gas pressure on the mechanical properties of sputtered tan films,” Phys. Procedia, vol. 50, no. October 2012, pp. 438–441, 2013, doi:10.1016/j.phpro.2013.11.068.; Y. X. Leng et al., “Biomedical properties of tantalum nitride films synthesized by reactive magnetron sputtering,” Thin Solid Films, vol. 398, no. 399, pp. 471–475, 2001, doi:10.1016/S0040-6090(01)01448-1.; J. A. Thornton, “Influence of Apparatus Geometry and Deposition Conditions on the Structure and Topography of Thick Sputtered Coatings.,” J Vac Sci Technol, vol. 11, no. 4, pp. 666–670, 1974, doi:10.1116/1.1312732.; J. A. Thornton, “High rate thick film growth,” Annu. Rev. Mater. Sci., vol. 7, p. 239, 1977, doi: 1977.7:239-260.; D. Esteban, “Propiedades estructurales , eléctricas y mecánicas de películas delgadas obtenidas por métodos de evaporación asistidos por plasma,” 1997.; H. I. Aaronson, “Atomic mechanisms of diffusional nucleation and growth and comparisons with their counterparts in shear transformations,” Metall. Trans. A, vol. 24, no. 2, pp. 241–276, 1993, doi:10.1007/bf02657313.; N. A. S. I. Series and N. 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Safi, “High rate reactive sputtering using gas pulsing: A technique for the creation of films onto large, flat substrates,” Thin Solid Films, vol. 351, no. 1–2, pp. 32–36, 1999, doi:10.1016/S0040-6090(99)00081-4.; S. Kadlec, J. Musil, and H. Vyskocil, “Hysteresis effect in reactive sputtering: A problem of system stability,” J. Phys. D. Appl. Phys., vol. 19, no. 9, 1986, doi:10.1088/0022-3727/19/9/004.; S. Kadlec, J. Musil, and J. Vyskočil, “Influence of the pumping speed on the hysteresis effect in the reactive sputtering of thin films,” Vacuum, vol. 37, no. 10, pp. 729–738, 1987, doi:10.1016/0042-207X(87)90262-4.; V. Kirchhoff, T. Kopte, T. Winkler, M. Schulze, and P. Wiedemuth, “Dual magnetron sputtering (DMS) system with sine-wave power supply for large-area coating,” Surf. Coatings Technol., vol. 98, no. 1–3, pp. 828–833, 1998, doi:10.1016/S0257-8972(97)00371-X.; J. Musil, S. Kadlec, J. Vyskočil, and V. 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Escobar, “MICROESTRUCTURA, ESFUERZOS RESIDUALES Y DUREZA EN PELÍCULAS DELGADAS DE NITRURO DE TITANIO-CIRCONIO,” Tesis Maest., 2012.; J. D. R. Salazar, “SÍNTESIS Y ESTUDIO OPTICO, ESTRUCTURAL Y TERMICO DE PVA DOPADAS CON TiO2,” 2014.; B. E. Warren, “B. E. Warren - X-ray diffraction-Dover (1990).pdf.” NEW YORK, 1990.; P. B. Hirsch, “Elements of X-Ray Diffraction,” Phys. Bull., vol. 8, no. 7, pp. 237–238, 1957, doi:10.1088/0031-9112/8/7/008.; P. Scardi, M. Leoni, and R. Delhez, “Line broadening analysis using integral breadth methods: A critical review,” J. Appl. Crystallogr., vol. 37, no. 3, pp. 381–390, 2004, doi:10.1107/S0021889804004583.; L. H. Schwartz J. B. cohen, Diffraction from materials, vol. 53, no. 9. 2013; G. Ribárik, “Modeling of diffraction patterns based on microstructural properties,” PhD Thesis, 2008.; L. E. A. Harold P. Klug, X- Ray diffraction procedures_ for polyerystalline and amorphous materials-Wiley (1974).pdf. 1974.; G. K. Williamson and W. H. 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Nie et al., “Structural and electrical properties of tantalum nitride thin films fabricated by using reactive radio-frequency magnetron sputtering,” Appl. Phys. A Mater. Sci. Process., vol. 73, no. 2, pp. 229–236, Aug. 2001, doi:10.1007/s003390000691.; I. P. B. and A. N. P. V. F. Petrunin, N. I. Sorokin, “STABILITY OF CUBIC TANTALUM NITRIDES DURING HEAT TREATMENT,” vol. 3, no. 3, pp. 1–22, 1980.; S. Baik and Y. Kim, “Microstructural evolution of tantalum nitride thin films synthesized by inductively coupled plasma sputtering,” Appl. Microsc., vol. 50, no. 1, p. 7, Dec. 2020, doi:10.1186/s42649-020-00026-7.; G. Bejarano Gaitán, J. Roque Caicedo, P. Prieto Pulido, G. Zambrano, and E. Baca Miranda, “Influence of ionic bombardment on cubic boron nitride (c-BN) thin film deposition by r. f. magnetron sputtering,” Rev. Fac. Ing. Univ. Antioquia, no. 37, pp. 188–199, 2006.; J. J. Olaya, D. M. Marulanda, and S. Rodil, “Preferential orientation in metal nitride deposited by the UBM system,” Ing. e Investig., vol. 30, no. 1, pp. 125–129, 2010.; K. L. Chopra, M. R. Randlett, and R. H. Duff, “Face-centred cubic modification in sputtered films of tantalum, molybdenum, tungsten, rhenium, hafnium and zirconium,” Philos. Mag., vol. 16, no. 140, pp. 261–273, 1967, doi:10.1080/14786436708229739.; Takuya Yoshihara and Katsumi Suzuki, “Variation of internal stresses in sputtered Ta films,” J. Vac. Sci. Technol. B Microelectron. Nanom. Struct., vol. 11, no. 2, p. 301, 1993, doi:10.1116/1.586674.; L. A. Clevenger, A. Mutscheller, J. M. E. Harper, C. Cabral, and K. Barmak, “The relationship between deposition conditions, the beta to alpha phase transformation, and stress relaxation in tantalum thin films,” J. Appl. Phys., vol. 72, no. 10, pp. 4918–4924, 1992, doi:10.1063/1.352059.; G. K. Williamson and W. H. Hall, “X-ray line broadening from filed aluminium and wolfram,” Acta Metall., vol. 1, no. 1, pp. 22–31, 1953, doi:10.1016/0001-6160(53)90006-6.; K. Y. Chan and B. S. Teo, “Investigation into the influence of direct current (DC) power in the magnetron sputtering process on the copper crystallite size,” Microelectronics J., vol. 38, no. 1, pp. 60–62, 2007, doi:10.1016/j.mejo.2006.09.011.; S. D. Ekpe and S. K. Dew, “Stability of Cubic FAPbI3 from X-ray Diffraction, Anelastic, and Dielectric Measurements,” pp. 229–254, 2008, doi:10.1007/978-3-540-76664-3_7.; M. T. Le, Y. U. Sohn, J. W. Lim, and G. S. Choi, “Effect of sputtering power on the nucleation and growth of Cu films deposited by magnetron sputtering,” Mater. Trans., vol. 51, no. 1, pp. 116–120, 2010, doi:10.2320/matertrans.M2009183.; D. A. Cogswell and M. Z. Bazant, “Coherency strain and the kinetics of phase separation in LiFePO 4 nanoparticles,” ACS Nano, vol. 6, no. 3, pp. 2215–2225, 2012, doi:10.1021/nn204177u.; H. N. Shah, R. Jayaganthan, and D. Kaur, “Effect of sputtering pressure and temperature on DC magnetron sputtered CrN films,” Surf. Eng., vol. 26, no. 8, pp. 629–637, 2010, doi:10.1179/174329409X389326. [18] M. K. S. Bin Rafiq et al., “WS2: A New Window Layer Material for Solar Cell Application,” Sci. Rep., vol. 10, no. 1, pp. 1–11, 2020, doi:10.1038/s41598-020-57596-5.; J. Jaiswal, S. Chauhan, and R. Chandra, “Influence of Sputtering Parameters on Structural, Optical and Thermal Properties of Copper Nanoparticles Synthesized By Dc Magnetron Sputtering,” Int. J. Sci. Technol. Manag., no. 0401, pp. 2394–1529, 2015.; D. HESSE, N. ZAKHAROV, A. PIGNOLET, A. JAMES, and S. SENZ, “TEM cross-section investigations of epitaxial Ba,” Cryst. Res. Technol., vol. 35, pp. 641–651, 2000.; T. Elangovan et al., “Synthesis and high temperature XRD studies of tantalum nitride thin films prepared by reactive pulsed dc magnetron sputtering,” J. 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Lyon, “Shreir’s Corrosion Volume 3: Comprehensive Corrosion,” Shreir’s Corros., 2009.; J. P. N. Espinosa, “Evaluación de la resistencia a la corrosión a través de técnicas electroquímicas en películas delgadas de TiZrN,” 2019.; C. Liu, Q. Bi, A. Leyland, and A. Matthews, “An electrochemical impedance spectroscopy study of the corrosion behavior of PVD coated steels in 0.5 N NaCl aqueous solution: Part II. EIS interpretation of corrossion behaviour,” Corros. Sci., vol. 45, no. 6, pp. 1257–1273, 2003, doi:10.1016/S0010-938X(02)00214-7.; Y. M. Lu, R. J. Weng, W. S. Hwang, and Y. S. Yang, “Study of phase transition and electrical resistivity of tantalum nitride films prepared by DC magnetron sputtering with OES detection system,” Thin Solid Films, vol. 398, no. 399, pp. 356–360, 2001, doi:10.1016/S0040-6090(01)01342-6.; Milton David Serna Manrique. Estudio de los mecanismos de crecimiento en función de las fases presentes y la evaluación de la microestructura en películas de TaxNy obtenidas por deposición física en fase de vapor asistida por plasma. Universidad Nacional de Colombia sede Manizales. 2020; https://repositorio.unal.edu.co/handle/unal/78543

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    المصدر: Universidad Católica de Santa María - UCSM ; Repositorio de la Universidad Católica de Santa María

    مصطلحات موضوعية: Vernáculo, Paisaje, Patrimonio

    وصف الملف: application/pdf

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