المؤلفون: Groppi, C, Maspero, F, Rovelli, A, Asa, M, Malavena, G, Monzio Compagnoni, C, Albisetti, E, Vangelista, S, Badillo-Avila, MA, Bertacco, R

المساهمون: Groppi, C, Maspero, F, Rovelli, A, Asa, M, Malavena, G, Monzio Compagnoni, C, Albisetti, E, Vangelista, S, Badillo-Avila, Ma, Bertacco, R

مصطلحات موضوعية: KNN micro -Capacitors, Oxygen vacancies, Top electrode effect, Asymmetric leakage, Schottky diode KNN, n -type doping KNN

وصف الملف: STAMPA

Relation: info:eu-repo/semantics/altIdentifier/wos/WOS:000965801400001; volume:160; firstpage:1; lastpage:8; numberofpages:8; journal:MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING; https://hdl.handle.net/11311/1250119; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85150418959

الاتاحة: https://hdl.handle.net/11311/1250119
https://doi.org/10.1016/j.mssp.2023.107422

المؤلفون: Giulianini M., Malavena G., Monzio Compagnoni C, Sottocornola Spinelli A.

المساهمون: Giulianini, M., Malavena, G., Monzio Compagnoni, C, Sottocornola Spinelli, A.

مصطلحات موضوعية: 3-D NAND Flash memories, down-coupling phenomenon (DCP), gate-induced drain leakage (GIDL) current, macaroni MOSFET, self-boosting effect

وصف الملف: STAMPA

Relation: info:eu-repo/semantics/altIdentifier/wos/WOS:000882694500001; volume:69; issue:12; firstpage:6757; lastpage:6762; numberofpages:6; journal:IEEE TRANSACTIONS ON ELECTRON DEVICES; https://hdl.handle.net/11311/1229606; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85141603807; https://ieeexplore.ieee.org/document/9940226

الاتاحة: https://hdl.handle.net/11311/1229606
https://doi.org/10.1109/TED.2022.3217718
https://ieeexplore.ieee.org/document/9940226

المؤلفون: Sottocornola Spinelli A., Malavena G., Lacaita A. L., Monzio Compagnoni C.

المساهمون: Sottocornola Spinelli, A., Malavena, G., Lacaita, A. L., Monzio Compagnoni, C.

مصطلحات موضوعية: 3D NAND Flash memories, Flash memory reliability, Random telegraph noise

وصف الملف: ELETTRONICO

Relation: info:eu-repo/semantics/altIdentifier/pmid/34208725; info:eu-repo/semantics/altIdentifier/wos/WOS:000666072000001; volume:12; issue:6; firstpage:703; lastpage:716; numberofpages:14; journal:MICROMACHINES; http://hdl.handle.net/11311/1187104; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85108892995; https://www.mdpi.com/2072-666X/12/6/703

الاتاحة: http://hdl.handle.net/11311/1187104
https://doi.org/10.3390/mi12060703
https://www.mdpi.com/2072-666X/12/6/703

المؤلفون: Dossena, M.¹ (AUTHOR), Malavena, G.¹ (AUTHOR), Spinelli, A. S.¹ (AUTHOR), Monzio Compagnoni, C.¹ (AUTHOR) christian.monzio@polimi.it

المصدر: Journal of Applied Physics. 8/21/2022, Vol. 132 Issue 7, p1-10. 10p.

مصطلحات موضوعية: *PERMITTIVITY, *CURRENT-voltage characteristics, *ELECTRIC fields

المؤلفون: Mazzola, J. L., Greatti, M., Compagnoni, C. Monzio, Spinelli, A.S., Marano, V., Lauria, M., Paci, D., Speroni, F., Malavena, G.

المصدر: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC)

الاتاحة: http://dx.doi.org/10.1109/essderc59256.2023.10268573
http://xplorestaging.ieee.org/ielx7/10268496/10268469/10268573.pdf?arnumber=10268573

المؤلفون: Malavena, G., Mazzola, J. L., Greatti, M., Compagnoni, C. Monzio, Lacaita, A. L., Marano, V., Lauria, M., Paci, D., Speroni, F., Spinelli, A. S.

المصدر: 2022 IEEE Latin American Electron Devices Conference (LAEDC)

الاتاحة: http://dx.doi.org/10.1109/laedc54796.2022.9908226
http://xplorestaging.ieee.org/ielx7/9908144/9907765/09908226.pdf?arnumber=9908226

المؤلفون: Malavena, G., Petro, S., Spinelli, A. S., Monzio Compagnoni, C.

المصدر: ESSDERC 2019 - 49th European Solid-State Device Research Conference (ESSDERC)

الاتاحة: http://dx.doi.org/10.1109/essderc.2019.8901751
http://xplorestaging.ieee.org/ielx7/8894830/8901681/08901751.pdf?arnumber=8901751

المؤلفون: Malavena, G., Spinelli, A. S., Compagnoni, C. Monzio

المصدر: 2018 IEEE International Electron Devices Meeting (IEDM)

الاتاحة: http://dx.doi.org/10.1109/iedm.2018.8614561
http://xplorestaging.ieee.org/ielx7/8601505/8614478/08614561.pdf?arnumber=8614561

المؤلفون: A. Mehonic, D. Ielmini, K. Roy, O. Mutlu, S. Kvatinsky, T. Serrano-Gotarredona, B. Linares-Barranco, S. Spiga, S. Savel’ev, A. G. Balanov, N. Chawla, G. Desoli, G. Malavena, C. Monzio Compagnoni, Z. Wang, J. J. Yang, S. G. Sarwat, A. Sebastian, T. Mikolajick, S. Slesazeck, B. Noheda, B. Dieny, T. -H. Hou, A. Varri, F. Brückerhoff-Plückelmann, W. Pernice, X. Zhang, S. Pazos, M. Lanza, S. Wiefels, R. Dittmann, W. H. Ng, M. Buckwell, H. R. J. Cox, D. J. Mannion, A. J. Kenyon, Y. Lu, Y. Yang, D. Querlioz, L. Hutin, E. Vianello, S. S. Chowdhury, P. Mannocci, Y. Cai, Z. Sun, G. Pedretti, J. P. Strachan, D. Strukov, M. Le Gallo, S. Ambrogio, I. Valov, R. Waser

المساهمون: Mehonic, A., Ielmini, D., Roy, K., Mutlu, O., Kvatinsky, S., Serrano-Gotarredona, T., Linares-Barranco, B., Spiga, S., Savel’Ev, S., Balanov, A. G., Chawla, N., Desoli, G., Malavena, G., Monzio Compagnoni, C., Wang, Z., Yang, J. J., Sarwat, S. G., Sebastian, A., Mikolajick, T., Slesazeck, S., Noheda, B., Dieny, B., Hou, T. -H., Varri, A., Brückerhoff-Plückelmann, F., Pernice, W., Zhang, X., Pazos, S., Lanza, M., Wiefels, S., Dittmann, R., Ng, W. H., Buckwell, M., Cox, H. R. J., Mannion, D. J., Kenyon, A. J., Lu, Y., Yang, Y., Querlioz, D., Hutin, L., Vianello, E., Chowdhury, S. S., Mannocci, P., Cai, Y., Sun, Z., Pedretti, G., Strachan, J. P., Strukov, D., Le Gallo, M., Ambrogio, S., Valov, I., Waser, R.

مصطلحات موضوعية: sezele

Relation: volume:12; firstpage:109201-1; lastpage:109201-59; numberofpages:59; journal:APL MATERIALS; https://hdl.handle.net/11311/1275918

الاتاحة: https://hdl.handle.net/11311/1275918
https://doi.org/10.1063/5.0179424

المؤلفون: M. Greatti, J. L. Mazzola, C. Monzio Compagnoni, A. Sottocornola Spinelli, D. Paci, F. Speroni, V. Marano, M. Lauria, G. Malavena

المساهمون: Greatti, M., Mazzola, J. L., Monzio Compagnoni, C., Sottocornola Spinelli, A., Paci, D., Speroni, F., Marano, V., Lauria, M., Malavena, G.

مصطلحات موضوعية: sezele

Relation: info:eu-repo/semantics/altIdentifier/isbn/979-8-3503-6976-2; ispartofbook:Proc. IRPS; IEEE - International Reliability Physics Symposium (IRPS); firstpage:9C.2-1; lastpage:9C.2-7; numberofpages:7; https://hdl.handle.net/11311/1265893

الاتاحة: https://hdl.handle.net/11311/1265893
https://doi.org/10.1109/IRPS48228.2024.10529441

المؤلفون: G. Malavena, A. Sottocornola Spinelli, C. Monzio Compagnoni

المساهمون: Malavena, G., Sottocornola Spinelli, A., Monzio Compagnoni, C.

مصطلحات موضوعية: sezele

Relation: info:eu-repo/semantics/altIdentifier/wos/WOS:000728378800001; volume:10; firstpage:1; lastpage:13; numberofpages:13; journal:ELECTRONICS; http://hdl.handle.net/11311/1196304

الاتاحة: http://hdl.handle.net/11311/1196304
https://doi.org/10.3390/electronics10222784

المؤلفون: S. M. Amoroso, G. Malavena, A. R. Brown, P. Asenov, X. -W. Lin, V. Moroz, M. Giulianini, D. G. Refaldi, C. Monzio Compagnoni, A. Sottocornola Spinelli

المساهمون: Amoroso, S. M., Malavena, G., Brown, A. R., Asenov, P., Lin, X. -W., Moroz, V., Giulianini, M., Refaldi, D. G., Monzio Compagnoni, C., Sottocornola Spinelli, A.

مصطلحات موضوعية: sezele

Relation: info:eu-repo/semantics/altIdentifier/isbn/978-4-86348-803-8; info:eu-repo/semantics/altIdentifier/wos/WOS:001117703800025; ispartofbook:2023 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2023; International Conference on Simulation of Semiconductor Processes and Devices (SISPAD); firstpage:97; lastpage:100; numberofpages:4; https://hdl.handle.net/11311/1257165; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85179133541

الاتاحة: https://hdl.handle.net/11311/1257165
https://doi.org/10.23919/SISPAD57422.2023.10319604

المؤلفون: J. L. Mazzola, M. Greatti, C. Monzio Compagnoni, A. Sottocornola Spinelli, V. Marano, M. Lauria, D. Paci, F. Speroni, G. Malavena

المساهمون: Mazzola, J. L., Greatti, M., Monzio Compagnoni, C., Sottocornola Spinelli, A., Marano, V., Lauria, M., Paci, D., Speroni, F., Malavena, G.

مصطلحات موضوعية: sezeele

Relation: info:eu-repo/semantics/altIdentifier/wos/WOS:001090588900040; ispartofbook:53rd IEEE European Solid-State Device Research Conference, ESSDERC 2023; European Solid-State Device Research Conference (ESSDERC); firstpage:160; lastpage:163; numberofpages:4; https://hdl.handle.net/11311/1252239; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85175480510

الاتاحة: https://hdl.handle.net/11311/1252239
https://doi.org/10.1109/ESSDERC59256.2023.10268573

المؤلفون: V. Milo, G. Malavena, C. Monzio Compagnoni, D. Ielmini

المساهمون: M. Rudan, R. Brunetti, S. Reggiani, Milo, V., Malavena, G., Monzio Compagnoni, C., Ielmini, D.

مصطلحات موضوعية: sezele

Relation: info:eu-repo/semantics/altIdentifier/isbn/978-3-030-79826-0; ispartofbook:Springer Handbook of Semiconductor Devices; firstpage:1167; lastpage:1199; numberofpages:33; serie:SPRINGER HANDBOOKS; alleditors:M. Rudan, R. Brunetti, S. Reggiani; https://hdl.handle.net/11311/1252817; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85142029949

الاتاحة: https://hdl.handle.net/11311/1252817
https://doi.org/10.1007/978-3-030-79827-7_32

المؤلفون: G. Malavena, J. L. Mazzola, M. Greatti, C. Monzio Compagnoni, A. L. Lacaita, V. Marano, M. Lauria, D. Paci, F. Speroni, A. Sottocornola Spinelli

المساهمون: Malavena, G., Mazzola, J. L., Greatti, M., Monzio Compagnoni, C., Lacaita, A. L., Marano, V., Lauria, M., Paci, D., Speroni, F., Sottocornola Spinelli, A.

مصطلحات موضوعية: Time-Dependent Dielectric Breakdown (TDDB), dielectric reliability, TDDB variability, percolation

Relation: info:eu-repo/semantics/altIdentifier/isbn/978-1-6654-9767-1; info:eu-repo/semantics/altIdentifier/wos/WOS:000925270200061; ispartofbook:Proceedings of the IEEE Latin America Electron Devices Conference (LAEDC); 4th IEEE Latin America Electron Devices Conference, LAEDC 2022; firstpage:1; lastpage:4; numberofpages:4; https://hdl.handle.net/11311/1223561; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85141425399

الاتاحة: https://hdl.handle.net/11311/1223561
https://doi.org/10.1109/LAEDC54796.2022.9908226

المؤلفون: G. Malavena, M. Giulianini, L. Chiavarone, A. Sottocornola Spinelli, C. Monzio Compagnoni

المساهمون: Malavena, G., Giulianini, M., Chiavarone, L., Sottocornola Spinelli, A., Monzio Compagnoni, C.

مصطلحات موضوعية: sezele

Relation: info:eu-repo/semantics/altIdentifier/wos/WOS:000792918100017; volume:43; issue:4; firstpage:557; lastpage:560; numberofpages:4; journal:IEEE ELECTRON DEVICE LETTERS; http://hdl.handle.net/11311/1207425

الاتاحة: http://hdl.handle.net/11311/1207425
https://doi.org/10.1109/LED.2022.3154432

المؤلفون: G. Malavena, PETRÒ, SIMONE, A. Sottocornola Spinelli, C. Monzio Compagnoni

المساهمون: Malavena, G., Petrò, Simone, Sottocornola Spinelli, A., Monzio Compagnoni, C.

مصطلحات موضوعية: sezele

Relation: info:eu-repo/semantics/altIdentifier/isbn/978-1-7281-1539-9; info:eu-repo/semantics/altIdentifier/wos/WOS:000520409500031; ispartofbook:Proc. ESSDERC; IEEE - European Solid-State Device Research Conference (IEEE - ESSDERC); firstpage:122; lastpage:125; numberofpages:4; http://hdl.handle.net/11311/1113594; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85075752248

الاتاحة: http://hdl.handle.net/11311/1113594

المؤلفون: G. Malavena, A. Mannara, A. L. Lacaita, A. Sottocornola Spinelli, C. Monzio Compagnoni

المساهمون: Malavena, G., Mannara, A., Lacaita, A. L., Sottocornola Spinelli, A., Monzio Compagnoni, C.

مصطلحات موضوعية: sezele

Relation: info:eu-repo/semantics/altIdentifier/wos/WOS:000467915400020; volume:18; issue:2; firstpage:561; lastpage:568; numberofpages:8; journal:JOURNAL OF COMPUTATIONAL ELECTRONICS; http://hdl.handle.net/11311/1086980; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85064339965

الاتاحة: http://hdl.handle.net/11311/1086980
https://doi.org/10.1007/s10825-019-01328-0

المؤلفون: G. Malavena, M. Filippi, A. Sottocornola Spinelli, C. Monzio Compagnoni

المساهمون: Malavena, G., Filippi, M., Sottocornola Spinelli, A., Monzio Compagnoni, C.

مصطلحات موضوعية: sezele

Relation: info:eu-repo/semantics/altIdentifier/wos/WOS:000494419900031; volume:66; firstpage:4727; lastpage:4732; numberofpages:6; journal:IEEE TRANSACTIONS ON ELECTRON DEVICES; http://hdl.handle.net/11311/1113940; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85074452738

الاتاحة: http://hdl.handle.net/11311/1113940
https://doi.org/10.1109/TED.2019.2940602

المؤلفون: G. Malavena, M. Filippi, A. Sottocornola Spinelli, C. Monzio Compagnoni

المساهمون: Malavena, G., Filippi, M., Sottocornola Spinelli, A., Monzio Compagnoni, C.

مصطلحات موضوعية: sezele

Relation: info:eu-repo/semantics/altIdentifier/wos/WOS:000494419900032; volume:66; firstpage:4733; lastpage:4738; numberofpages:6; journal:IEEE TRANSACTIONS ON ELECTRON DEVICES; http://hdl.handle.net/11311/1113941; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85074452201

الاتاحة: http://hdl.handle.net/11311/1113941
https://doi.org/10.1109/TED.2019.2940599