المؤلفون: M. Krishnan, M.F. Lofaro

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::111582688ee508be5537c07d382b60c6
https://doi.org/10.1016/b978-0-12-821791-7.00016-2

المؤلفون: H. Aida, E.A. Baisie, D. Boning, L. Borucki, Lee Cook, W. Fan, H. Schumacher-Härtwig, M. Krishnan, U. Künzelmann, Uma Ramesh Krishna Lagudu, Kangchun Lee, Z.C. Li, M.F. Lofaro, Y. Moon, J. Nalaskowski, P. Ong, Ungyu Paik, Jin-Goo Park, K. Pate, N.K. Penta, A. Philipossian, Nagendra Prasad Yerriboina, S.S. Papa Rao, Dipankar Roy, P. Safier, Y. Sampurno, Jihoon Seo, Z. Song, D.E. Speed, L. Teugels, S. Theng, Wei-Tsu Tseng, M. Tsujimura, L. Wang, Q. Zhang, X.H. Zhang, G. Zwicker

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::161388f8245624726dc0a25d71cd0c91
https://doi.org/10.1016/b978-0-12-821791-7.00092-7

المؤلفون: M. Krishnan, M.F. Lofaro

مصطلحات موضوعية: Back end of line, Materials science, Fabrication, Chemical-mechanical planarization, Process (computing), Process control, Node (circuits), Nanotechnology, Interconnect scaling, Metrology

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::417db5037672cddb8c7ae262c9db151f
https://doi.org/10.1016/b978-0-08-100165-3.00002-4

المؤلفون: H. Aida, E.A. Baisie, D. Boning, L. Borucki, W. Fan, M. Krishnan, U. Künzelmann, U.R.K. Lagudu, Z.C. Li, M.F. Lofaro, Y. Moon, J. Nalaskowski, P. Ong, U. Paik, S.S. Papa Rao, K. Pate, N.K. Penta, D. Roy, P. Safier, H. Schumacher, J. Seo, Z. Song, D.E. Speed, L. Teugels, W.-T. Tseng, M. Tsujimura, L. Wang, X.H. Zhang, Q. Zhang, G. Zwicker

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bbc182a73395d013bf5bf75f304420fa
https://doi.org/10.1016/b978-0-08-100165-3.01002-0