المؤلفون: R. van Zelm, E. Coeckelberghs, W. Sermeus, A. Wolthuis, L. Bruyneel, M. Panella, K. Vanhaecht

المصدر: BMC Health Services Research, Vol 21, Iss 1, Pp 1-15 (2021)

مصطلحات موضوعية: Process evaluation, Care pathway, Enhanced recovery, Mixed methods case study, Implementation, Extended normalization process theory (eNPT), Public aspects of medicine, RA1-1270

وصف الملف: electronic resource

Relation: https://doaj.org/toc/1472-6963

URL الوصول: https://doaj.org/article/c67e584359da42e392ace85c5c1c9ff1

المؤلفون: A. Ceschini, M. Panella

المساهمون: Ceschini, A., Panella, M.

مصطلحات موضوعية: Quantum Dropout, Quantum Ensemble, Hybrid Quantum-Classical Diffusion Network, Variational Approach to Quantum GRU

Relation: ispartofbook:Meeting Centro Nazionale di Ricerca in HPC, Big Data and Quantum Computing (ICSC); QUANTUM COMPUTING ANNUAL MEETING ICSC - SPOKE 10, Research and Innovation; firstpage:1; lastpage:1; numberofpages:1; https://hdl.handle.net/11573/1717751

الاتاحة: https://hdl.handle.net/11573/1717751

المؤلفون: S. Piperno, L. Lavagna, F. De Falco, A. Ceschini, A. Rosato, D. Windridge, M. Panella

المساهمون: Piperno, S., Lavagna, L., De Falco, F., Ceschini, A., Rosato, A., Windridge, D., Panella, M.

Relation: ispartofbook:Proceedings of Quantum Techniques in Machine Learning (QTML 2024); Quantum Techniques in Machine Learning (QTML 2024); firstpage:1; lastpage:3; numberofpages:3; https://hdl.handle.net/11573/1717681

الاتاحة: https://hdl.handle.net/11573/1717681

المؤلفون: F. De Falco, S. Piperno, L. Lavagna, A. Ceschini, A. Rosato, M. Panella

المساهمون: De Falco, F., Piperno, S., Lavagna, L., Ceschini, A., Rosato, A., Panella, M.

Relation: ispartofbook:Proceedings of Quantum Techniques in Machine Learning (QTML 2024); Quantum Techniques in Machine Learning (QTML 2024); firstpage:1; lastpage:3; numberofpages:3; https://hdl.handle.net/11573/1717680

الاتاحة: https://hdl.handle.net/11573/1717680

المؤلفون: F. De Falco, A. Ceschini, A. Rosato, M. Panella

المساهمون: De Falco, F., Ceschini, A., Rosato, A., Panella, M.

Relation: ispartofbook:Memorie ET2024; XXXVIII Riunione Annuale dei Ricercatori di Elettrotecnica; firstpage:1; lastpage:2; numberofpages:2; https://hdl.handle.net/11573/1710441

الاتاحة: https://hdl.handle.net/11573/1710441

المؤلفون: A. Rosato, M. Panella

المساهمون: Rosato, A., Panella, M.

Relation: ispartofbook:Memorie ET2024; XXXVIII Riunione Annuale dei Ricercatori di Elettrotecnica; firstpage:1; lastpage:2; numberofpages:2; https://hdl.handle.net/11573/1710444

الاتاحة: https://hdl.handle.net/11573/1710444

المؤلفون: V. Mottola, A. Ceschini, M. Panella, A. Tamburrino

المساهمون: Mottola, V., Ceschini, A., Panella, M., Tamburrino, A.

Relation: ispartofbook:Memorie ET2024; XXXVIII Riunione Annuale dei Ricercatori di Elettrotecnica; firstpage:1; lastpage:2; numberofpages:2; https://hdl.handle.net/11573/1710443

الاتاحة: https://hdl.handle.net/11573/1710443

المؤلفون: A. Verdone, S. Scardapane, M. Panella

المساهمون: Verdone, A., Scardapane, S., Panella, M.

Relation: ispartofbook:Memorie ET2024; XXXVIII Riunione Annuale dei Ricercatori di Elettrotecnica; firstpage:1; lastpage:2; numberofpages:2; https://hdl.handle.net/11573/1710446

الاتاحة: https://hdl.handle.net/11573/1710446

المؤلفون: A. Ceschini, L. Lavagna, F. De Falco, A. Rosato, M. Panella

المساهمون: Ceschini, A., Lavagna, L., De Falco, F., Rosato, A., Panella, M.

Relation: ispartofbook:Memorie ET2024; XXXVIII Riunione Annuale dei Ricercatori di Elettrotecnica; firstpage:1; lastpage:2; numberofpages:2; https://hdl.handle.net/11573/1710440

الاتاحة: https://hdl.handle.net/11573/1710440

المؤلفون: F. Succetti, A. Rosato, M. Panella

المساهمون: Succetti, F., Rosato, A., Panella, M.

Relation: ispartofbook:Memorie ET2024; XXXVIII Riunione Annuale dei Ricercatori di Elettrotecnica; firstpage:1; lastpage:2; numberofpages:2; https://hdl.handle.net/11573/1710445

الاتاحة: https://hdl.handle.net/11573/1710445

المؤلفون: F. Di Luzio, F. Colonnese, A. Rosato, M. Panella

المساهمون: Di Luzio, F., Colonnese, F., Rosato, A., Panella, M.

Relation: ispartofbook:Memorie ET2024; XXXVIII Riunione Annuale dei Ricercatori di Elettrotecnica; firstpage:1; lastpage:2; numberofpages:2; https://hdl.handle.net/11573/1710442

الاتاحة: https://hdl.handle.net/11573/1710442

المؤلفون: L. Lavagna, F. De Falco, S. Piperno, A. Ceschini, A. Rosato, M. Panella

المساهمون: Lavagna, L., De Falco, F., Piperno, S., Ceschini, A., Rosato, A., Panella, M.

Relation: ispartofbook:Proceedings of Quantum Techniques in Machine Learning (QTML 2024); Quantum Techniques in Machine Learning (QTML 2024); firstpage:1; lastpage:3; numberofpages:3; https://hdl.handle.net/11573/1717679

الاتاحة: https://hdl.handle.net/11573/1717679

المؤلفون: M. Marchetti, V. De Stefano, M. Di Nisio, A. Falanga, G. Lessiani, M. Marietta, M. Panella, A. B. Payedimarri, A. Piro, F. Rodegheiro, R. Santi, S. Siragusa, P. Tondi, A. Tosetto, A. Vasile, M. Napolitano

المساهمون: Marchetti, M., De Stefano, V., Di Nisio, M., Falanga, A., Lessiani, G., Marietta, M., Panella, M., Payedimarri, A. B., Piro, A., Rodegheiro, F., Santi, R., Siragusa, S., Tondi, P., Tosetto, A., Vasile, A., Napolitano, M.

وصف الملف: ELETTRONICO

Relation: info:eu-repo/semantics/altIdentifier/wos/WOS:000719458000365; 48th Congress of the Italian Society of Hematology; volume:106; issue:10 s3; firstpage:1; lastpage:248; numberofpages:248; journal:HAEMATOLOGICA; http://hdl.handle.net/11579/136593

الاتاحة: http://hdl.handle.net/11579/136593
https://doi.org/10.3324/haematol.2021.s3

المؤلفون: F. Scala, A. Ceschini, D. Gerace, M. Panella

المساهمون: Scala, F., Ceschini, A., Gerace, D., Panella, M.

Relation: ispartofbook:Proceedings of Quantum Techniques in Machine Learning (QTML 2023); Quantum Techniques in Machine Learning (QTML 2023); firstpage:1; lastpage:4; numberofpages:4; https://hdl.handle.net/11573/1710427

الاتاحة: https://hdl.handle.net/11573/1710427

المؤلفون: S. Mair, A. Sebastianelli, A. Ceschini, S. Vidal, M. Panella, B. Le Saux

المساهمون: Mair, S., Sebastianelli, A., Ceschini, A., Vidal, S., Panella, M., Le Saux, B.

Relation: ispartofbook:Proceedings of Quantum Techniques in Machine Learning (QTML 2023); Quantum Techniques in Machine Learning (QTML 2023); firstpage:1; lastpage:4; numberofpages:4; https://hdl.handle.net/11573/1710430

الاتاحة: https://hdl.handle.net/11573/1710430

المؤلفون: F. De Falco, A. Ceschini, A. Sebastianelli, M. Panella, B. Le Saux

المساهمون: De Falco, F., Ceschini, A., Sebastianelli, A., Panella, M., Le Saux, B.

Relation: ispartofbook:Proceedings of Quantum Techniques in Machine Learning (QTML 2023); Quantum Techniques in Machine Learning (QTML 2023); firstpage:1; lastpage:4; numberofpages:4; https://hdl.handle.net/11573/1710429

الاتاحة: https://hdl.handle.net/11573/1710429

المؤلفون: M. Incudini, M. Grossi, A. Ceschini, A. Mandarino, M. Panella, S. Vallecorsa, D. Windridge, A. Di Pierro

المساهمون: Incudini, M., Grossi, M., Ceschini, A., Mandarino, A., Panella, M., Vallecorsa, S., Windridge, D., Di Pierro, A.

Relation: ispartofbook:Proceedings of Quantum Techniques in Machine Learning (QTML 2022); Quantum Techniques in Machine Learning (QTML 2022); lastpage:1; numberofpages:6; https://hdl.handle.net/11573/1664099

الاتاحة: https://hdl.handle.net/11573/1664099

المؤلفون: B. Alam, A. Ceschini, A. Rosato, M. Panella, R. Asquini

المساهمون: Alam, B., Ceschini, A., Rosato, A., Panella, M., Asquini, R.

Relation: ispartofbook:Atti della 53.ma Riunione Annuale dell’Associazione Società Italiana di Elettronica (SIE); 53.ma Riunione Annuale dell’Associazione Società Italiana di Elettronica (SIE); firstpage:1; lastpage:2; numberofpages:2; https://hdl.handle.net/11573/1664101

الاتاحة: https://hdl.handle.net/11573/1664101

المؤلفون: F. Di Luzio, A. Rosato, M. Panella

المساهمون: Di Luzio, F., Rosato, A., Panella, M.

Relation: ispartofbook:Memorie ET2022; XXXVI Riunione Annuale dei Ricercatori di Elettrotecnica; firstpage:1; lastpage:2; numberofpages:2; https://hdl.handle.net/11573/1710436

الاتاحة: https://hdl.handle.net/11573/1710436

المؤلفون: A. Ceschini, A. Rosato, M. Panella

المساهمون: Ceschini, A., Rosato, A., Panella, M.

Relation: ispartofbook:Memorie ET2022; XXXV Riunione Annuale dei Ricercatori di Elettrotecnica; firstpage:1; lastpage:2; numberofpages:2; https://hdl.handle.net/11573/1710435

الاتاحة: https://hdl.handle.net/11573/1710435